28 Other Function Telecom Interface ICs 398

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Input Type	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
PCM3060PWRG4	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G28	2	1.2 mm		4.4 mm	Not Qualified			e4	NOT SPECIFIED	260	9.7 mm
ATWILC1000-MR110PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel			UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm		14.73 mm			Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
MAX7033EUI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G28	1	1.1 mm		4.4 mm	Not Qualified			e0			9.7 mm
MAX7033EUI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm		4.4 mm	Not Qualified			e3	30	260	9.7 mm
ATWILC1000-MR110PB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel			UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm		14.73 mm			Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
SX1273IMLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N28	3	1 mm		6 mm				e3		260	6 mm
LEA-6H-0-002	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	PLASTIC/EPOXY	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel			DUAL		R-PDMA-N28	4	2.7 mm		17 mm							22.4 mm
CY7B923-SXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm		7.505 mm	Not Qualified			e4	30	260	17.905 mm
WT11U-A-AI4	Silicon Labs	TELECOM CIRCUIT		NO LEAD	28	DMA	RECTANGULAR	UNSPECIFIED	NO	1		CMOS			3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			DUAL	3 Mbps	R-XDMA-N28		2.7 mm		14.5 mm							35.75 mm
SX1509QBIULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N28		.6 mm		4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	4 mm
CY7B923-400JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		.085 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
AD73322AR-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1.2 dB	TIN LEAD	DUAL		R-PDSO-G28	3	2.65 mm	16-BIT	7.5 mm	Not Qualified			e0		240	17.9 mm	YES
AD73322AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1.2 dB	TIN LEAD	DUAL		R-PDSO-G28	3	2.65 mm	16-BIT	7.5 mm	Not Qualified			e0		240	17.9 mm	YES
CY7B933-JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		MATTE TIN	QUAD	400 Mbps	S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
UCC3750DWG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm		7.5 mm	Not Qualified			e4	30	260	17.9 mm
CY7B933-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified			e0			11.5316 mm
CY7B933-JIT	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-PQCC-J28		4.572 mm		11.5316 mm	Not Qualified			e0			11.5316 mm
MC100SX1230FN	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR			5 V	-4.2/-5.46	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	85 Cel	0 Cel		TIN LEAD	QUAD		S-PQCC-J28		4.57 mm		11.505 mm	Not Qualified			e0		235	11.505 mm
AD73360ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
AD974BRZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
ENW89846A1KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	28		RECTANGULAR	UNSPECIFIED	NO	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X28		2 mm		9 mm					50	250	9.5 mm
LEA-6S-0-001	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	PLASTIC/EPOXY	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel			DUAL		R-PDMA-N28	4	2.7 mm		17 mm							22.4 mm
RF6504SQ	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	BUTT	28	LFLGA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.676 mm	85 Cel	-40 Cel			BOTTOM		R-XBGA-B28		1.25 mm		5 mm							5.5 mm
TDA5235XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified			e4			9.7 mm
AD73360ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
CY7B923-SC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		85 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28	1	2.67 mm		7.5 mm	Not Qualified			e0	30	225	17.905 mm
LEA-6H-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel			DUAL		R-XDMA-N28		2.7 mm		17 mm					NOT SPECIFIED	NOT SPECIFIED	22.4 mm
LEA-6S-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel			DUAL		R-PDSO-N28
LEA-6T-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel			DUAL		R-PDSO-N28
MAX2510EEI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		25 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G28	1	1.75 mm		3.9 mm	Not Qualified			e0			9.89 mm
MAX2510EEI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				25 mA	3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.75 mm		3.9 mm	Not Qualified			e3	30	260	9.89 mm
SX1509IULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N28		.6 mm		4 mm	Not Qualified			e3			4 mm
AD73322LARUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.031 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Codecs	.65 mm	85 Cel	-40 Cel	.75 dB	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.2 mm	16-BIT	4.4 mm	Not Qualified			e3	40	260	9.7 mm	YES
AD73360ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
CY7B9234-270JXCT	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		MATTE TIN	QUAD		S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
TSC2200IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified	SINGLE-ENDED		e4	30	260	9.7 mm
UCC2750DWTRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	17.9 mm
WT11I-E-AI5	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			DUAL		R-XDMA-N28		2.86 mm		14.5 mm							35.75 mm
CY7B933-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm		7.505 mm	Not Qualified			e4	20	260	17.905 mm
AD974BRSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2 mm		5.3 mm	Not Qualified			e3		260	10.2 mm
CY7B923-JI	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		95 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-PQCC-J28	3	4.572 mm		11.5316 mm	Not Qualified			e0			11.5316 mm
CY7B9334-270JXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel			QUAD		S-PQCC-J28		4.572 mm		11.5316 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	11.5316 mm
SKY85806-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel			QUAD		R-XQCC-N28		.9 mm		3 mm					NOT SPECIFIED	NOT SPECIFIED	4 mm
CY7B923-JC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		TIN LEAD	QUAD		S-PQCC-J28	3	4.57 mm		11.53 mm	Not Qualified			e0			11.53 mm
MGA-43024-BLKG	Broadcom	TELECOM CIRCUIT		NO LEAD	28		SQUARE	UNSPECIFIED	YES	1					5 V		MICROELECTRONIC ASSEMBLY			.5 mm					QUAD		S-XQMA-N28	3	.92 mm		5 mm						260	5 mm
WT11I-A-AI4	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			DUAL		R-XDMA-N28		2.86 mm		14.5 mm							35.75 mm
EYSGJNZWY	Taiyo Yuden	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			.4 mm	75 Cel	-25 Cel			UNSPECIFIED		R-XXMA-N28		1.5 mm		5.1 mm					NOT SPECIFIED	NOT SPECIFIED	11.3 mm
AD974ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.