BASEBAND CIRCUIT Cellphone ICs 371

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGA7204,115	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32	1	.85 mm	5 mm			30	260	5 mm
BGA7204	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD	S-PQCC-N32	1	.85 mm	5 mm		e4			5 mm
OC1120-0810VQFN8	Infineon Technologies	BASEBAND CIRCUIT		NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		10 mA	1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			1.27 mm	85 Cel	-25 Cel		DUAL	R-PQCC-N8		.9 mm	5 mm					6 mm
OC1120-0810WLB25	Infineon Technologies	BASEBAND CIRCUIT		BALL	25		SQUARE		YES	1		10 mA	1.8 V						85 Cel	-25 Cel		BOTTOM	R-XBGA-B25		.43 mm	2.554 mm					2.926 mm
SP000942752	Infineon Technologies	BASEBAND CIRCUIT
MAX1958ETP	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
MAX1958ETP-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX1959ETP-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX1959ETP	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
MAX2312EEI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2310EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2055EUP-D	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
MAX2308EGI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0415 mA	2.75 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX2047ETJ-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX2316EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2306EGI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0415 mA	2.75 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0	20	240	5 mm
MAX2306EGI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0415 mA	2.75 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0	20	240	5 mm
MAX2046ETJ-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX2045ETJ-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX2607EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2308ETI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0415 mA	2.75 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX2309EGI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0415 mA	2.75 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX2308EGI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0415 mA	2.75 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX2316EEI+T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28		1.73 mm	3.9 mm	Not Qualified	e3			9.89 mm
MAX2312EEI+	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2314EEI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2316EEI+	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2314EEI+	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2314EEI+T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2609EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2605EUT	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
MAX2308ETI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0415 mA	2.75 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.8 mm	5 mm	Not Qualified	e0			5 mm
MAX2045ETJ+	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2047ETJ+	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2309EGI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0415 mA	2.75 V	3/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N28	1	.9 mm	5 mm	Not Qualified	e0			5 mm
MAX2605EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2316EEI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2045ETJ	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm		e0			5 mm
MAX2314EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2055EUP-TD	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
MAX2608EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX2046ETJ	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm		e0			5 mm
MAX2312EEI+T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2047ETJ	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm		e0			5 mm
MAX2029ETP-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified				5 mm
MAX2310EEI+	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2021ETX-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.315 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36		.8 mm	6 mm	Not Qualified	e0			6 mm
MAX2310EEI-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.