28 Other Function Telecom Interface ICs 398

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Maximum Output Low Current	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PEB2075C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		CMOS	10 mA	5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T28							Not Qualified			e0
PEB3035-P	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.008 mA	5 V		IN-LINE	DIP28(UNSPEC)	Other Telecom ICs	2.54 mm	85 Cel				0 Cel	TIN LEAD	DUAL		R-PDIP-T28			4.6 mm			15.24 mm	Not Qualified			e0			35.9 mm
PEB2235-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		CMOS	220 mA	5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T28				T-1(DS1)	CEPT PCM-30/E-1		Not Qualified			e0
PSB4451V1.1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm	Not Qualified						9.7 mm
PEF3035-N	Infineon Technologies	TELECOM CIRCUIT		J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1					CHIP CARRIER			1.27 mm							QUAD		R-PQCC-J28			3.8 mm			8.95 mm	Not Qualified						14.05 mm
PEB2235A2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28				T-1(DS1)	CEPT PCM-30/E-1		Not Qualified			e0
PEB2025-N	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V	5,-12/-60	CHIP CARRIER	LDCC28,.4X.6	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD		R-PQCC-J28	S		3.8 mm			8.95 mm	Not Qualified	2 Amp		e0			14.05 mm
PEB2070B1N	Infineon Technologies		COMMERCIAL	J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				CHIP CARRIER	LDCC28,.4X.6	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		R-PQCC-J28							Not Qualified			e0
SP000016381	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel	MATTE TIN	DUAL		R-PDSO-G28			1.2 mm			4.4 mm				e3			9.7 mm
SLB9635TT1.2	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel				0 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm							9.7 mm
SP000550860	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm							9.7 mm
SLB9635TT1.2F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel				0 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm							9.7 mm
TDA5200DUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm							9.7 mm
TDA5221XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm					NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TDA5220XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified						9.7 mm
TDA5211XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm					NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TDA5204	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0064 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified					235	9.7 mm
TDA5210	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0077 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel				-40 Cel	TIN	DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified			e3			9.7 mm
TDA7200	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0077 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	70 Cel				-20 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified					260	9.7 mm
TDA5200XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm					NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TDA5225	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.015 mA	3.3 V	3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel				-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified			e4		260	9.7 mm
TDA5240XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm				e4			9.7 mm
TDA5200	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0048 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified					260	9.7 mm
TDA5221	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0081 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified					260	9.7 mm
TDA5212	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.006 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified					260	9.7 mm
TDA5225XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified			e4			9.7 mm
TDA5201	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.005 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel				-40 Cel	TIN	DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified			e3			9.7 mm
TDA5210XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm					NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TDA5240	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm							9.7 mm
TDA5220XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm					NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TDA5235	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.015 mA	3.3 V	3.3,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel				-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified			e4		260	9.7 mm
TDA7200XT	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel				-20 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm	Not Qualified						9.7 mm
TDA5201XT	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G28			1.2 mm			4.4 mm					NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TDA5212XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified						9.7 mm
TDA5221XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel				-40 Cel	TIN	DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified			e3			9.7 mm
TDA5220	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.0079 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified					260	9.7 mm
TDA5211	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0075 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel				-40 Cel		DUAL		R-PDSO-G28		3	1.2 mm			4.4 mm	Not Qualified					260	9.7 mm
CY7B933-SXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28		3	2.67 mm			7.505 mm	Not Qualified			e4	30	260	17.905 mm
CY7B933-400JXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28		3	4.572 mm			11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
CY7B9233-270JC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BICMOS	160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28							Not Qualified			e0
CY7B923-400JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.085 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28		3	4.572 mm			11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
CYBT-423054-02	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	28	XMA	SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY			.91 mm	85 Cel				-30 Cel		UNSPECIFIED	3 Mbps	S-XXMA-N28		3	1.7 mm			11 mm			SEATED HGT-NOM				11 mm
CY7B933-400JXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.155 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	MATTE TIN	QUAD	400 Mbps	S-PQCC-J28		3	4.572 mm			11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
CYBT-423060-02	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	28	XMA	SQUARE	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY			.91 mm	85 Cel				-30 Cel		UNSPECIFIED	3 Mbps	S-XXMA-N28		3	1.7 mm			11 mm			SEATED HGT-NOM				11 mm
CY7B9233-400JC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BICMOS	160 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28							Not Qualified			e0
MAX3507EGI+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel				-40 Cel		QUAD		S-PQCC-N28			1 mm			5 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX3507EGI-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQCC-N28		1	1 mm			5 mm	Not Qualified			e0			5 mm
MAX3507EGI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel				-40 Cel	TIN LEAD	QUAD		S-PQCC-N28		1	1 mm			5 mm	Not Qualified			e0			5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.