64 Other Function Telecom Interface ICs 286

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM20738A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B64		1 mm	7 mm					7 mm
BCM20730A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B64		1 mm	7 mm					7 mm
CYW20738A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B64		1 mm	7 mm					7 mm
CYW20730A1KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B64		1 mm	7 mm					7 mm
CYW20730A2KFBG	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B64		1 mm	7 mm					7 mm
MAX2980CCB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Modems	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified	e0			10 mm
TC35661IDBG-203	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B64		1.4 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
TC35661DBG-203	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B64		1.4 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
TC35661IDBG-008	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B64		1.4 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
TB31301F(EL)	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V		FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G64		3.15 mm	12 mm	Not Qualified				12 mm
TC35661SBG-203	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B64		1.2 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
TB31301F-TP2	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V		FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G64		3.15 mm	12 mm	Not Qualified				12 mm
TC90207FG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
TB31301F	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V		FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G64		3.15 mm	12 mm	Not Qualified				12 mm
TB31301F-TP1	Toshiba	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1		20 mA	5 V		FLATPACK			.65 mm	75 Cel	-20 Cel		QUAD	S-PQFP-G64		3.15 mm	12 mm	Not Qualified				12 mm
82V3255DK	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0			10 mm
IDT82V3255TF8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0	30	240	10 mm
ICS9536-01	Renesas Electronics	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK			.8 mm			TIN LEAD	QUAD	S-PQFP-G64		2.45 mm	14 mm	Not Qualified	e0			14 mm
82V3358TF	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.464 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0			10 mm
82V3358EDG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.464 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3	30	260	10 mm
82V3358TFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.464 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
82V3255TF8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK				85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3				e0	30	240
IDT82V3255TFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
82V3255EDG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3		260	10 mm
ICS9536-01LF	Renesas Electronics	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK			.8 mm			MATTE TIN	QUAD	S-PQFP-G64		2.45 mm	14 mm	Not Qualified	e3			14 mm
82V3255TFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
82V3255TFG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm		e3	30	260	10 mm
IDT82V3255TFG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm		e3	30	260	10 mm
UPD72307CW	Renesas Electronics			THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS				IN-LINE	DIP64(UNSPEC)	Other Telecom ICs				Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T64				Not Qualified	e0
IDT82V3255DK	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e0			10 mm
UPD72305CW	Renesas Electronics			THROUGH-HOLE	64	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS		5 V	5	IN-LINE	DIP64(UNSPEC)	Other Telecom ICs				Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T64				Not Qualified	e0
BCM2040	Broadcom	TELECOM CIRCUIT		BALL	64	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1	CMOS				GRID ARRAY							BOTTOM	X-PBGA-B64
BCM2037	Broadcom	TELECOM CIRCUIT		GULL WING	64	QFP	UNSPECIFIED	PLASTIC/EPOXY	YES	1					FLATPACK							QUAD	X-PQFP-G64				Not Qualified
HDMP-2631B	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		FLATPACK			.8 mm	85 Cel	0 Cel		QUAD	S-PQFP-G64		2.35 mm	13.8 mm	Not Qualified				13.8 mm
HDMP-1546A	Broadcom	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		FLATPACK			.8 mm	70 Cel	0 Cel		QUAD	S-PQFP-G64		2.35 mm	14 mm	Not Qualified				14 mm
HDMP-0480	Broadcom	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR	280 mA	3.3 V	3.3	FLATPACK	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G64				Not Qualified
T-8532---JL-DT	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1					FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		3 mm	14 mm	Not Qualified				14 mm
HDMP-1536A	Broadcom	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G64		2.45 mm	10 mm	Not Qualified				10 mm
HDMP-0552	Broadcom	TELECOM CIRCUIT		GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	3.3	FLATPACK, FINE PITCH	QFP64,.51SQ,20	ATM/SONET/SDH ICs	.5 mm		0 Cel		QUAD	S-PQFP-G64		2.45 mm	10 mm	Not Qualified				10 mm
BCM3037	Broadcom	TELECOM CIRCUIT		GULL WING	64	QFP	UNSPECIFIED	PLASTIC/EPOXY	YES	1					FLATPACK							QUAD	X-PQFP-G64				Not Qualified
HDMP-2630B	Broadcom	TELECOM CIRCUIT	OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		FLATPACK			.8 mm	85 Cel	0 Cel		QUAD	S-PQFP-G64		2.35 mm	13.8 mm	Not Qualified				13.8 mm
KA8511	Samsung		OTHER	THROUGH-HOLE	64	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO					2/6	IN-LINE, SHRINK PITCH	SDIP64,.75	Other Telecom ICs	1.78 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T64				Not Qualified	e0
KS8510	Samsung	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK			1 mm				QUAD	R-PQFP-G64		2.45 mm	14 mm	Not Qualified				20 mm
S5T8610X01-Q0R0	Samsung	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK	QFP64,.66SQ,32	Modems	.8 mm	70 Cel	-10 Cel		QUAD	S-PQFP-G64		2.8 mm	14 mm	Not Qualified				14 mm
KA8510	Samsung		OTHER	THROUGH-HOLE	64	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO					2/6	IN-LINE, SHRINK PITCH	SDIP64,.75	Other Telecom ICs	1.78 mm	70 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T64				Not Qualified	e0
KS8511	Samsung	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					FLATPACK			1 mm				QUAD	R-PQFP-G64		2.45 mm	14 mm	Not Qualified				20 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.