28 Other Function Telecom Interface ICs 398

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SX1276IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	3	1 mm	6 mm	Not Qualified		e3		260	6 mm
AX5043-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.125 Mbps	S-XQCC-N28	1	1 mm	5 mm				30	260	5 mm
SX1509BIULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	.6 mm	4 mm			e3		260	4 mm
CC2520RHDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
SX1272IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	1	1 mm	6 mm			e3	30	260	6 mm
LEA-M8S-0	U-blox Ag	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	DMA	RECTANGULAR	UNSPECIFIED	YES	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel		-40 Cel		DUAL		R-XDMA-N28	4	2.7 mm	17 mm						22.4 mm
CC2520RHDRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
EYSHSNZWZ	Taiyo Yuden	TELECOM CIRCUIT		NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID			3 V						85 Cel		-40 Cel		BOTTOM		R-XBGA-N28		.85 mm	3.25 mm						8.55 mm
BQ51013BYFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
SX1503I091TRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQCC-N28		.6 mm	4 mm	Not Qualified		e3			4 mm
MAX2771ETI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N28	1	.8 mm	5 mm			e3	30	260	5 mm
CC2520RHDT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
LEA-M8T-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N28	4	2.7 mm	17 mm				NOT SPECIFIED	NOT SPECIFIED	22.4 mm
TDA5210XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel		-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
CY7B933-JXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		.16 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
TDA5200XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
BQ51013BYFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
MGC3130-I/MQ	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQCC-N28		1 mm	5 mm			e3			5 mm
BQ51003YFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
CY7B923-JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
SX1278IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-XQCC-N28	3	1 mm	6 mm	Not Qualified		e3		260	6 mm
CY7B933-JXIT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		.16 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
PCM3060PWR	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
ATWILC1000-MR110UB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel		-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
CY7B923-JXI	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		.095 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
TM266DVA1	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.5	ATM/SONET/SDH ICs	.65 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G28	1	5.588 mm		Not Qualified
CY7B923-JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		.085 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
TDA5201XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
PCM3060PW	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
TDA5211XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel		-40 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
CY7B923-JXIT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		.095 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
UCC3750DW	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified		e4	30	260	17.9 mm
CC2520RHDTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N28	3	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
UCC3750DWTR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified		e4	30	260	17.9 mm
LEA-M8F-0-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N28	4	3.8 mm	17 mm						22.4 mm
TM1062DVA1	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.5	ATM/SONET/SDH ICs	.65 mm	125 Cel		-55 Cel		DUAL		R-PDSO-G28	1	5.588 mm		Not Qualified
XRT85L61IG-F	Exar	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
MT9041AP	Zarlink Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		.3 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm	11.506 mm	Not Qualified		e0		260	11.506 mm
BQ51013AYFPT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
UCC3750DWTRG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified		e4	30	260	17.9 mm
CY7B923-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm	7.505 mm	Not Qualified		e4	20	260	17.905 mm
TDA7200XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel		-20 Cel	TIN	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
ATWILC1000-MR110UB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel		-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
MGC3030-I/SS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	2	2 mm	5.3 mm			e3	40	260	10.2 mm
EYAGJNZXX	Taiyo Yuden	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			.4 mm	75 Cel		-25 Cel		UNSPECIFIED		R-XXMA-N28		1.5 mm	5.1 mm				NOT SPECIFIED	NOT SPECIFIED	11.3 mm
CY7B933-JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm	11.5316 mm	Not Qualified		e3	20	260	11.5316 mm
HPA00399RHDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm			e4	30	260	5 mm
BQ51003YFPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.