BASEBAND CIRCUIT Cellphone ICs 371

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
08906-003-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	QFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-003-XTD	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	QFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-004-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-002-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	68	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	CHIP CARRIER	LCC68(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N68				Not Qualified	e0
DSL01-010SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5	1			Not Qualified	e4	30	260
DSL01-024SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5	1			Not Qualified	e4	30	260
935292558515	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
935292558115	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm
BLM6G10-30G,118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm			TIN	DUAL	R-PDSO-G16	3	3.6 mm	11 mm		e3	30	245	15.9 mm
PCF5083H/F2-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
934060893135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
934060893127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
934060304118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
PCF5083H/5V2/F3	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
PCF5083H/F2	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
OM5300	NXP Semiconductors	BASEBAND CIRCUIT		J INVERTED	66		RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY							DUAL	R-XDMA-U66				Not Qualified
UMF1000T-T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UMA1002T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0018 mA	3 V	3/5	SMALL OUTLINE	SOP28,.4	Cordless Telephone ICs	1.27 mm	70 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	e4			17.9 mm
934060304135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
UMA1002TD-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UMA1002H	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0018 mA	3 V	3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Cordless Telephone ICs	.8 mm	70 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
BLM6G10-30G,135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm			Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
UMA1002T-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
PCF5083H/6V2/F4-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
UMA1000LT	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
PCF5083H/001/F2-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
UMA1002H-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE			.8 mm	70 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
934060303135	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-F16			11 mm					15.9 mm
BLM6G10-30,127	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE						Tin (Sn)	DUAL	R-PDSO-F16			11 mm		e3			15.9 mm
UMA1000TD-T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
BLM6G10-30	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	HSOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE, HEAT SINK/SLUG			1.37 mm			TIN	DUAL	R-PDSO-F16			11 mm	Not Qualified	e3			15.9 mm
UMA1000LT-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UMF1000T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
934060303118	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-F16			11 mm					15.9 mm
BLM6G10-30,135	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE						Tin (Sn)	DUAL	R-PDSO-F16			11 mm		e3			15.9 mm
934060303127	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-F16			11 mm					15.9 mm
PCF5081PN	NXP Semiconductors	BASEBAND CIRCUIT								1	CMOS																Not Qualified
BLM6G10-30G,127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm			Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
UMA1000TD	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
BLM6G10-30G	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE, HEAT SINK/SLUG			1.37 mm			TIN	DUAL	R-PDSO-G16	3	3.6 mm	11 mm	Not Qualified	e3			15.9 mm
BLM6G10-30,118	NXP Semiconductors	BASEBAND CIRCUIT		FLAT	16	SOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE						TIN	DUAL	R-PDSO-F16	3		11 mm		e3	30	245	15.9 mm
PCF5082PN	NXP Semiconductors	BASEBAND CIRCUIT								1	CMOS																Not Qualified
PCF5083H/6V2/F4	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
934060893118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
PCF5083H/5V2/F3-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
PCF5083H/001/F2	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
934060304127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
BGA7204,515	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.85 mm	5 mm					5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.