28 Other Function Telecom Interface ICs 398

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD73360LARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3		260	17.9 mm
MAX7033EUI+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
MAX1470EUI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
MAX2511EEI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.045 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX7034AUI/V+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		.0087 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
MAX2510EEI+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			25 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX2511EEI+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.045 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX769EEI+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e3			9.89 mm
MAX1470EUI+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
MAX2121ETI+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N28	1	.8 mm	5 mm		e3	30	260	5 mm
MAX7034AUI+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.0087 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
MAX2121BETI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N28	1	.8 mm	5 mm		e3	30	260	5 mm
MAX2107CWI	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0	20	240	17.9 mm
MAX7034AUI/V+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm		e3	30	260	9.7 mm
MAX2121ETI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	QCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER			.75 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N28	1		5 mm	Not Qualified	e3	30	260	5 mm
MAX7034AUI+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm		e3	30	260	9.7 mm
AMIS49587C5871R	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel		QUAD		S-PQCC-J28		4.572 mm	12.446 mm	Not Qualified				12.446 mm
MTK-40130	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE				85 Cel	-30 Cel		DUAL		R-PDSO-G28				Not Qualified
AX5042-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-XQCC-N28	1	1 mm	5 mm		e4		260	5 mm
MTK-40131	Onsemi	TELECOM CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE				85 Cel	-30 Cel		DUAL		R-PDSO-G28				Not Qualified
MC100SX1230FNR2	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR				5 V	-4.2/-5.46	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified	e0			11.505 mm
AMIS49587C5871RG	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	80 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified	e3	30	260	11.506 mm
AX5044-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	.2 Mbps	S-PQCC-N28		1 mm	5 mm					5 mm
AX5043	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N28		.9 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
AX5042-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.25 Mbps	S-XQCC-N28		1 mm	5 mm		e4			5 mm
AMIS49587C5871G	Onsemi	TELECOM CIRCUIT	OTHER	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				.08 mA	3.3 V	3.3	CHIP CARRIER	LDCC28,.5SQ	Modems	1.27 mm	80 Cel	-40 Cel	TIN	QUAD		S-PQCC-J28	3	4.572 mm	11.506 mm	Not Qualified	e3	30	260	11.506 mm
TEA7050D	STMicroelectronics			GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					26 mA	2.8 V	2.8	SMALL OUTLINE	SOP28,.5	Other Telecom ICs	1.27 mm			Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28				Not Qualified	e0
TEA7050DP	STMicroelectronics			THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					26 mA	2.8 V	2.8	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28				Not Qualified	e0
STLC60133N	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			-6 V		6 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified				9.7 mm
L3092FN	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		-5 V		5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified	e0			11.5062 mm
ST5451N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS				5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDIP-T28			15.24 mm	Not Qualified	e0			36.83 mm
TEA7052D	STMicroelectronics			GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					26 mA	4 V	4	SMALL OUTLINE	SOP28,.5	Other Telecom ICs	1.27 mm			Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28				Not Qualified	e0
L3092N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		-5 V		5 V	+-5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDIP-T28			15.24 mm	Not Qualified	e0			36.83 mm
STLC60243	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		-5 V		5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e0			9.7 mm
E-STLC60243	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e3/e4	NOT SPECIFIED	NOT SPECIFIED	9.7 mm
M3444F1	STMicroelectronics			THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		MOS				5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T28				Not Qualified	e0
ST3854	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	NMOS			.15 mA	2.7 V	3	SMALL OUTLINE	SOP28,.4	Telephone Circuits	1.27 mm	55 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
M104B1	STMicroelectronics	TELECOM CIRCUIT		THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS				5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28				Not Qualified	e0
L3092TFN	STMicroelectronics		INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		-5 V		5 V	+-5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28				Not Qualified	e0
M044F1	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		MOS				5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T28				Not Qualified	e0
L3092FNT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			-5 V		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel		QUAD		S-PQCC-J28		4.57 mm	11.5062 mm	Not Qualified				11.5062 mm
L3092NT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			-5 V		5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T28			15.24 mm	Not Qualified				36.83 mm
STLC60133	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			-6 V		6 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified	e0			9.7 mm
L3092TN	STMicroelectronics		INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		-5 V		5 V	+-5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28				Not Qualified	e0
TEA1094PN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL		R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified				35.5 mm
UMA1000T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-G28				Not Qualified
TEA1094N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL		R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified				35.5 mm
TEA1093	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			140 mA	3.6 V	3.6	IN-LINE	DIP28,.6	Telephone Circuits	2.54 mm	75 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	e3/e4			35.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.