60 Other Function Telecom Interface ICs 19

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SIM900B	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	60	XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.0856 Mbps	R-XXMA-X60					Operates with 3.2-4.8 V supply
LMX9830SMX/NOPB	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.065 mA	2.75 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.9216 Mbps	R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
MC12311CHN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	LGA	SQUARE	PLASTIC/EPOXY	YES							2/3.3	GRID ARRAY	LGA60,16X16,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM		S-PBGA-N60	3			Not Qualified		e4	40	260
LMX5452SM/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
LMX5453SMX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B60	4	1.3 mm	6 mm			e1	30	260	9 mm
LMX5452SMX/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					3/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
LM96530SQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	60	VQCCN	SQUARE	UNSPECIFIED	YES	1			-5 V		5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N60		.8 mm	9 mm						9 mm
LM96530SQ/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1			-5 V		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N60	2	.8 mm	9 mm			e3	30	260	9 mm
LM96530SQ	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	60	VQCCN	SQUARE	UNSPECIFIED	YES	1			-5 V		5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N60		.8 mm	9 mm						9 mm
LMX5453SM/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	12 Mbps	R-PBGA-B60	4	1.3 mm	6 mm			e1	30	260	9 mm
LMX5452SMX	Texas Instruments		INDUSTRIAL	BALL	60	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS					3/3.3	GRID ARRAY, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B60	3			Not Qualified			20	235
LM96530SQX	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	60	VQCCN	SQUARE	UNSPECIFIED	YES	1			-5 V		5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N60		.8 mm	9 mm						9 mm
LMX9830SMX	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	125 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B60	3	1.3 mm	6 mm	Not Qualified		e0	30	235	9 mm
LMX9830SM/NOPB	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.065 mA	2.75 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.9216 Mbps	R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
LMX9830SM	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	125 Cel	-40 Cel		BOTTOM		R-PBGA-B60		1.3 mm	6 mm	Not Qualified					9 mm
MC12311CHNR	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	LGA	SQUARE	PLASTIC/EPOXY	YES							2/3.3	GRID ARRAY	LGA60,16X16,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM		S-PBGA-N60	3			Not Qualified		e4	40	260
MC12311	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	60	VFLGA	SQUARE	UNSPECIFIED	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B60		.98 mm	8 mm						8 mm
CYW89035CWMLG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N60		.9 mm	7 mm						7 mm
CYW20735PKML1G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	60	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N60		.9 mm	7 mm						7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.