Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.031 mA |
3 V |
3 |
SMALL OUTLINE |
SOP28,.4 |
Codecs |
1.27 mm |
85 Cel |
-40 Cel |
.75 dB |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
240 |
17.9 mm |
YES |
|||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
26 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
240 |
4.9 mm |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-G24 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G6 |
1 |
1 mm |
1.25 mm |
Not Qualified |
e0 |
2 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.031 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Codecs |
.65 mm |
85 Cel |
-40 Cel |
.75 dB |
MATTE TIN |
DUAL |
R-PDSO-G28 |
1 |
1.2 mm |
16-BIT |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
YES |
|||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
e0 |
7.8 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
260 |
7.8 mm |
|||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.031 mA |
3 V |
3 |
SMALL OUTLINE |
SOP28,.4 |
Codecs |
1.27 mm |
105 Cel |
-40 Cel |
.75 dB |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
240 |
17.9 mm |
YES |
|||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.031 mA |
3 V |
3 |
SMALL OUTLINE |
SOP28,.4 |
Codecs |
1.27 mm |
85 Cel |
-40 Cel |
.75 dB |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
17.9 mm |
YES |
|||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.031 mA |
3 V |
3 |
SMALL OUTLINE |
SOP28,.4 |
Codecs |
1.27 mm |
105 Cel |
-40 Cel |
.75 dB |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
240 |
17.9 mm |
YES |
|||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
15 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
UNCASED CHIP |
85 Cel |
-25 Cel |
UPPER |
R-XUUC-N15 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
e0 |
7.8 mm |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
17 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
95 Cel |
-40 Cel |
UPPER |
R-XUUC-N17 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
24 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP24,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G24 |
1.2 mm |
4.4 mm |
Not Qualified |
e0 |
7.8 mm |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
.0129 mA |
2.7 V |
3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
TIN LEAD |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e0 |
240 |
3 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0125 mA |
3 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25 |
Modems |
.65 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
260 |
17.9 mm |
||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
OTHER |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63X.87,20 |
Other Telecom ICs |
.5 mm |
70 Cel |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G128 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
240 |
20 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
7 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.5 V |
UNCASED CHIP |
85 Cel |
-55 Cel |
GOLD |
UPPER |
R-XUUC-N7 |
Not Qualified |
e4 |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.00688 mA |
3.3 V |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Telecom ICs |
.65 mm |
105 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.045 mA |
3 V |
3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.89 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
.0087 mA |
5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
|||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
25 mA |
3 V |
3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.89 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.045 mA |
3 V |
3/5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.25 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.89 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.7 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
30 |
260 |
2.9 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e3 |
9.89 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
36 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
SMALL OUTLINE, SHRINK PITCH |
.8 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G36 |
1 |
2.64 mm |
7.495 mm |
Not Qualified |
e3 |
15.415 mm |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.7 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
e4 |
30 |
260 |
2.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0087 mA |
5 V |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
9.7 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
2.85 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B6 |
1 |
.69 mm |
.865 mm |
Not Qualified |
e2 |
30 |
260 |
1.27 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
308 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA308,14X22,32 |
.8 mm |
110 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B308 |
1.4 mm |
12 mm |
30 |
260 |
18 mm |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
20 |
240 |
17.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
e3 |
30 |
260 |
9.7 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G28 |
1 |
1.1 mm |
4.4 mm |
e3 |
30 |
260 |
9.7 mm |
|||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B12 |
.611 mm |
.722 mm |
1.179 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
3.3 V |
IN-LINE |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
10 V |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.5 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
.9 mm |
2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.3 mm |
||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
BALL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.42 mm |
85 Cel |
-30 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B4 |
1 |
.345 mm |
.609 mm |
e4 |
260 |
.626 mm |
||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
BALL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.42 mm |
85 Cel |
-30 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B4 |
1 |
.345 mm |
.609 mm |
e4 |
260 |
.626 mm |
||||||||||||||||||||||||||||||||||||||||
Onsemi |
COMMERCIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
25 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Other Telecom ICs |
.635 mm |
50 Cel |
0 Cel |
DUAL |
R-PDSO-G20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
3.3 V |
IN-LINE |
85 Cel |
-40 Cel |
DUAL |
R-PDIP-T8 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
BALL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B12 |
.611 mm |
.722 mm |
1.179 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Onsemi |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
50 Cel |
0 Cel |
DUAL |
R-PDSO-G20 |
2 mm |
5.3 mm |
Not Qualified |
7.2 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B20 |
.65 mm |
2.23 mm |
2.58 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.