RECTANGULAR Other Function Telecom Interface ICs 2,400+

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

AD6439-2BS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

R-PQFP-G128

2.35 mm

14 mm

Not Qualified

20 mm

LT1328CS8#TR

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G8

1.752 mm

3.9 mm

Not Qualified

e0

4.9 mm

ADM1041ARQ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e0

240

8.6614 mm

LTC4400-1ES6#TR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

LTC4400-1ES6#TRPBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

30

260

2.9 mm

ADL5601ARKZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

FLAT

3

LSOF

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE

1.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-F3

1

1.6 mm

2.45 mm

Not Qualified

e3

260

4.5 mm

LTP5902IPC-IPRB1C1#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

XMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

3.6 V

MICROELECTRONIC ASSEMBLY

MODULE66(UNSPEC)

1 mm

85 Cel

-40 Cel

QUAD

.25 Mbps

R-PXMA-N66

3.54 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

42 mm

LTM9004CV-AC#PBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

204

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

GOLD

BOTTOM

R-PBGA-N204

2.97 mm

15 mm

Not Qualified

e4

22 mm

LTC1757-2EMS

Analog Devices

TELECOM CIRCUIT

OTHER

GULL WING

10

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-G10

Not Qualified

e0

AD6140ARSRL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1.98 mm

5.29 mm

Not Qualified

e0

7.2 mm

ADMP510ACEZ-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

TLGA

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY, THIN PROFILE

1.22 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B3

1.08 mm

2.5 mm

NOT SPECIFIED

NOT SPECIFIED

3.35 mm

LT1328CS8#PBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.752 mm

3.899 mm

Not Qualified

e3

30

260

4.9025 mm

AD7011ARS-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

e0

8.2 mm

AD7010ARS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP24,.3

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

e0

8.2 mm

LTM9004CV-AA#PBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

204

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

GOLD

BOTTOM

R-PBGA-N204

2.97 mm

15 mm

Not Qualified

e4

22 mm

LTP5901IPC-IPRC1C1#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

XMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

3.6 V

MICROELECTRONIC ASSEMBLY

MODULE66(UNSPEC)

1 mm

85 Cel

-40 Cel

QUAD

.25 Mbps

R-PXMA-N66

3.54 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

42 mm

LTP5902IPC-IPRA1C1#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

XMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

3.6 V

MICROELECTRONIC ASSEMBLY

MODULE66(UNSPEC)

1 mm

85 Cel

-40 Cel

QUAD

.25 Mbps

R-PXMA-N66

3.54 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

42 mm

LTC4401-1ES6#PBF

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

70 Cel

0 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e3

30

260

2.9 mm

HMC757

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

7 V

UNCASED CHIP

85 Cel

-55 Cel

UPPER

R-XUUC-N4

Not Qualified

AD1803JRU

Analog Devices

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Modems

.65 mm

70 Cel

0 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

e0

7.8 mm

AD974BR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

3

2.65 mm

7.5 mm

Not Qualified

e0

240

17.9 mm

LTP5902IPC-IPRC1C1#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

XMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

3.6 V

MICROELECTRONIC ASSEMBLY

MODULE66(UNSPEC)

