8 Other Function Telecom Interface ICs 419

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TZA3033U/T/C3	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N8				Not Qualified
TZA3043BT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	ECL		.047 mA	5 V	3.3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8				Not Qualified	e4
TEA1081TD	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
PCF5078T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.1 mm	3 mm	Not Qualified				3 mm
SA5222D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.012 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SA5212AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.033 mA	5 V	5	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T8	1	4.2 mm	7.62 mm	Not Qualified				9.5 mm
TZA3043T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
TZA3033T/C3	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
935201030118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
935051900118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
SL3S1202FTT,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		30	260	3 mm
935262927112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
935262664112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
933897010112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		40	250	9.5 mm
SA5212AFE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	BIPOLAR		.033 mA	5 V	5	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel		DUAL	R-GDIP-T8	1	5.08 mm	7.62 mm	Not Qualified				9.955 mm
TEA1081T/C2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
935030770602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e4			9.5 mm
MC33660BEF	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-N8	3	1.75 mm	3.9 mm		e3	40	260	4.9 mm
MF0ICU1101W/V4D	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES							UNCASED CHIP							UPPER	R-XUUC-N8				Not Qualified
MC33660EFR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8	3	1.75 mm	3.9 mm		e3			4.9 mm
MF0ICU1001W/V4D	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES							UNCASED CHIP							UPPER	R-XUUC-N8				Not Qualified
SA602AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e4			9.5 mm
SA602AD/N,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
SA602AN,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	9.5 mm
SA602AD/N,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm					4.9 mm
IRMS6409	Infineon Technologies	TELECOM CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-25 Cel		SINGLE	R-XSMA-X8				Not Qualified
IRMS6419	Infineon Technologies	TELECOM CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS			5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-25 Cel		SINGLE	R-XSMA-X8				Not Qualified
IRM6002	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS					MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	R-XSMA-X8				Not Qualified	e0
LH2559AAC-TR	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G8		2.13 mm	5.59 mm	Not Qualified				5.715 mm
LH2559AC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G8				Not Qualified
TDA4065	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			5 V	5	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8				Not Qualified	e0
TDA4065-X	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8				Not Qualified	e0
IRM6000	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS					MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	R-XSMA-X8				Not Qualified	e0
IRMT6409	Infineon Technologies	TELECOM CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-25 Cel		SINGLE	R-XSMA-X8				Not Qualified
PSB6620	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		22 mA		TIP-RING/8.8/26	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8				Not Qualified	e0
WM72016-6-DG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.025 mA	2.5 V	2.5	SMALL OUTLINE	SOLCC8,.12,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N8				Not Qualified
TLE8457BLE	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL	S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLE8457ALE	Infineon Technologies	TELECOM CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL	S-PDSO-N8	2A	1.15 mm	3 mm		e3			3 mm
TLE8457BSJ	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm			TIN	DUAL	R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
TLE8457ASJ	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm			TIN	DUAL	R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
AP22811AM8-13	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8		1.1 mm	2.95 mm		e3	30	260	3 mm
AP22811BM8-13	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G8		1.1 mm	2.95 mm		e3	30	260	3 mm
AP22804AM8-13	Diodes Incorporated	TELECOM CIRCUIT		GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8		1.1 mm	3 mm		e3	30	260	3 mm
MAX3120CUA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX3120EUA-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX3120CUA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX3120CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3658AETA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.