SUPPORT CIRCUIT Network Interfaces 206

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

TLE9254SKXUMA1

Infineon Technologies

SUPPORT CIRCUIT

Nickel/Gold/Palladium (Ni/Au/Pd)

2A

NOT SPECIFIED

NOT SPECIFIED

TLE9254LCXUMA1

Infineon Technologies

SUPPORT CIRCUIT

Tin (Sn)

2A

e3

NOT SPECIFIED

NOT SPECIFIED

MAX2821AETM-T

Maxim Integrated

SUPPORT CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MAX2821ETM+

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2828ETN-D

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

MAX2820ETM+

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX3952EGK-D

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N68

3

.9 mm

10 mm

Not Qualified

e0

10 mm

MAX2828ETN+D

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e3

30

260

8 mm

MAX2820ETM+T

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2828ETN

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

8 mm

DS33X162+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.77 mm

17 mm

Not Qualified

e1

30

260

17 mm

MAX2821ETM-TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e0

7 mm

MAX3952EGK

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N68

3

.9 mm

10 mm

Not Qualified

e0

10 mm

DS33Z11+C01

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.5 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

DS33Z41

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

3

1.5 mm

14 mm

Not Qualified

14 mm

MAX2820AETM

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2829ETN+TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e3

30

260

8 mm

MAX2821AETM+TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e3

7 mm

MAX2821AETM+T

Maxim Integrated

SUPPORT CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

DS33ZH11+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

100

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

10 mm

Not Qualified

e1

30

260

10 mm

MAX2820ETM-TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e0

7 mm

MAX2820AETM+T

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2821AETM+

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2820AETM-T

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

DS33Z44+

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.8 mm

17 mm

Not Qualified

e1

30

260

17 mm

MAX2821ETM

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2828ETN-T

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

MAX2828ETN+TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e3

30

260

8 mm

MAX2820AETM+TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e3

7 mm

MAX2820ETM-T

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2821AETM-TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e0

7 mm

MAX2820AETM-TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e0

7 mm

MAX3952EGK-TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N68

.9 mm

10 mm

Not Qualified

10 mm

MAX2820AETM+

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2821ETM+TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e3

7 mm

MAX2821AETM

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2820ETM+TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

.11 mA

2.7 V

3/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e3

7 mm

MAX2820ETM

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2821ETM-T

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2828ETN-TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

DS33ZH11

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

100

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

10 mm

Not Qualified

e1

225

10 mm

MAX2829ETN-TD

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

MAX3952EGK-T

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N68

.9 mm

10 mm

Not Qualified

e0

10 mm

MAX2829ETN-D

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

DS33Z44

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

1.77 mm

17 mm

Not Qualified

e1

245

17 mm

MAX2821ETM+T

Maxim Integrated

SUPPORT CIRCUIT

MATTE TIN

1

e3

30

260

MAX2829ETN+D

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.8 mm

8 mm

e3

30

260

8 mm

UPD60610GA-GAM-AX

Renesas Electronics

SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G48

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.