SUPPORT CIRCUIT Network Interfaces 206

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LTC4257IS8#TRPBF	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified	e3	30	260	4.9025 mm
LTC4257CDD#TR	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
LTC4257CS8#TRPBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified	e3	30	260	4.9025 mm
LTC4257IS8	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified	e0			4.9025 mm
LTC4257CDD	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX2828ETN+T	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
MAX2828ETN+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm	Not Qualified	e3	30	260	8 mm
DS33X81+W	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256	3	1.82 mm	17 mm					17 mm
DS33Z44DK	Analog Devices	SUPPORT CIRCUIT
DS33W11DK+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.82 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
DS33Z11-W	Analog Devices	SUPPORT CIRCUIT
DS33Z41DK	Analog Devices	SUPPORT CIRCUIT
DS33X162+W	Analog Devices	SUPPORT CIRCUIT
DS33X11+W	Analog Devices	SUPPORT CIRCUIT
DS33X82+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3	1.77 mm	17 mm	Not Qualified	e1	30	260	17 mm
DS33W11+W	Analog Devices	SUPPORT CIRCUIT
NB4N7132DTG	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.125 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
NB4N1158DTG	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.075 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e3		260	9.7 mm
NB4N7132DTR2G	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.125 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
NB4N1158DTR2G	Onsemi	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.075 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e3		260	9.7 mm
STULPI01ATBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified	e1	30	260	3.6 mm
PN5331B3HN/C270,51	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm	Not Qualified	e4		260	6 mm
PN5331B3HN/C270	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm	Not Qualified				6 mm
MC34903CP5EK	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	5 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
MC34903CP3EK/R2	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	3.3 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
MC34904C3EK/R2	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	3.3 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
935295735118	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			30	260	4.9 mm
MC34905CS3EK/R2	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	3.3 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
MC34903CS5EK/R2	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	5 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
935303555118	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
935290454112	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
MC34903CS5EK	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	5 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
935287868551	NXP Semiconductors	SUPPORT CIRCUIT
MC34903CP5EK/R2	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	5 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
MC34903CS3EK/R2	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	3.3 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
MC34905CS5EK	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	5 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
MC34905CS5EK/R2	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	5 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
935303553118	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
MC34903CS3EK	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	3.3 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
935290454118	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
MC34904C5EK/R2	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	5 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
935303555112	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
935287868518	NXP Semiconductors	SUPPORT CIRCUIT
MC34905CS3EK	NXP Semiconductors	SUPPORT CIRCUIT	AUTOMOTIVE	GULL WING	32	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	1	.008 mA	3.3 V	5.5/28	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP32,.4	Network Interfaces	.65 mm	125 Cel	-40 Cel	TIN	DUAL	1 Mbps	R-PDSO-G32	3	2.45 mm	7.5 mm	Not Qualified	e3	40	260	11 mm
TJF1051T	NXP Semiconductors	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
PLB2224	Infineon Technologies	SUPPORT CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8,3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B272		2.35 mm	27 mm	Not Qualified	e0			27 mm
TLE9254LC	Infineon Technologies	SUPPORT CIRCUIT																				TIN				2A				e3
TLE9254SK	Infineon Technologies	SUPPORT CIRCUIT																				NICKEL GOLD PALLADIUM				2A

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.