SUPPORT CIRCUIT Network Interfaces 206

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
88E6321-A0-NAZ2C000	Marvell Technology	SUPPORT CIRCUIT								1
BCM53134SKFBG	Broadcom	SUPPORT CIRCUIT		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1 V		GRID ARRAY							BOTTOM		S-PBGA-B256	3						260
KSZ8841-PMQLI	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	R-PQFP-G128	3	3.4 mm	14 mm		e3		260	20 mm
KSZ8841-PMQLI-TR	Microchip Technology	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	R-PQFP-G128		3.4 mm	14 mm		e3			20 mm
MAX2829ETN-T	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2829ETN+T	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm		e3	30	260	8 mm
PN5331B3HN/C270:55	NXP Semiconductors	SUPPORT CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	2	1 mm	6 mm	Not Qualified	e4		260	6 mm
MAX2829ETN	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				2.7 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2829ETN+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm	Not Qualified	e3	30	260	8 mm
BCM82793AKFSBG	Broadcom	SUPPORT CIRCUIT					SQUARE				CMOS														25000 Mbps
BCM88370CB0KFSBG	Broadcom	SUPPORT CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1														UNSPECIFIED	800000 Mbps	X-XXSS-X	4						245
EZX557AT2SLKVX	Intel	SUPPORT CIRCUIT	COMMERCIAL	BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1							GRID ARRAY				55 Cel	0 Cel		BOTTOM	10000 Mbps	S-PBGA-B						NOT SPECIFIED	NOT SPECIFIED
BCM88680CA1KFSBG	Broadcom	SUPPORT CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1														UNSPECIFIED	900000 Mbps	X-XXSS-X
BCM56450B1IFSBG	Broadcom	SUPPORT CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1	CMOS													UNSPECIFIED	102500 Mbps	X-XXSS-X	4						245
KSZ8692PB	Microchip Technology	SUPPORT CIRCUIT	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1					1.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.33 mm	27 mm	Not Qualified	e1			27 mm
KSZ8841-32MVL	Microchip Technology	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3			14 mm
KSZ8841-32MVLI	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G128		1.6 mm	14 mm	Not Qualified	e3			14 mm
VSC7444YIH-02	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1				7500 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	110 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B672		2.71 mm	27 mm		e1	NOT SPECIFIED	NOT SPECIFIED	27 mm
TPS2371PWG4	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				48 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.2 mm	3 mm	Not Qualified	e4	30	260	4.4 mm
TPS2371DRG4	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				48 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
TLK3114SCGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	1.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified		20	220	19 mm
TNETX3150GGP	Texas Instruments	SUPPORT CIRCUIT		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.5 mA	3.3 V	3.3,5	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	Network Interfaces	1.27 mm				BOTTOM		S-PBGA-B352		1.7 mm	35 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	35 mm
TNETX4080GGP	Texas Instruments	SUPPORT CIRCUIT		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	Network Interfaces	1.27 mm				BOTTOM		S-PBGA-B352		1.7 mm	35 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	35 mm
TLK3118GDV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	400	HBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V	1.2,1.5,2.5	GRID ARRAY, HEAT SINK/SLUG	BGA400,20X20,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B400	4	3.65 mm	21 mm	Not Qualified	e0	20	220	21 mm
UC5661N	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-9 V		.02 mA		-9	IN-LINE	DIP8,.3	Network Interfaces	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T8		5.33 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.78 mm
TLK3114SAGPV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified				19 mm
TLK3114SBGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK3114SCGPV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.65 mA	2.5 V	2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e0	20	220	19 mm
UC5661J	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1		-9 V		.02 mA		-9	IN-LINE	DIP8,.3	Network Interfaces	2.54 mm	70 Cel	0 Cel		DUAL		R-GDIP-T8		5.08 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TNETX3150AGGP	Texas Instruments	SUPPORT CIRCUIT		BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.55 mA	3.3 V	3.3,5	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	Network Interfaces	1.27 mm				BOTTOM		S-PBGA-B352		1.7 mm	35 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	35 mm
TNETX4020PPB	Texas Instruments	SUPPORT CIRCUIT		GULL WING	208	HFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	2.5,3.3	FLATPACK, HEAT SINK/SLUG, FINE PITCH	HQFP208,1.2SQ,20	Network Interfaces	.5 mm				QUAD		S-PQFP-G208		4.1 mm	28 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	28 mm
TPS2371PWR	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				48 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.2 mm	3 mm	Not Qualified	e4	30	260	4.4 mm
TPS2371DR	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				48 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
TPS2371DG4	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				48 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
TPS2371PW	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				48 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.2 mm	3 mm	Not Qualified	e4	30	260	4.4 mm
SN75LBC088FN	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		8	.45 mA	5 V	5	CHIP CARRIER	LDCC84,1.2SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel		QUAD	5 Mbps	S-PQCC-J84		4.57 mm	29.3116 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	29.3116 mm
TPS2371PWRG4	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				48 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.2 mm	3 mm	Not Qualified	e4	30	260	4.4 mm
TLK3114SAGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK3114SCZPV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.65 mA	2.5 V	2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	2 mm	19 mm	Not Qualified	e1	30	260	19 mm
TPS2371D	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				48 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
TLK3114SBGPV	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.65 mA	2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified				19 mm
TLK10034AAJ	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		4	1249 mA	1 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B324	4	3.29 mm	19 mm		e1	30	260	19 mm
LTC4257IS8#TR	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified	e0			4.9025 mm
LTC4257IDD#TRPBF	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
LTC4257CS8#TR	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified	e0			4.9025 mm
LTC4257IDD	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
LTC4257IDD#TR	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
LTC4257CS8	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified	e0			4.9025 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.