8 Other Function Telecom Interface ICs 419

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TRF37B73IDSGR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e4

30

260

2 mm

LMV243BL

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

8

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B8

1.095 mm

1.514 mm

1.514 mm

UCC5341N

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BICMOS

3.3 V

IN-LINE

2.54 mm

70 Cel

0 Cel

DUAL

R-PDIP-T8

5.33 mm

7.62 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

9.78 mm

TRF37A73IDSGR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e4

30

260

2 mm

LMV243BLX

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

8

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B8

1.095 mm

1.514 mm

1.514 mm

TSLM1100

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

SIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

1.27 mm

70 Cel

0 Cel

SINGLE

R-PSIP-T8

6.86 mm

15.9 mm

TSLM1100SRA

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

SPECIAL SHAPE

70 Cel

0 Cel

SINGLE

R-PSSS-T8

Not Qualified

TCM1505P

Texas Instruments

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

DIP8,.3

Other Telecom ICs

2.54 mm

70 Cel

-20 Cel

DUAL

R-PDIP-T8

Not Qualified

UCC5341D

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4.89 mm

TCM1505JG

Texas Instruments

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP8,.3

Other Telecom ICs

2.54 mm

70 Cel

-20 Cel

DUAL

R-XDIP-T8

Not Qualified

ISO150AU-1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

2.65 mm

7.5 mm

Not Qualified

17.9 mm

OPA2381AIDRBTG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

2

1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA2381AIDRBT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

2

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

2

1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA381AIDRBR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

2

1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA2381AIDGKRG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA381AIDGKRG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

30

260

3 mm

SN65HVD1050-Q1

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

OPA381AIDRBT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

2

1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA2381AIDRBR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

DUAL

S-PDSO-N8

1 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

OPA381AIDRBRG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

2

1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA2381AIDGKR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

2

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

OPA2381AIDRBRG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

DUAL

S-PDSO-N8

1 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

OPA381AIDRBTG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

.0011 mA

5 V

3/5

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

2

1 mm

3 mm

Not Qualified

e4

30

260

3 mm

HMC310MS8G

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

1

3 V

3

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

SSOP8,.19

Network Interfaces

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

235

3 mm

LTC4403-1EMS8#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

260

3 mm

LTC4401-2EMS8#PBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC1957-1EMS8#TR

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LT1328CS8#TRPBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1.752 mm

3.9 mm

Not Qualified

e3

4.9 mm

LTC1757A-1EMS8#PBF

Analog Devices

TELECOM CIRCUIT

OTHER

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC4402-1EMS8

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LT5504EMS8#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LT5504EMS8#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

HMC310MS8GE

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

HTSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

40

260

3 mm

LT5504EMS8

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LTC4400-2EMS8

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LT1328CMS8#PBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

MATTE TIN

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

ADL5350ACPZ-R2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e3

30

260

3 mm

MAX3266CSA+T

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e3

4.9 mm

MAX3120CUA+T

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3658AETA+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

UNSPECIFIED

YES

1

.026 mA

3.3 V

3.3

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-XDSO-N8

1

.8 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3120EUA+T

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MAX3120CSA+

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

MAX3266CSA+

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

MAX3120ESA+T

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

MAX3120CUA+

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e3

30

260

3 mm

LTC4400-2EMS8#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

LT1328CS8

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G8

1

1.752 mm

3.899 mm

Not Qualified

e0

4.9025 mm

LTC4401-2EMS8#TR

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

e0

3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.