BASEBAND CIRCUIT Cellphone ICs 371

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX2047ETJ+T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3			5 mm
MAX2045ETJ+T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3			5 mm
MAX2312EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2021ETX	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.315 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N36	1	.8 mm	6 mm	Not Qualified	e0		245	6 mm
MAX2055EUP-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
MAX2029ETP	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
UPC8194K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
UPC8195K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
UPC8194K-E1-A	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN BISMUTH	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e6			4 mm
ISL5216KI-1Z	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
ISL5216KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		700 mA	2.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	12 mm		e0			12 mm
ISL5217KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e1			15 mm
HSP50216KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.5 mm	12 mm	Not Qualified	e1			12 mm
ISL5216KI-1	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		700 mA	2.5 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
ISL5416KIZ	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm		e1			17 mm
UPC8195K-E1	Renesas Electronics	BASEBAND CIRCUIT	OTHER	NO LEAD	20	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0126 mA	3 V	3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-25 Cel	TIN LEAD	QUAD	R-PQCC-N20		.9 mm	3 mm	Not Qualified	e0			4 mm
ISL5416KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm	17 mm		e0	20	220	17 mm
ISL5217KI	Renesas Electronics	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196	3	1.5 mm	15 mm		e0			15 mm
LUCW3030ACA-DB	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
ACFM-7102-TR1	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				100 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X6	3			Not Qualified
ACFM-7101-BLKG	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				100 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X6	3			Not Qualified			260
ACFM-7102-BLK	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				100 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X6	3			Not Qualified
ACFM-7101-TR1G	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	UNSPECIFIED	6		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY				100 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X6	3			Not Qualified			260
ALM-1522-TR1G	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1			5 V		MICROELECTRONIC ASSEMBLY							QUAD	R-XQMA-N22	2			Not Qualified			260
ACFM-9025-BLK	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY			2.15 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N5		1.1 mm	4 mm					7 mm
ACFM-9025-TR1	Broadcom	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	5		RECTANGULAR	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY			2.15 mm	85 Cel	-40 Cel		DUAL	R-XDMA-N5		1.1 mm	4 mm					7 mm
ALM-1522-BLKG	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1			5 V		MICROELECTRONIC ASSEMBLY							QUAD	R-XQMA-N22	2			Not Qualified			260
LUCW3030ACA	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
ALM-1522-TR2G	Broadcom	BASEBAND CIRCUIT		NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1			5 V		MICROELECTRONIC ASSEMBLY							QUAD	R-XQMA-N22	2			Not Qualified			260
S1M8656A01-F0T0	Samsung	BASEBAND CIRCUIT	OTHER	BUTT	48	VBCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B48		.8 mm	7 mm	Not Qualified				7 mm
S1M8657X01-F0T0	Samsung	BASEBAND CIRCUIT	OTHER	BUTT	48	VBCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B48		.8 mm	7 mm	Not Qualified				7 mm
S1M8653BQ	Samsung	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.05 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80		1.8 mm	12 mm	Not Qualified				12 mm
S1M8656A01-E0T0	Samsung	BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8657X01-E0T0	Samsung	BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8662AX01-F0T0	Samsung	BASEBAND CIRCUIT	OTHER	BUTT	32	VBCC	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		BOTTOM	S-XBCC-B32		.8 mm	5 mm	Not Qualified				5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.