8 Other Function Telecom Interface ICs 419

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TLE8457ALEXUMA1

Infineon Technologies

TELECOM CIRCUIT

NO LEAD

8

SON

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

8 V

SMALL OUTLINE

.65 mm

TIN

DUAL

S-PDSO-N8

2A

1.15 mm

3 mm

e3

3 mm

SST12LP17E-QU8E

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

3

.6 mm

2 mm

e3

2 mm

TLE8457ASJXUMA1

Infineon Technologies

TELECOM CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

8 V

SMALL OUTLINE

1.27 mm

TIN

DUAL

R-PDSO-G8

3

1.75 mm

4 mm

e3

5 mm

AD8314ACPZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

UNSPECIFIED

YES

1

3 V

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e3

30

260

3 mm

LTC5596HDC#TRMPBF

Analog Devices

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e3

260

2 mm

LTC5596HDC#PBF

Analog Devices

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e3

2 mm

MC33660BEFR2

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

e3

40

260

4.9 mm

NCV7428D13R2G

Onsemi

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

12 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

2

1.72 mm

3.937 mm

e3

30

260

4.927 mm

AD8015ARZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

26 mA

5 V

SMALL OUTLINE

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

Not Qualified

e3

ATA8401C-6AQY66

Atmel

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

11.6 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1.05 mm

3 mm

Not Qualified

3 mm

ATA8401C-6AQY-66

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

.0116 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-55 Cel

MATTE TIN

DUAL

S-PDSO-G8

1.05 mm

3 mm

Not Qualified

e3

3 mm

MLX90109EDC-AAA-000-TU

Melexis N V

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.72 mm

3.9 mm

e3

260

4.9 mm

MAX3658AETA-T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

1

.026 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-XDSO-N8

1

.8 mm

3 mm

Not Qualified

e0

3 mm

MAX3658AETA+T

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

1

.026 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-XDSO-N8

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

OPA380AIDR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

.008 mA

5 V

3/5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

2

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

MAX3120EUA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

MAX3120EUA+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

SA612AD,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

OPA381AIDGKR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

AD8314ARMZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MLX90109EDC

Melexis N V

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2 mA

3.3/5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G8

Not Qualified

e3

AMMP-6532-TR2G

Broadcom

TELECOM CIRCUIT

BUTT

8

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

NICKEL GOLD

BOTTOM

S-XBCC-B8

3

2.25 mm

5.215 mm

Not Qualified

e4

20

260

5.215 mm

MLX90109CDC-AAA-000-TU

Melexis N V

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.72 mm

3.9 mm

e3

260

4.9 mm

MLX90109CDC-AAA-000-RE

Melexis N V

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.72 mm

3.9 mm

e3

260

4.9 mm

AD8314ACP-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

UNSPECIFIED

YES

1

3 V

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e0

240

3 mm

AD8314ACP-WP

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

UNSPECIFIED

YES

1

3 V

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e0

240

3 mm

AD8314ARM

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

240

3 mm

AD8314ARM-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

240

3 mm

AD8314ARMZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

260

3 mm

MAX1472AKA-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0164 mA

2.7 V

2.7

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP8,.1

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

Not Qualified

e4

245

2.9 mm

MAX1472AKA+T

Analog Devices

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0166 mA

2.7 V

2.7

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP8,.1

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

Not Qualified

e4

30

260

2.9 mm

MAX3120ESA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX3120ESA+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

MD0100DK6-G

Microchip Technology

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.16SQ,40

1 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

1 mm

4 mm

e3

4 mm

NCV7428MW5R2G

Onsemi

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

12 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

1

1 mm

3 mm

e3

30

260

3 mm

OPA2381AIDGKT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

2

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA380AIDRG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

.008 mA

5 V

3/5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

2

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

T555711-TAS

Atmel

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.00004 mA

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

3.8 mm

Not Qualified

e0

4.925 mm

IPJ-P6005-X2BT

Impinj

TELECOM CIRCUIT

OTHER

NO LEAD

8

VQCCN

SQUARE

UNSPECIFIED

YES

1

1.6 V

CHIP CARRIER, VERY THIN PROFILE

LCC8,0.079,25

.9 mm

95 Cel

-25 Cel

QUAD

.4 Mbps

S-XQCC-N8

1

.35 mm

2 mm

30

260

2 mm

OPA2381AIDGKTG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA381AIDGKT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

SE2568U-R

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-N8

.5 mm

2 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

SL3S4021FHKH

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

QCCN

SQUARE

PLASTIC/EPOXY

YES

1.8/3.6

CHIP CARRIER

LCC8,.06SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N8

1

Not Qualified

e4

30

260

MC33660EF

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N8

1.75 mm

3.9 mm

4.9 mm

OPA381AIDGKTG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

ACPL-C799-000E

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

105 Cel

-40 Cel

TIN

DUAL

R-PDSO-G8

1

3.607 mm

5.85 mm

e3

260

6.807 mm

ACPL-C799-500E

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

105 Cel

-40 Cel

TIN

DUAL

R-PDSO-G8

1

3.607 mm

5.85 mm

e3

260

6.807 mm

LTC5596IDC#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e3

260

2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.