8 Other Function Telecom Interface ICs 419

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA612AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4		260	4.9 mm
SA612AD/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
SL3S4011FHK,125	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES								1.8/3.6	CHIP CARRIER	LCC8,.06SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N8	1			Not Qualified		30	260
ADL5350ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1						3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm	2 mm	Not Qualified	e3		260	3 mm
OPA380AIDGKT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1				.008 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
SN65HVD1050QDRQ1	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.8 mm	Not Qualified	e4	30	260	4.905 mm
TRF37B73IDSGT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e4	30	260	2 mm
OPA2380AIDGKT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2				.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
OPA2380AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2				.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
ATECC508A-SSHDA-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949			3.6 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm		e4		260	4.9 mm
SA612AD/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
OPA380AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1	CMOS			.0088 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
OPA380AIDG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1				.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
AP22800HB-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-N8		.605 mm	1.6 mm		e4		260	2.1 mm
OPA380AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	1				.008 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
OPA2380AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2				.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
ATECC508A-SSHDA-B	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949			3.6 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm		e4		260	4.9 mm
OPA2380AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2					.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
SA612AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.9 mm
SA602AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.5 mm
SA602AD/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
LTC5596IDC#TRMPBF	Analog Devices	TELECOM CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			MATTE TIN	DUAL		S-PDSO-N8		.8 mm	2 mm		e3			2 mm
OPA380AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					.008 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8	2	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
SA612AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		40	250	9.5 mm
SA612AN,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		40	250	9.5 mm
AD8015AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0		240	4.9 mm
MLX90109EDC-AAA-000-RE	Melexis N V	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.72 mm	3.9 mm		e3		260	4.9 mm
TLE8457BSJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100			8 V		SMALL OUTLINE			1.27 mm			TIN	DUAL		R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
SA602AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.9 mm
AD8015ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					26 mA	5 V		SMALL OUTLINE				85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1			Not Qualified	e3	30	260
MAX7044AKA-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX7044AKA+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified		30	260	2.9 mm
TRF37A73IDSGT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e4	30	260	2 mm
TLE8457BLEXUMA1	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100			8 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
SA602AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SX1243IULTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-N8	1	.6 mm	2 mm	Not Qualified	e3		260	3 mm
SA612AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e4			9.5 mm
AD8314ARMZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3		260	3 mm
LTC5596IDC#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e3			2 mm
AD8015ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
ATA8403C-6AQY66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES						11 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.635 mm	85 Cel	-55 Cel	MATTE TIN	DUAL		R-PDSO-G8				Not Qualified	e3
ATA8403C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		.65 mm	85 Cel	-55 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8		1.05 mm	3 mm		e3	NOT SPECIFIED	NOT SPECIFIED	3 mm
ATA8402C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					.0116 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified	e3			3 mm
ATA8402C-6AQY66	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					11.6 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified				3 mm
OPA380AID	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1				.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm	3.9 mm	Not Qualified	e4	30	260	4.9 mm
BGS13SN8E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1		MOS						CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-XBCC-B8	1	.4 mm	1.1 mm		e3			1.1 mm
SA602AD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
LTC5596HDC#TRPBF	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e3		260	2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.