RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

MC33742SPEG

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.045 mA

5.5/18

SMALL OUTLINE

SOP28,.4

Network Interfaces

1.27 mm

125 Cel

-40 Cel

TIN

DUAL

1 Mbps

R-PDSO-G28

3

Not Qualified

e3

40

260

HT2DC20S20/F,122

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

SPECIAL SHAPE

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

UNSPECIFIED

R-PXSS-N

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HT2DC20S20

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

SPECIAL SHAPE

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

UNSPECIFIED

R-PXSS-N

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HTMS8301FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

3

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B3

Not Qualified

HT1ICS3002W/V6F

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N

HTMS8301FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC2(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

MC13055D

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

9.9 mm

HTMS8101FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

CGY2110CU

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

GAAS

.1 mA

5.7 V

5.7

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-10 Cel

UPPER

R-XUUC-N13

Not Qualified

HTMS1301FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC2(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTMS1201FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS8001FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTSFCH4801EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

METAL

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-MUUC-N2

Not Qualified

HTMS1201FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

MC13155D

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

sop16,.24

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

4.9 mm

9.9 mm

JN5139-001-M/02R1V

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

41

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N41

18 mm

41 mm

HT1MOA3S30/E/3

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

2.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

Not Qualified

HT2ICS2002W/V9F

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

HT1MOA4S30/E/3

NXP Semiconductors

TELECOM CIRCUIT

OTHER

UNSPECIFIED

RECTANGULAR

PLASTIC/EPOXY

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-25 Cel

UNSPECIFIED

R-PXMA-X

HTSICH4801EW/V7

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N5

HTMS1301FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

2

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B2

Not Qualified

HT2DC20S20/F

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.5 V

UNCASED CHIP

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-PUUC-N2

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HTMS8001FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

MF0ICU1001W/V4D

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

8

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

R-XUUC-N8

Not Qualified

HTMS8001FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Not Qualified

HTMS1301FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

3

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B3

Not Qualified

HTMS8201FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

HT2MOA3S20/E/3

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

HYBRID

2.8 V

MICROELECTRONIC ASSEMBLY

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

Not Qualified

HTMS1001FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTMS8201FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTMS8301FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HT2MOA3S20/E/1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

HYBRID

2.8 V

MICROELECTRONIC ASSEMBLY

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

Not Qualified

HTMS1201FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

MF0MOA4U10/D

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

DUAL

R-XDMA-N4

Not Qualified

MC33111D

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

9.9 mm

HTMS1001FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS1001FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

HTCICC6402FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Not Qualified

MC145446AFW

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-20 Cel

DUAL

R-PDSO-G28

2.65 mm

7.51 mm

17.9 mm

HT1MOA2S30/E/3

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.5 V

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N

HTSFCH5601EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

METAL

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-MUUC-N2

Not Qualified

HTMS8101FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Not Qualified

HTMS1101FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

HT1DC20S30/F

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

PLASTIC/EPOXY

YES

1

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

R-PXSS-N

Not Qualified

SL2S5402FUD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

SA606D

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

40

260

12.8 mm

SA606DK/03,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

6.5 mm

SA607DK-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e0

6.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.