RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TDA5255XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

9.7 mm

TDA5101XUMA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

5 mm

TDA5251

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

260

9.7 mm

BGS12SN6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.6 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

Tin (Sn)

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

e3

NOT SPECIFIED

NOT SPECIFIED

1.1 mm

TDA7110

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

260

5 mm

BGS12SL6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

.32 mm

.7 mm

NOT SPECIFIED

NOT SPECIFIED

1.1 mm

TDA7255VXUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N40

.9 mm

5.5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

BGM1032N7

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

TDA5200DUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

9.7 mm

TDA5221XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TDA7255V

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

2.5/5

CHIP CARRIER, VERY THIN PROFILE

LCC40,.22X.26,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N40

.9 mm

5.5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

TDA5102XUMA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

5 mm

TDA5220XUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

9.7 mm

TDA5111

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3 V

2.1/4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

Not Qualified

5 mm

TDA5211XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TDA5660P

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

40 mA

11 V

11

IN-LINE

DIP18,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

e0

BGS12S3N6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

MOS

2.6 V

CHIP CARRIER

.35 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.65 mm

.98 mm

BGM1033N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

TDA5251F1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

2.5/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

BGS14PN10E6327XTSA1/SAMPLE

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

10

VQCCN

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.85 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N10

.4 mm

1.1 mm

1.5 mm

TDA5204

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0064 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

235

9.7 mm

TDA5102XT

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

5 mm

TDA5210

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0077 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

TIN

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e3

9.7 mm

TDA7200

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0077 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

260

9.7 mm

TDA5200XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

BGS14PN10

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

10

VQCCN

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.85 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N10

1

.4 mm

1.1 mm

1.5 mm

TDA5664

Infineon Technologies

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

29 mA

5 V

5

IN-LINE

DIP14,.3

Other Telecom ICs

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T14

Not Qualified

e0

TDA5100XT

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

BGM1034N7

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N7

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

TDA5250

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

2.1/5.5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

Not Qualified

e3

260

9.7 mm

TDA5251XUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TLE8457BSJ

Infineon Technologies

TELECOM CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

8 V

SMALL OUTLINE

1.27 mm

TIN

DUAL

R-PDSO-G8

3

1.75 mm

4 mm

e3

5 mm

TDA5103AHTMA2

Infineon Technologies

OTHER

GULL WING

10

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

BIPOLAR

9.5 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP10,.19,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G10

Not Qualified

TDA5225

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.015 mA

3.3 V

3.3,5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e4

260

9.7 mm

TDA7110XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

5 mm

TDA5240XUMA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

e4

9.7 mm

TDA5100

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.008 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-25 Cel

TIN

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

e3

260

5 mm

BGS13PN10

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

1.5 mm

TLE8457ASJ

Infineon Technologies

TELECOM CIRCUIT

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

AEC-Q100

8 V

SMALL OUTLINE

1.27 mm

TIN

DUAL

R-PDSO-G8

3

1.75 mm

4 mm

e3

5 mm

TDA5101

Infineon Technologies

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

260

5 mm

TDA5200

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0048 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

260

9.7 mm

TDA5250XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

NOT SPECIFIED

NOT SPECIFIED

9.7 mm

TDA5252XT

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

9.7 mm

TDA5221

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.0081 mA

5 V

5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

260

9.7 mm

TDA5252G1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

9.7 mm

BGS12PN10

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

10

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.85 V

SMALL OUTLINE, VERY THIN PROFILE

.4 mm

85 Cel

-30 Cel

DUAL

R-PDSO-N10

1

.4 mm

1.1 mm

1.5 mm

TDA5252

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

9.7 mm

BGS12AL7-6

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.48 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

1.4 mm

1.26 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.