SUPPORT CIRCUIT Network Interfaces 206

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CMWX1ZZABZ-078	Murata Manufacturing	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	METAL	YES	1			1	3.6 mA	3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-MXMA-N
PM8800A	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified		e4	40	260	5 mm
PM8800ATR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified		e4	40	260	5 mm
TJF1051T/3,118	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
SJA1105PELY	NXP Semiconductors	SUPPORT CIRCUIT		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B159	3	1.5 mm	12 mm					260	12 mm
CMWX1ZZABZ-091	Murata Manufacturing	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	METAL	YES	1			1	3.6 mA	3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-MXMA-N
TJF1051T/1J	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
SN65HVD102RGBT	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				2 mA	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4 mm
AT86RF212B-ZU	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		e3			5 mm
88E6321-A0-NAZ2I000	Marvell Technology	SUPPORT CIRCUIT								1															1000 Mbps
AT86RF212B-ZUR	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified		e3			5 mm
TJF1051T/3,112	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
WIZ810MJ	Wiznet	SUPPORT CIRCUIT		THROUGH-HOLE	56	QMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-40 Cel		QUAD		R-XQMA-T56			25 mm						48 mm
TJF1051T/3/1J	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
KSZ8841-16MVLI	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G128	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
CMWX1ZZABZ-TEMP	Murata Manufacturing	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	METAL	YES	1			1	3.6 mA	3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-MXMA-N
STULPI01BTBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified		e2		260	3.6 mm
FTT-10A	Dialog Semiconductor	SUPPORT CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	PLASTIC/EPOXY	NO	1					5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	TIN OVER NICKEL	UNSPECIFIED		R-PXMA-X						e3
TJF1051T/3/CM,118	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	70 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified			30	260	4.9 mm
88E6393XA0-BXB2C000	Marvell Technology	SUPPORT CIRCUIT								1			1												1000 Mbps
SN65HVD101RGBT	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 mA	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4 mm
MC34903CP3EK	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.008 mA	3.3 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified		e3	40	260	11 mm
MC34904C3EK	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.008 mA	3.3 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified		e3	40	260	11 mm
DS33W11+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33W41+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X11+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.5 mm	10 mm	Not Qualified		e1	30	260	10 mm
DS33X161+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1			17 mm
DS33X41+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X42+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
DS33X81+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified		e1	30	260	17 mm
KSZ8841-16MQL	Microchip Technology	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified		e3	30	260	20 mm
IP175DLFI	Ic Plus	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1		1.9 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel		QUAD		R-PQFP-G128		3.42 mm	14 mm						20 mm
LTC4257IDD#PBF	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
TJF1051T/3/1U	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
MC34904C5EK	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.008 mA	5 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified		e3	40	260	11 mm
SN65HVD102RGBR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				2 mA	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4 mm
TLK10031CTR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1	700 mA	1 V		GRID ARRAY	BGA144,12X12,40		1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10312.5 Mbps	S-PBGA-B144	4	3.25 mm	13 mm	Not Qualified		e1	30	260	13 mm
BCM82391AKFSBG	Broadcom	SUPPORT CIRCUIT		BALL	324		SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2		1 V									BOTTOM	100000 Mbps	S-PBGA-B324					IT ALSO REQUIRES 1.8V, 2.5V AND 3.3V NOMINAL SUPPLY VOLTAGE
LTC4257CS8#PBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified		e3	30	260	4.9025 mm
LTC4257CDD#PBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4257CDD#TRPBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4257IS8#PBF	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE	SOP8,.24		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified		e3	30	260	4.9025 mm
SN65HVD101RGBR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 mA	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4 mm
DS33Z11+UNUSED	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.5 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	14 mm
ATA6663-TAQY	Microchip Technology	SUPPORT CIRCUIT		GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					13.5 V		SMALL OUTLINE, LOW PROFILE			1.27 mm				DUAL		R-PDSO-G8		1.4 mm	3.8 mm	Not Qualified					4.9 mm
DS33Z11	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified					14 mm
DS33Z11+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified		e1	30	260	14 mm
KSZ8692PBI	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.33 mm	27 mm	Not Qualified		e1			27 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.