GULL WING Cellphone ICs 418

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
UPC8112TB-E3	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
HD155101F	Renesas Electronics	RF FRONT END CIRCUIT		GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES						FLATPACK			.5 mm				QUAD	S-PQFP-G48		1.7 mm	7 mm	Not Qualified				7 mm
UPC8112TB	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
HD155111F	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G48		1.7 mm	7 mm	Not Qualified				7 mm
UPG2128TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2121TB-E3	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	GAAS	.0045 mA	2.8 V	2.8	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08	Other Telecom ICs	.65 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2 mm
HD155121F	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G48		1.7 mm	7 mm	Not Qualified				7 mm
HD155131TF	Renesas Electronics	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	56	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK				75 Cel	-20 Cel		QUAD	R-PQFP-G56				Not Qualified
HFA3600IB	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
UPG2130TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
HD155101BF	Renesas Electronics	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-20 Cel		QUAD	S-PQFP-G48		1.7 mm	7 mm	Not Qualified				7 mm
UPG174TA-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	90 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G6		1.53 mm	1.5 mm		e0			2.9 mm
UPC8112TB-E3-A	Renesas Electronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e6			2 mm
UPG2106TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2110TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-40 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
UPG2126TB-E3	Renesas Electronics	RF FRONT END CIRCUIT	OTHER	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	90 Cel	-30 Cel		DUAL	R-PDSO-G6		1.1 mm	1.25 mm					2 mm
IAM-91563-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm
IAM-91563-TR1G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e3		260	2.025 mm
IAM-91563-BLK	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm
IAM-91563-TR2G	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1.1 mm	1.25 mm	Not Qualified	e3		260	2.025 mm
IAM-91563-TR2	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1.1 mm	1.25 mm	Not Qualified	e0			2.025 mm
LUCW3030ACA-DB	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
LUCW3020CCS-DB	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.2 mm	10 mm	Not Qualified	e0	30	240	10 mm
W3013BCL-TR	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified	e0	30	240	6.5 mm
LUCW3020CCS	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN LEAD	QUAD	S-PQFP-G64		1.2 mm	10 mm	Not Qualified	e0	30	240	10 mm
W3013BCL	Broadcom	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-35 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified	e0			6.5 mm
HPMX-7202-TR1	Broadcom	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.55 mm	5 mm	Not Qualified	e0			5 mm
LUCW3030ACA	Broadcom	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	100 Cel	-35 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0	30	240	7 mm
S1T8536X01-T0R0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-10 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8653BQ	Samsung	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.05 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80		1.8 mm	12 mm	Not Qualified				12 mm
S1M8656A01-E0T0	Samsung	BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8657X01-E0T0	Samsung	BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
S1M8673X01-V0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	80 Cel	-30 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified				6.5 mm
S1M8674X01-V0T0	Samsung	RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	80 Cel	-30 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified				6.5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.