Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
TELECOM CIRCUIT |
NO LEAD |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
8 V |
SMALL OUTLINE |
.65 mm |
TIN |
DUAL |
S-PDSO-N8 |
2A |
1.15 mm |
3 mm |
e3 |
3 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
3 |
.6 mm |
2 mm |
e3 |
2 mm |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
8 V |
SMALL OUTLINE |
1.27 mm |
TIN |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
4 mm |
e3 |
5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
e3 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
e3 |
2 mm |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
e3 |
40 |
260 |
4.9 mm |
||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
2 |
1.72 mm |
3.937 mm |
e3 |
30 |
260 |
4.927 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
26 mA |
5 V |
SMALL OUTLINE |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
11.6 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-G8 |
1.05 mm |
3 mm |
Not Qualified |
3 mm |
||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0116 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
85 Cel |
-55 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1.05 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Melexis N V |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.72 mm |
3.9 mm |
e3 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
.026 mA |
3.3 V |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-XDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
.026 mA |
3.3 V |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-XDSO-N8 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.008 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
3 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
6 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
Melexis N V |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 mA |
3.3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G8 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BUTT |
8 |
BCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER |
NICKEL GOLD |
BOTTOM |
S-XBCC-B8 |
3 |
2.25 mm |
5.215 mm |
Not Qualified |
e4 |
20 |
260 |
5.215 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Melexis N V |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.72 mm |
3.9 mm |
e3 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||
|
Melexis N V |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.72 mm |
3.9 mm |
e3 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e0 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e0 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e0 |
240 |
3 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-G8 |
1 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0164 mA |
2.7 V |
2.7 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e4 |
245 |
2.9 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0166 mA |
2.7 V |
2.7 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e4 |
30 |
260 |
2.9 mm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.16SQ,40 |
1 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.008 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||||||||||
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.00004 mA |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
3.8 mm |
Not Qualified |
e0 |
4.925 mm |
||||||||||||||||||||||||||||||||||||||||
|
Impinj |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
8 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.6 V |
CHIP CARRIER, VERY THIN PROFILE |
LCC8,0.079,25 |
.9 mm |
95 Cel |
-25 Cel |
QUAD |
.4 Mbps |
S-XQCC-N8 |
1 |
.35 mm |
2 mm |
30 |
260 |
2 mm |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0011 mA |
5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.5 mm |
2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.6 |
CHIP CARRIER |
LCC8,.06SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N8 |
1 |
Not Qualified |
e4 |
30 |
260 |
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NXP Semiconductors |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-N8 |
1.75 mm |
3.9 mm |
4.9 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.0011 mA |
5 V |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.19 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G8 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
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|
Broadcom |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
1 |
3.607 mm |
5.85 mm |
e3 |
260 |
6.807 mm |
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|
Broadcom |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
1 |
3.607 mm |
5.85 mm |
e3 |
260 |
6.807 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
e3 |
260 |
2 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.