1 mm

85 Cel

-40 Cel

QUAD

.25 Mbps

R-PXMA-N66

3.54 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

42 mm

LTP5902IPC-WHMAXXX#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

DIE

RECTANGULAR

UNSPECIFIED

YES

3.6 V

UNCASED CHIP

DIE OR CHIP

85 Cel

-40 Cel

UPPER

.25 Mbps

R-XUUC-N66

5.5 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

37.5 mm

HMC7891

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

4

RECTANGULAR

UNSPECIFIED

NO

1

8 V

FLANGE MOUNT

85 Cel

-40 Cel

UNSPECIFIED

R-XXFM-X4

1

AD61009ARS

Analog Devices

TELECOM CIRCUIT

OTHER

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

2 mm

5.3 mm

Not Qualified

e0

240

7.2 mm

ADM1041AARQZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.7526 mm

3.9116 mm

Not Qualified

e3

260

8.6614 mm

HMC-ABH264

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

6

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-55 Cel

UPPER

R-XUUC-N6

Not Qualified

NOT APPLICABLE

NOT APPLICABLE

AD7013ARS-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

SMALL OUTLINE, SHRINK PITCH

SOP28,.3

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G28

2 mm

5.3 mm

Not Qualified

e0

10.2 mm

ADL5506WACBZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,16

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.56 mm

.79 mm

e1

30

260

1.19 mm

LTC4400-1ES6

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

6

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G6

1

1 mm

1.6 mm

Not Qualified

e0

2.9 mm

LTP5901IPC-WHMAXXX#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

DIE

RECTANGULAR

UNSPECIFIED

YES

3.6 V

UNCASED CHIP

DIE OR CHIP

85 Cel

-40 Cel

UPPER

.25 Mbps

R-XUUC-N66

5.5 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

42 mm

LTP5901IPC-IPRB1C1#PBF

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

66

XMA

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

3.6 V

MICROELECTRONIC ASSEMBLY

MODULE66(UNSPEC)

1 mm

85 Cel

-40 Cel

QUAD

.25 Mbps

R-PXMA-N66

3.54 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

42 mm

AD73311LARZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0125 mA

3 V

3

SMALL OUTLINE

SOP20,.4

Modems

1.27 mm

105 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e3

260

12.8 mm

HMC554

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

3

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N3

Not Qualified

e4

AD8311ACBZ-P7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

.0129 mA

3 V

3/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B6

1

.675 mm

.95 mm

Not Qualified

e1

30

260

1.45 mm

AD8320ARPZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

105 mA

12 V

SMALL OUTLINE

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G20

5

Not Qualified

e3

260

ADF7012BRU

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

e0

7.8 mm

AD8312ACPZ-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B6

.675 mm

.95 mm

Not Qualified

e1

40

260

1.45 mm

AD9879BSZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK

QFP100,.7X.9

Modems

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G100

3

3.4 mm

14 mm

Not Qualified

e3

260

20 mm

HMC570

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

7

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.5 V

UNCASED CHIP

85 Cel

-55 Cel

GOLD

UPPER

R-XUUC-N7

Not Qualified

e4

ADF7011BRUZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G24

1

1.2 mm

4.4 mm

Not Qualified

e3

260

7.8 mm

ADF7012BRU-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

e0

7.8 mm

AD73322LYR-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.031 mA

3 V

3

SMALL OUTLINE

SOP28,.4

Codecs

1.27 mm

105 Cel

-40 Cel

.75 dB

TIN LEAD

DUAL

R-PDSO-G28

3

2.65 mm

16-BIT

7.5 mm

Not Qualified

e0

240

17.9 mm

YES

AD73322LAR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.031 mA

3 V

3

SMALL OUTLINE

SOP28,.4

Codecs

1.27 mm

85 Cel

-40 Cel

.75 dB

TIN LEAD

DUAL

R-PDSO-G28

3

2.65 mm

16-BIT

7.5 mm

Not Qualified

e0

240

17.9 mm

YES

AD73311LAR-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0125 mA

3 V

3

SMALL OUTLINE

SOP20,.4

Modems

1.27 mm

105 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e0

240

12.8 mm

AD9877ABS

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK

QFP100,.7X.9

Modems

.65 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

R-PQFP-G100

3

3.4 mm

14 mm

Not Qualified

e0

240

20 mm

AD8315ACPZ-REEL7

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0129 mA

2.7 V

3/5

SMALL OUTLINE

SOLCC8,.08,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

MATTE TIN

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e3

30

260

3 mm

AD608AR

Analog Devices

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE

1.27 mm

85 Cel

-25 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.75 mm

3.9 mm

Not Qualified

e0

240

9.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.