RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Peak Reflow Temperature (C)	Length
PEB2045C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40							Not Qualified		e0
PEB2235-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC	NO		CMOS		220 mA	5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T28				T-1(DS1)	CEPT PCM-30/E-1		Not Qualified		e0
PSB4451V1.1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G28			1.2 mm			4.4 mm	Not Qualified				9.7 mm
PSB4500-P	Infineon Technologies		OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		140 mA		1.6/7.5	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T20							Not Qualified		e0
PEF3035-N	Infineon Technologies	TELECOM CIRCUIT		J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1						CHIP CARRIER			1.27 mm							QUAD	R-PQCC-J28			3.8 mm			8.95 mm	Not Qualified				14.05 mm
PEB2046C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40							Not Qualified		e0
PEB2235A2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28				T-1(DS1)	CEPT PCM-30/E-1		Not Qualified		e0
BGA924N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel				-40 Cel		DUAL	R-PDSO-N6		1	.4 mm			.7 mm					1.1 mm
IRMS5000	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS			5 V		MICROELECTRONIC ASSEMBLY				85 Cel				-25 Cel		SINGLE	R-XSMA-N6							Not Qualified
PMB2728-H	Infineon Technologies	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			.65 mm							QUAD	R-PQFP-G100			3.4 mm			14 mm	Not Qualified				20 mm
PEB2070-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC	NO		CMOS					IN-LINE	DIP24,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T24							Not Qualified		e0
PMB2205S(V1.1)	Infineon Technologies		OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				33 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Other Telecom ICs	.635 mm	85 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20							Not Qualified		e0
V23815-K1306-M230	Infineon Technologies	TELECOM CIRCUIT		GULL WING	72		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		FIBER OPTIC										UNSPECIFIED	R-XXFO-G72							Not Qualified
PEF2023	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			40 V		SMALL OUTLINE			1.27 mm	85 Cel				-40 Cel	TIN LEAD	DUAL	R-PDSO-G14			1.75 mm			4 mm	Not Qualified		e0		8.75 mm
BGA924N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel				-40 Cel	TIN	DUAL	R-PDSO-N6		1	.4 mm			.7 mm			e3		1.1 mm
V23815-U1306-M130	Infineon Technologies	TELECOM CIRCUIT		GULL WING	72		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		FIBER OPTIC										UNSPECIFIED	R-XXFO-G72							Not Qualified
BGAU1A10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel				-30 Cel		BOTTOM	R-XBCC-B10		1	.65 mm			1.1 mm					1.5 mm
PMB2205	Infineon Technologies		OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				.048 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	85 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20							Not Qualified		e0
PEB22710	Infineon Technologies	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm							DUAL	R-PDSO-G20			3.7 mm			11 mm	Not Qualified
FOA1151A1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		57 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.635 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16							Not Qualified		e0
PEB2025-N	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	5,-12/-60	CHIP CARRIER	LDCC28,.4X.6	Digital Transmission Interfaces	1.27 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	QUAD	R-PQCC-J28	S		3.8 mm			8.95 mm	Not Qualified	2 Amp	e0		14.05 mm
PSB4595	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V	4.25,5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel				0 Cel	TIN LEAD	DUAL	R-PDSO-G24			1.2 mm			4.4 mm	Not Qualified		e0		7.8 mm
PEB2070B1N	Infineon Technologies		COMMERCIAL	J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LDCC28,.4X.6	Other Telecom ICs	1.27 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	QUAD	R-PQCC-J28							Not Qualified		e0
BGA8V1BN6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel				-40 Cel		DUAL	R-PDSO-N6		1	.4 mm			.7 mm					1.1 mm
PEF2045C	Infineon Technologies		INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS		10 mA	5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40							Not Qualified		e0
IRMT6409	Infineon Technologies	TELECOM CIRCUIT	OTHER	UNSPECIFIED	8		RECTANGULAR	UNSPECIFIED	NO	1	BICMOS			3 V		MICROELECTRONIC ASSEMBLY				85 Cel				-25 Cel		SINGLE	R-XSMA-X8							Not Qualified
PMB2200-T	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.048 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	85 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20			2.65 mm			7.6 mm	Not Qualified		e0		12.8 mm
PSB6620	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		22 mA		TIP-RING/8.8/26	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8							Not Qualified		e0
PMB2200-S	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.048 mA	5 V	5	SMALL OUTLINE	SSOP20(UNSPEC)	Other Telecom ICs		85 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G24							Not Qualified		e0
PBA31301/3S	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	34	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			2.8 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel				-10 Cel		BOTTOM	R-PBGA-B34			1.6 mm			10.2 mm	Not Qualified				14 mm
BCM20713A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel				-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B50		3	.6 mm			4 mm			e1	260	4.5 mm
BCM20715A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B42			.6 mm			2.509 mm					3.019 mm
BCM43241FKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B208			1.05 mm			7 mm					9 mm
BCM43455HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B140			.6 mm			4.47 mm					5.27 mm
BCM43241XKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B208			1.05 mm			7 mm					9 mm
BCM4334XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	109	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B109			.55 mm			4.08 mm					4.48 mm
BCM4329GKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B182			.55 mm			5.62 mm					6.57 mm
BCM4334WKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	109	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B109			.55 mm			4.08 mm					4.48 mm
BCM43241DKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B208			1.05 mm			7 mm					9 mm
BCM4354XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel				-30 Cel		BOTTOM	R-PBGA-B395			.33 mm			4.87 mm					7.67 mm
BCM43438KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel				-30 Cel		BOTTOM	R-PBGA-B63			.55 mm			2.87 mm					4.87 mm
BCM4330GKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel				-30 Cel		BOTTOM	R-PBGA-B225			.41 mm			4.89 mm					5.33 mm
BCM43241ZKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B208			1.05 mm			7 mm					9 mm
BCM20710A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B50			.6 mm			4 mm					4.5 mm
BCM4329EKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B182			.55 mm			5.62 mm					6.57 mm
WM72016-6-DG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.025 mA	2.5 V	2.5	SMALL OUTLINE	SOLCC8,.12,25	Other Telecom ICs	.635 mm	85 Cel				-40 Cel		DUAL	R-PDSO-N8							Not Qualified
BCM4354XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-30 Cel		BOTTOM	R-PBGA-B192			.55 mm			4.87 mm					7.67 mm
BCM88335L2CUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel				-40 Cel		BOTTOM	R-PBGA-B145			.55 mm			4.87 mm					5.413 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.