GULL WING Cellphone ICs 418

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADF7901BRUZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified	e3		260	7.8 mm
ADF7901BRUZ-REEL7	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	50 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e3			7.8 mm
ADF7901BRUZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	7.8 mm
ADF7901BRU-REEL7	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified	e0		240	7.8 mm
MAX2055EUP+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	6.5 mm
MAX2606EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e3	30	260	2.9 mm
08906-808-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64	3			Not Qualified	e3		260
08906-808-XTD	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64				Not Qualified	e3		260
08906-004-XTD	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-003-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	QFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-003-XTD	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	QFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
08906-004-XTP	Onsemi	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		.07 mA	3.3 V	3.3	FLATPACK	TQFP64(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64				Not Qualified	e0
DSL01-010SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5	1			Not Qualified	e4	30	260
DSL01-024SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE						NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5	1			Not Qualified	e4	30	260
MD7IC2250GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	14		RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		FLANGE MOUNT						TIN	DUAL	R-PDFM-G14	3			Not Qualified	e3	40	260
MC13150FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G24		1.6 mm	4 mm	Not Qualified	e0			4 mm
MC13143D	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
MC13146FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G24	1	1.6 mm	4 mm					4 mm
MC13150FTB	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	3 mA	3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified	e0			7 mm
MC13145FTA	NXP Semiconductors	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-20 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm					7 mm
935164740512	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
BLM6G10-30G,118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm			TIN	DUAL	R-PDSO-G16	3	3.6 mm	11 mm		e3	30	245	15.9 mm
PCF5083H/F2-T	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm				QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
SA601DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
935143730112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
SA900BE-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
934060893135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
934060893127	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm				DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
934060304118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
PCF5083H/5V2/F3	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
PCF5083H/F2	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.64SQ,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.6 mm	14 mm	Not Qualified				14 mm
SA3603DH	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		2.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e4			5 mm
UMF1000T-T	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UMA1002T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0018 mA	3 V	3/5	SMALL OUTLINE	SOP28,.4	Cordless Telephone ICs	1.27 mm	70 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	e4			17.9 mm
934060304135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE							DUAL	R-PDSO-G16		3.6 mm	11 mm					15.9 mm
SA1920	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified	e3			7 mm
935164740118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
A2I25H060GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS		28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL	R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm
PCF5073H	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	7 mm	Not Qualified				7 mm
SA620DK-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4	30	260	6.5 mm
UMA1002TD-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
UMA1002H	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.0018 mA	3 V	3/5	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	Cordless Telephone ICs	.8 mm	70 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	7 mm	Not Qualified				7 mm
SA1920-T	NXP Semiconductors	RF FRONT END CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
PCF5073H-T	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	7 mm	Not Qualified				7 mm
SA620DK	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
BLM6G10-30G,135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm			Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
UMA1002T-T	NXP Semiconductors	BASEBAND CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		SMALL OUTLINE			1.27 mm	70 Cel	-30 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
MRFIC1814	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.