8 Other Function Telecom Interface ICs 419

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX14628ETA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3.6 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		S-PDSO-N8	1	.8 mm	2 mm		e3	30	260	2 mm
SX072	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3.3 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T8				Not Qualified
NLHVQ001USG	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		10 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		.9 mm	2 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
SX071	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3.3 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T8				Not Qualified
N24RF16DTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.2 mm	3 mm		e4	30	260	4.4 mm
N24RF64DWPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE	SOP8,.25		1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02648 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TCP-3118H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.32 mm	.652 mm			NOT SPECIFIED	NOT SPECIFIED	.834 mm
TCP-3033H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm					.879 mm
NLHVQ011USG	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				20 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	.9 mm	2 mm		e3	30	260	2.3 mm
N24RF16DWPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V		SMALL OUTLINE			1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
LC898214XD-MH	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B8	1	.33 mm	1.15 mm		e1	30	260	2.37 mm
LC898214XC-MH	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B8	1	.45 mm	1.15 mm		e1	30	260	2.37 mm
TCP-3012H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.639 mm	.722 mm					.879 mm
N24RF16EDTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.2 mm	3 mm			NOT SPECIFIED	260	4.4 mm
SX073	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3.3 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T8				Not Qualified
TCP-3027H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm					.879 mm
N24RF64DTET3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8		1.2 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	4.4 mm
N24RF64DWET3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					2.5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
N24RF64EDTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel		DUAL	.053 Mbps	R-PDSO-G8	1	1.2 mm	3 mm			NOT SPECIFIED	260	4.4 mm
TCP-3027N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm					.879 mm
N24RF64DTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02648 Mbps	R-PDSO-G8	1	1.2 mm	3 mm		e4	30	260	6.4 mm
NCV7428D1L3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm	3.937 mm		e3	30	260	4.927 mm
NCV7428MW3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7428MWL5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7428MWL3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
NCV7428D1L5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm	3.937 mm		e3	30	260	4.927 mm
LRI2K-MBTG/3	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
L3845D1013TR	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	70 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
LRI2K-MBTG/1	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
TEA7530DP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.03 mA	3 V	3	IN-LINE	DIP8,.3	Telephone Circuits	2.54 mm	70 Cel	-20 Cel	TIN LEAD	DUAL		R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified	e0
LRI2K-MBTG/4	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
LRIS2K-MBTG	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
LRI2K-MBTG/2	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
L3845B	STMicroelectronics	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				20 V	20	IN-LINE	DIP8,.3	Analog Transmission Interfaces	2.54 mm	70 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified	e3
LRI64-MBTG/XXX	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
LRIS2K-MBTG/3	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
LRIS2K-MBTG/1	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
L3845D	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				20 V	20	SMALL OUTLINE	SOP8,.25	Analog Transmission Interfaces	1.27 mm	70 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
LB1026AB	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		1 mA		2/15	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	50 Cel	0 Cel		DUAL		R-PDIP-T8				Not Qualified
LB1006AB	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		.9 mA		TIP-RING VOLTAGE	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel	-20 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T8				Not Qualified	e0
LRIS2K-MBTG/4	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
STPAC01F1	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	UNSPECIFIED	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-XBGA-B8		.715 mm	1.57 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	1.57 mm
LRIS2K-MBTG/2	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8				Not Qualified
TEA7530FP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.03 mA	3 V	3	SMALL OUTLINE	DIP8,.3	Telephone Circuits	1.27 mm	70 Cel	-20 Cel	TIN LEAD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
STPAC01F2	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B8		.715 mm	1.57 mm	Not Qualified				1.57 mm
TDA7212	STMicroelectronics	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3 V		IN-LINE			2.54 mm	85 Cel	-20 Cel	TIN LEAD	DUAL		R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified	e0
TEA1081T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
933897020112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.