GULL WING Cellphone ICs 418

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
MAX4003EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified			e0			3 mm
MAX4003EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified			e3	30	260	3 mm
CC1000PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified			e4	30	260	9.7 mm
SA638	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified			e4			7.8 mm
AD607ARSZ	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		MATTE TIN	DUAL	R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified			e3		260	7.2 mm
AD607ARS	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		TIN LEAD	DUAL	R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified			e0		240	7.2 mm
MAX2620EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified			e0			3 mm
MAX2620EUA+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified			e3	30	260	3 mm
MAX2606EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm		1.625 mm	Not Qualified			e0			2.9 mm
MAX2606EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm		1.625 mm	Not Qualified			e3	30	260	2.9 mm
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		TIN LEAD	DUAL	R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified			e0		240	7.2 mm
AD607ARSZ-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		MATTE TIN	DUAL	R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified			e3		260	7.2 mm
MAX2620EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified			e0	20	240	3 mm
MAX2620EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified			e3	30	260	3 mm
CC1000PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified			e4	30	260	9.7 mm
AD8348ARU	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified			e0		240	9.7 mm
AD8348ARU-REEL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified			e0		240	9.7 mm
SI4136-F-BT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G24		1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
SI4136-F-GT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	3	1.2 mm		4.4 mm	Not Qualified			e3		260	7.8 mm
SI4136-F-GTR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	3	1.2 mm		4.4 mm	Not Qualified			e3		260	7.8 mm
MAX4003EUA/GH9-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL	S-PDSO-G8	1	1.1 mm		3 mm							3 mm
CC1000PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified			e4	30	260	9.7 mm
MAX4003EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified			e0			3 mm
MAX4003EUA+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified			e3	30	260	3 mm
MC13142D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G16		1.75 mm		3.9 mm							9.9 mm
IAM-91563-BLKG	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm		1.25 mm	Not Qualified			e3		260	2.025 mm
AD8348ARUZ-REEL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified			e3	30	260	9.7 mm
HMC422MS8ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm		3 mm				e3		260	3 mm
TCM320AC57PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
TCM8002IFR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK			.8 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G44		2.25 mm		10 mm							10 mm
TCM4300PZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G100		1.6 mm		14 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	14 mm
TCM320AC57CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	70 Cel	0 Cel	1 dB		DUAL	R-PDSO-G20		2.65 mm	13-BIT	7.5 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	12.8 mm	YES
ADS58C20IPFP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	3	1.2 mm		12 mm			3.45 V	e4	30	260	12 mm
TLV320AC57CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0075 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	70 Cel	0 Cel	1 dB		QUAD	S-PQFP-G48		1.6 mm	13-BIT	7 mm	Not Qualified	A-LAW			NOT SPECIFIED	NOT SPECIFIED	7 mm	YES
TRF6903PTRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TRF1015DBLE	Texas Instruments	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.75 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2 mm		5.3 mm	Not Qualified						7.2 mm
TCM8002FR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3/5	FLATPACK	QFP44,.5SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G44		2.25 mm		10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
TRF6901PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.04 mA	2.7 V	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm		7 mm	Not Qualified			e4	30	260	7 mm
TCM4400APN	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified						12 mm
TLV321AC37CPT	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
TLV321AC36CDW	Texas Instruments	BASEBAND CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified						12.8 mm
TCM4400PNR	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified						12 mm
ADS58C23IPFP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	3	1.2 mm		12 mm			3.45 V	e4	30	260	12 mm
TCM4400PN	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V	3/5,3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	12 mm
TLV320AC57DWR	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified						12.8 mm
TLV321AC36IPT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm
TCM4400EPNR	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		FLATPACK			.5 mm	85 Cel	-25 Cel			QUAD	S-PQFP-G80		1.6 mm		12 mm	Not Qualified						12 mm
TCM320AC56PT	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified						7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.