GULL WING Cellphone ICs 418

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC1050PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
TRF3040PT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7 mm
CC1050PWG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
CC1050-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm			e4	30	260	7.8 mm
HMC422MS8	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified		e0		235	3 mm
HMC485MS8GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8		1	1.1 mm	3 mm			e3		260	3 mm
HMC421QS16ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.64 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm			e3		260	4.9 mm
HMC485MS8GTR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm	3 mm			e0		235	3 mm
AD7005AS	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		5 V		FLATPACK			.8 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G44			2.45 mm	10 mm	Not Qualified					10 mm
AD8348ARUZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G28		1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
HMC420QS16TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.64 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16			1.75 mm	3.9 mm						4.9 mm
HMC422MS8TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm	3 mm			e0		235	3 mm
HMC421QS16E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified		e3		260	4.9 mm
AD7001AS	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		5 V		FLATPACK			.8 mm	85 Cel		-25 Cel		QUAD	S-PQFP-G44			2.45 mm	10 mm	Not Qualified					10 mm
AD7002AS	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	1	CMOS	.03 mA	5 V	5	FLATPACK	QFP44,.57SQ,32	Codecs	.8 mm	85 Cel	10	-40 Cel	TIN LEAD	QUAD	S-PQFP-G44	VOLTAGE		2.45 mm	10 mm	Not Qualified	SINGLE-ENDED	e0			10 mm
HMC377QS16G	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
HMC485MS8G	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified		e0		235	3 mm
HMC380QS16G	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
HMC420QS16ETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.64 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm					260	4.9 mm
AD6432AST	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	3/3.3	FLATPACK, LOW PROFILE	QFP44,.47SQ,32	Other Telecom ICs	.8 mm	85 Cel		-25 Cel		QUAD	S-PQFP-G44			1.6 mm	10 mm	Not Qualified					10 mm
HMC421QS16	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified		e0		235	4.9 mm
HMC380QS16GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified		e3			4.9 mm
HMC421QS16TR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.64 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G16			1.75 mm	3.9 mm						4.9 mm
AD8348XXX	Analog Devices	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-34 Cel	TIN LEAD	DUAL	R-PDSO-G28			1.1 mm	4.4 mm	Not Qualified		e0			9.7 mm
HMC420QS16	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
HMC485MS8GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
HMC422MS8E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
HMC377QS16GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified		e3			4.9 mm
HMC420QS16E	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified		e3		260	4.9 mm
ADF7901BRU-REEL	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel		0 Cel	TIN LEAD	DUAL	R-PDSO-G24		1	1.2 mm	4.4 mm	Not Qualified		e0		240	7.8 mm
ADF7901BRUZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	50 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified		e3			7.8 mm
ADF7901BRU	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel		0 Cel	TIN LEAD	DUAL	R-PDSO-G24		1	1.2 mm	4.4 mm	Not Qualified		e0		240	7.8 mm
ADF7901BRUZ	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G24		1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	7.8 mm
ADF7901BRUZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G24		1	1.2 mm	4.4 mm	Not Qualified		e3		260	7.8 mm
ADF7901BRUZ-REEL7	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	50 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified		e3			7.8 mm
ADF7901BRUZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G24		1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	7.8 mm
ADF7901BRU-REEL7	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel		0 Cel	TIN LEAD	DUAL	R-PDSO-G24		1	1.2 mm	4.4 mm	Not Qualified		e0		240	7.8 mm
MAX2055EUP+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20		1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX2606EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm			e3	30	260	2.9 mm
MAX2055EUP+TD	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20		1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX2609EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
MAX2607EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
MAX2055EUP+D	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G20		1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	6.5 mm
MAX2608EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm			e3	30	260	2.9 mm
MAX2609EUT+	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm			e3	30	260	2.9 mm
MAX2605EUT+T	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified		e3	30	260	2.9 mm
MAX2690EUB+T	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G10		1	1.092 mm	2.9465 mm	Not Qualified		e3	30	260	3 mm
MAX2685EEE+	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16		1	1.73 mm	3.9 mm	Not Qualified		e3	30	260	4.89 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.