64 Other Function Telecom Interface ICs 286

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SX043HQ

Onsemi

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

70 Cel

0 Cel

QUAD

R-PQFP-G64

Not Qualified

LC72711LW

Onsemi

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

20 mA

3/3.3

FLATPACK

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

LA8580W

Onsemi

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

21 mA

5 V

5

FLATPACK

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

70 Cel

-20 Cel

QUAD

S-PQFP-G64

Not Qualified

SX043HT

Onsemi

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

70 Cel

0 Cel

QUAD

R-PQFP-G64

Not Qualified

SX042HQ

Onsemi

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

70 Cel

0 Cel

QUAD

R-PQFP-G64

Not Qualified

SX043T

Onsemi

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

70 Cel

0 Cel

QUAD

R-PQFP-G64

Not Qualified

LC72710W

Onsemi

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

25 mA

5 V

5

FLATPACK

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

SX042Q

Onsemi

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

70 Cel

0 Cel

QUAD

R-PQFP-G64

Not Qualified

LC72709W

Onsemi

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

25 mA

5 V

5

FLATPACK

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

SX042HT

Onsemi

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

70 Cel

0 Cel

QUAD

R-PQFP-G64

Not Qualified

LC72714W

Onsemi

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

20 mA

3/3.3

FLATPACK

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

SX042T

Onsemi

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

70 Cel

0 Cel

QUAD

R-PQFP-G64

Not Qualified

LC72711W

Onsemi

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

25 mA

5 V

5

FLATPACK

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

STM7E1A

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

-3.3 V

3.3 V

+-3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

10 mm

STV0361

STMicroelectronics

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

STV0299B

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

-10 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

MTC20154TQ-C

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

ST70134A

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Modems

.5 mm

80 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e4

10 mm

STLC1511

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

5 V

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Modems

.5 mm

80 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e4

10 mm

FC106

STMicroelectronics

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

3.3 V

3.3

FLATPACK

QFP64,.51SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G64

Not Qualified

e0

STM7E1AR

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

-3.3 V

3.3 V

+-3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

FC106/14

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK

QFP64,.66SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

2.35 mm

14 mm

Not Qualified

e0

14 mm

STV0360

STMicroelectronics

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

STV0297E

STMicroelectronics

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

STV0196

STMicroelectronics

OTHER

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

480 mA

3.3 V

3.3

FLATPACK

QFP64,.66SQ,32

Other Telecom ICs

.8 mm

85 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

S-PQFP-G64

Not Qualified

e0

STV0288

STMicroelectronics

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

ST70134

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Modems

.5 mm

80 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

e4

10 mm

FC106/10

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

64

FQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, FINE PITCH

QFP64,.51SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

2.45 mm

10 mm

Not Qualified

e0

10 mm

STA610

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N64

1 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

TDA7541W

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TDA7541

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

TDA7541WTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

TDA7541B

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

TDA7541BWTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

TIN SILVER COPPER

QUAD

S-PQFP-G64

3

Not Qualified

e1

30

260

TDA7541BW

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

TIN SILVER COPPER

QUAD

S-PQFP-G64

3

Not Qualified

e1

30

260

TDA7541TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

10 mm

TDA7541BTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e4

30

260

10 mm

MWCT1013VLHSTR

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

10 mm

MWCT1013VLH

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

Tin (Sn)

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

e3

40

260

10 mm

TDA10026HN/C1

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-PQCC-N64

1 mm

9 mm

9 mm

MWCT1111CLH

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

e3

40

260

SA58646BD,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

1

1.6 mm

10 mm

Not Qualified

e3

10 mm

MWCT1001AVLHR

NXP Semiconductors

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

e3

40

260

10 mm

SA58646BD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin (Sn)

QUAD

S-PQFP-G64

1

1.6 mm

10 mm

Not Qualified

e3

30

260

10 mm

MWCT1013VLHST

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

10 mm

PN5441A2ET/C20501

NXP Semiconductors

TELECOM CIRCUIT

OTHER

BALL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

85 Cel

-25 Cel

BOTTOM

S-PBGA-B64

935311368528

NXP Semiconductors

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

e3

40

260

10 mm

PN5180A0ET/C1,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

1

1.15 mm

5.5 mm

e1

30

260

5.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.