64 Other Function Telecom Interface ICs 286

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Input Code	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SN65DSI83TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				AEC-Q100			1.8 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 Mbps	S-PQFP-G64		3	1.2 mm	10 mm					e4	30	260	10 mm
SN65DSI84TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				AEC-Q100			1.8 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 Mbps	S-PQFP-G64		3	1.2 mm	10 mm					e4	30	260	10 mm
SN65DSI84ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 Mbps	S-PBGA-B64		3	1 mm	5 mm					e1	30	260	5 mm
SN65DSI83ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 Mbps	S-PBGA-B64		3	1 mm	5 mm					e1	30	260	5 mm
SN65DSI86IPAPQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G64		3	1.2 mm	10 mm					e4	30	260	10 mm
SN65DSI86IPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G64		3	1.2 mm	10 mm					e4	30	260	10 mm
CC430F6137IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1							2.2 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.25 Mbps	S-PQCC-N64		3	1 mm	9 mm	Not Qualified				e4	30	260	9 mm
SN65DSI83ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B64			1 mm	5 mm								5 mm
SN65DSI85TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				AEC-Q100			1.8 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 Mbps	S-PQFP-G64		3	1.2 mm	10 mm					e4	30	260	10 mm
PEF7072HLV16SLLHN	Intel	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1										FLATPACK									QUAD		R-PQFP-G64
SN65DSI86ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	5400 Mbps	S-PBGA-B64		3	1 mm	5 mm					e1	30	260	5 mm
TLK2711IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1							2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G64		3	1 mm	10 mm	Not Qualified				e4	30	260	10 mm
TLK2711IRCPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1							2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G64		3	1 mm	10 mm	Not Qualified				e4	30	260	10 mm
ZGM130S037HGN2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE		YES								1.8 V			CHIP CARRIER	LCC64,.35SQ,20		.5 mm	85 Cel		-40 Cel			QUAD		S-PQCC-N64		3	1.3 mm	9 mm						40	260	9 mm
TLK2711AIRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1							2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G64		3	1 mm	10 mm	Not Qualified				e4	30	260	10 mm
TLK2711AIRCPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1							2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQFP-G64		3	1 mm	10 mm	Not Qualified				e4	30	260	10 mm
CC430F6137IRGCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1							2.2 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.25 Mbps	S-PQCC-N64		3	1 mm	9 mm	Not Qualified				e4	30	260	9 mm
SC1894A-00C13E	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1							1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm						QUAD		S-XQCC-N64			.9 mm	9 mm						NOT SPECIFIED	NOT SPECIFIED	9 mm
SN65DSI85ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 Mbps	S-PBGA-B64		3	1 mm	5 mm					e1	30	260	5 mm
ML7037-003TBZ03A	Lapis Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V			FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD		S-PQFP-G64			1.2 mm	10 mm								10 mm
ZGM130S037HGN2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	QCCN	SQUARE		YES								1.8 V			CHIP CARRIER	LCC64,.35SQ,20		.5 mm	85 Cel		-40 Cel			QUAD		S-PQCC-N64		3	1.3 mm	9 mm						40	260	9 mm
CC430F6137IRGC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1							2.2 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N64		3	1 mm	9 mm	Not Qualified				e4	30	260	9 mm
SC1894A-00M13E	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm						QUAD		S-XQCC-N64			.9 mm	9 mm						NOT SPECIFIED	NOT SPECIFIED	9 mm
SC1894A-00C13	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1							1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm						QUAD		S-XQCC-N64			.9 mm	9 mm						NOT SPECIFIED	NOT SPECIFIED	9 mm
SC1894A-00M13	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1							1.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm						QUAD		S-XQCC-N64			.9 mm	9 mm						NOT SPECIFIED	NOT SPECIFIED	9 mm
PN5120A0ET/C2QL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES							100 mA			3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel		-30 Cel			BOTTOM		S-PBGA-B64		1			Not Qualified						260
AD9866BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS				3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Modems	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N64		3	1 mm	9 mm	Not Qualified				e3		260	9 mm
ST25RU3992-BQFT	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	64		SQUARE	UNSPECIFIED	YES	1											LCC64(UNSPEC)								QUAD		S-XQCC-N64							Operates from 4.1V to 5.5V Supply
PGA5807ARGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD		S-PQCC-N64		3	1 mm	9 mm					e4	30	260	9 mm
SN65DSI85ZQE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			BOTTOM		S-PBGA-B64			1 mm	5 mm								5 mm
CC430F6135IRGCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1							2.2 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD		S-PQCC-N64		3	1 mm	9 mm	Not Qualified				e4	30	260	9 mm
CC430F6127IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1							2.2 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.25 Mbps	S-PQCC-N64		3	1 mm	9 mm	Not Qualified				e4	30	260	9 mm
CC430F6135IRGCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1							2.2 V			CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		QUAD	.25 Mbps	S-PQCC-N64		3	1 mm	9 mm	Not Qualified				e4	30	260	9 mm
IC1003	Rf Monolithics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1										FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel			QUAD		R-PQFP-G64		1	1.2 mm	10 mm	Not Qualified						260	10 mm
PSB21150FV1.4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD		S-PQFP-G64		3	1.6 mm	10 mm							260	10 mm
PEF7072HLV16	Intel	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1										FLATPACK									QUAD		R-PQFP-G64
PN5120A0ET/C2J	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES							100 mA			3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel		-30 Cel			BOTTOM		S-PBGA-B64		1			Not Qualified						260
TLK2501IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					1		2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	2500 Mbps	S-PQFP-G64		3	1 mm	10 mm	Not Qualified				e4	30	260	10 mm
PSB21150FSLLHQ	Intel	TELECOM CIRCUIT		GULL WING	64		RECTANGULAR	PLASTIC/EPOXY	YES	1																			QUAD		R-PQFP-G64										NOT SPECIFIED	NOT SPECIFIED
AD9861BCPZ-80	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1							3.3 V		3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-XQCC-N64		3	1 mm	9 mm	Not Qualified				e3		260	9 mm
ZL30100QDG1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V			FLATPACK, THIN PROFILE, FINE PITCH	PQFP64,.40SQ,20		.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-PQFP-G64		1	1.2 mm	10 mm					e3		260	10 mm
ZL30102QDG1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1							1.8 V			FLATPACK, THIN PROFILE, FINE PITCH	PQFP64,.40SQ,20		.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD		S-PQFP-G64			1.2 mm	10 mm					e3			10 mm
TLC320AD535PM	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified							10 mm
TLK1501IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TTL				2.5 V		2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	2500 Mbps	S-PQFP-G64		3	1 mm	10 mm	Not Qualified				e4	30	260	10 mm
SN75FC1000PJD	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			.25 mA	3.3 V		3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	70 Cel		0 Cel			QUAD		S-PQFP-G64			1.2 mm	10 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	10 mm
TLC320AD535CPM	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TWOS COMPLEMENT	2	CMOS			.06 mA	3.3 V	TWOS COMPLEMENT	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel		1.78 V	QUAD		S-PQFP-G64	VOLTAGE		1.6 mm	10 mm	Not Qualified	DIFFERENTIAL		3 V		NOT SPECIFIED	NOT SPECIFIED	10 mm
TSB21LV03PM	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	10 mm
SN75FC1000BPJD	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			GAAS			.31 mA	3.3 V		3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	70 Cel		0 Cel			QUAD		S-PQFP-G64			1.2 mm	10 mm	Not Qualified					NOT SPECIFIED	NOT SPECIFIED	10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.