64 Other Function Telecom Interface ICs 286

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	ISDN Access Rate	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PN5180A0ET/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel				-30 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B64		1	1.15 mm	5.5 mm			e1	30	260	5.5 mm
PN5120A0ET/C2EL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3		GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel				-30 Cel		BOTTOM		S-PBGA-B64		1			Not Qualified				260
PN5120A0ET/C2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel				-30 Cel		BOTTOM		S-PBGA-B64			1.15 mm	5.5 mm						5.5 mm
PN5120A0ET/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		3 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel				-30 Cel		BOTTOM		S-PBGA-B64			1.15 mm	5.5 mm						5.5 mm
PMB2905-F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PEF8091H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PSB21150FV14XQMA1	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel	MATTE TIN	QUAD		S-PQFP-G64			1.6 mm	10 mm			e3	40	260	10 mm
PSB21150F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel		QUAD	.144 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	4.5 Amp				10 mm
PEB31664V1.3	Infineon Technologies		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES		BICMOS		125 mA	3.3 V	3.3		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64					Not Qualified		e0
PEB31666	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK				85 Cel				-40 Cel		QUAD		S-PQFP-G64					Not Qualified
PMB2708-F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PSB2115F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	7 Amp	e0			10 mm
PEB8191	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEF8191H	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	85 Cel	2.4 V	.45 V	ANSI T1.601	-40 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)				Not Qualified	7 Amp	e0
PSB2113H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.019 mA	5 V	5		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel				0 Cel	TIN LEAD	QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified		e0			14 mm
PEF8191	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PSB2115F-V12	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PSB21150HV1.4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK			.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64		3	2.45 mm	14 mm					220	14 mm
PEB31665	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V			FLATPACK			.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified					14 mm
PSB21150H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel		QUAD	.144 Mbps	S-PQFP-G64	S/T		2.45 mm	14 mm	Not Qualified	4.5 Amp				14 mm
PSB21150FV14XQSA1	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel	MATTE TIN	QUAD		S-PQFP-G64			1.6 mm	10 mm			e3			10 mm
PSF2115	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PMB2708_2-F(GOLD-SXE)	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PEB22811	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1							FLATPACK										QUAD		R-PQFP-G64					Not Qualified
PEB8091F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEB80900H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK			.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified					14 mm
PSB2115	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK			.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified					14 mm
PSB2113F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.019 mA	5 V	5		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel				0 Cel	TIN LEAD	QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified		e0			10 mm
PSB2115HV1.1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PSF21150F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel		QUAD	.144 Mbps	S-PQFP-G64	S/T		1.6 mm	10 mm	Not Qualified	4.5 Amp				10 mm
PEB8090H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PEB31664	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V			FLATPACK			.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified					14 mm
PEF8191F	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	85 Cel	2.4 V	.45 V	ANSI T1.601	-40 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)		1.6 mm	10 mm	Not Qualified	7 Amp	e0			10 mm
PSF21150H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel		QUAD	.144 Mbps	S-PQFP-G64	S/T		2.45 mm	14 mm	Not Qualified	4.5 Amp				14 mm
PSB21384	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified					14 mm
PEB31666V1.3	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		.125 mA	3.3 V	3.3		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified		e0			14 mm
PEB80900F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PSF2115H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK			.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified					14 mm
PMB2900-H	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V			FLATPACK				85 Cel				-25 Cel		QUAD		S-PQFP-G64					Not Qualified
PEB8191H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	70 Cel	2.4 V	.45 V	ANSI T1.601	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)				Not Qualified	7 Amp	e0
PEB8191F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Digital Transmission Interfaces	.5 mm	70 Cel	2.4 V	.45 V	ANSI T1.601	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T TO U (NT-1)		1.6 mm	10 mm	Not Qualified	7 Amp	e0			10 mm
PSF2115F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V			FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PMB2708_1-F(GOLD-SXH)	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V			FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PEB8090F	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK, LOW PROFILE, FINE PITCH			.5 mm							QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm
PEB8091H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK										QUAD		S-PQFP-G64					Not Qualified
PSB2115H	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	BASIC	FLATPACK	QFP64,.66SQ,32	Digital Transmission Interfaces	.8 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD	.192 Mbps	S-PQFP-G64	S/T		2.45 mm	14 mm	Not Qualified	7 Amp	e0			14 mm
PSB21382	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3/5		FLATPACK	QFP64,.66SQ,32	Other Telecom ICs	.8 mm	70 Cel				0 Cel		QUAD		S-PQFP-G64			2.45 mm	14 mm	Not Qualified					14 mm
PSB2115FV1.1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1							FLATPACK, LOW PROFILE			.6 mm							QUAD		S-PQFP-G64			1.6 mm	10 mm	Not Qualified					10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.