3 Other Function Telecom Interface ICs 54

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SL3S1002FTB1,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

.55 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-PBCC-B3

1

.5 mm

1 mm

Not Qualified

e3

30

260

1.45 mm

SL2S2002FTB,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

.55 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N3

1

.5 mm

1 mm

e3

30

260

1.45 mm

MD0100N8-G

Microchip Technology

TELECOM CIRCUIT

AUTOMOTIVE

FLAT

3

LSOF

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

SMALL OUTLINE, LOW PROFILE

TO-243

1.5 mm

125 Cel

-40 Cel

MATTE TIN

SINGLE

R-PSSO-F3

1

1.6 mm

2.445 mm

e3

40

260

4.5 mm

SL2S2002FTB

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

.55 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N3

1

.5 mm

1 mm

Not Qualified

e3

30

260

1.45 mm

SL2S2102FTB,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

.55 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N3

1

.5 mm

1 mm

e3

30

260

1.45 mm

ADMP510ACEZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

TLGA

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY, THIN PROFILE

1.22 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B3

1.08 mm

2.5 mm

NOT SPECIFIED

NOT SPECIFIED

3.35 mm

HMC773

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

3

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-55 Cel

UPPER

R-XUUC-N3

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

ADL5601ARKZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

FLAT

3

LSOF

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE

1.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-F3

1

1.6 mm

2.45 mm

Not Qualified

e3

260

4.5 mm

ADMP510ACEZ-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

TLGA

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY, THIN PROFILE

1.22 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B3

1.08 mm

2.5 mm

NOT SPECIFIED

NOT SPECIFIED

3.35 mm

HMC554

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

3

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N3

Not Qualified

e4

HMC560

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

3

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N3

Not Qualified

e4

TCP-5118XA-DT

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

BALL

3

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA3(UNSPEC)

.55 mm

85 Cel

-30 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B3

.375 mm

.772 mm

e1

5

260

.94 mm

TCP-5112UA-DT

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

BALL

3

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA3(UNSPEC)

.55 mm

85 Cel

-30 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B3

.375 mm

.772 mm

e1

5

260

.993 mm

TCP-5127XA-DT

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

BALL

3

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA3(UNSPEC)

.55 mm

85 Cel

-30 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B3

.375 mm

.772 mm

e1

5

260

.94 mm

TCP-5118UA-DT

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

BALL

3

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA3(UNSPEC)

.55 mm

85 Cel

-30 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B3

.375 mm

.772 mm

e1

5

260

.993 mm

TCP-5156UA-DT

Onsemi

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

3

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA3(UNSPEC)

.55 mm

85 Cel

-30 Cel

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BOTTOM

R-PBGA-B3

.375 mm

.772 mm

e1

5

260

.993 mm

SL3S1202FTB1,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

.55 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-PBCC-B3

1

.5 mm

1 mm

Not Qualified

e3

30

260

1.45 mm

SL3S1002FTB1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

CHIP CARRIER

.55 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-PBCC-B3

1

.5 mm

1 mm

Not Qualified

e3

1.45 mm

SL3S1202FTB1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

CHIP CARRIER

.55 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-PBCC-B3

1

.5 mm

1 mm

Not Qualified

e3

1.45 mm

HTMS8101FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

HTMS1301FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS8101FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

HTMS1101FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS8001FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

MMG30271BT1

NXP Semiconductors

TELECOM CIRCUIT

FLAT

3

LSOF

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE

1.5 mm

SINGLE

R-PSSO-F3

1

1.6 mm

2.5 mm

40

260

4.5 mm

MMG30301BT1

NXP Semiconductors

TELECOM CIRCUIT

FLAT

3

LSOF

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE

1.5 mm

SINGLE

R-PSSO-F3

1

1.6 mm

2.5 mm

40

260

4.5 mm

HTMS1301FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

HTMS8001FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

1

Not Qualified

260

HTMS8101FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

1

Not Qualified

260

HTMS8201FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

HTMS8301FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

3

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B3

Not Qualified

HTMS8301FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

HTMS8201FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

1

Not Qualified

260

HTMS1201FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

HTMS1201FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS8001FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

HTMS1301FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

3

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B3

Not Qualified

HTMS8201FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

HTMS8301FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS1201FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

HTMS1001FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

HTMS1001FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS1001FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

HTMS1101FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

HTMS8001FTB/AF,148

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

1

Not Qualified

260

HTMS1101FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

SL2S1512FTB

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

.55 mm

85 Cel

-40 Cel

DUAL

.848 Mbps

R-PDSO-N3

.5 mm

1 mm

1.45 mm

SL2S2102FTB

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

.55 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N3

1

.5 mm

1 mm

Not Qualified

e3

1.45 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.