RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SL3S1203FUF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

PCD6002H/F1-T

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

80

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

FLATPACK

.8 mm

70 Cel

-25 Cel

QUAD

R-PQFP-G80

3.2 mm

14 mm

Not Qualified

20 mm

TZA3054AHN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

.026 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.12X.16,20

ATM/SONET/SDH ICs

.5 mm

85 Cel

-40 Cel

TIN/NICKEL PALLADIUM GOLD

QUAD

R-PQCC-N20

1 mm

3 mm

Not Qualified

e3/e4

4 mm

TEA1081T/C2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

935263011118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10.3 mm

NE571F

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

4.8 mA

6 V

IN-LINE

70 Cel

0 Cel

DUAL

R-GDIP-T16

Not Qualified

TEA1083AT

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

0 V

.004 mA

3.6 V

3.6

SMALL OUTLINE

SOP16,.4

Telecom Signaling Circuits

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

10.3 mm

SA5753K

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

935030770602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

6 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T8

4.2 mm

7.62 mm

Not Qualified

e4

9.5 mm

935241000118

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-10 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA575AD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-G20

Not Qualified

935263881118

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G28

2 mm

5.3 mm

Not Qualified

10.2 mm

HTSICC5601EW/C7

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N5

935297767115

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1 mm

2.5 mm

3.5 mm

MC3356DW

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

12.8 mm

HTMS1001FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTMS1301FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

MC33660BEF

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N8

3

1.75 mm

3.9 mm

e3

40

260

4.9 mm

HT1MOA3S30/E/1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

2.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

Not Qualified

HTMS8101FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N3

Not Qualified

MC33742PEG/R2

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

5.5/18

SMALL OUTLINE

Network Interfaces

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G28

3

2.65 mm

7.5 mm

Not Qualified

e3

40

260

17.925 mm

HTSH4801ETK

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-N2

1

HTMS1001FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Not Qualified

HTMS1101FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS8201FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Not Qualified

HTSH5601ETK

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

85 Cel

-25 Cel

DUAL

R-PDSO-N2

1

HTMS1101FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Not Qualified

MMG30271BT1

NXP Semiconductors

TELECOM CIRCUIT

FLAT

3

LSOF

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE

1.5 mm

SINGLE

R-PSSO-F3

1

1.6 mm

2.5 mm

40

260

4.5 mm

935297767135

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1 mm

2.5 mm

3.5 mm

MMG30301BT1

NXP Semiconductors

TELECOM CIRCUIT

FLAT

3

LSOF

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE

1.5 mm

SINGLE

R-PSSO-F3

1

1.6 mm

2.5 mm

40

260

4.5 mm

HTMS1101FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

MC33742PEG

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.045 mA

5.5/18

SMALL OUTLINE

SOP28,.4

Network Interfaces

1.27 mm

125 Cel

-40 Cel

TIN

DUAL

1 Mbps

R-PDSO-G28

3

Not Qualified

e3

40

260

HTCICC6403FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Not Qualified

HT1DC20S30

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

PLASTIC/EPOXY

YES

1

SPECIAL SHAPE

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

UNSPECIFIED

R-PXSS-N

Not Qualified

MC13055P

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

YES

1

IN-LINE

DIP16,.3

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T16

4.4 mm

7.62 mm

19.175 mm

MF0ICU1101W/V4D

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

8

RECTANGULAR

UNSPECIFIED

YES

UNCASED CHIP

UPPER

R-XUUC-N8

Not Qualified

HTMS1201FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Not Qualified

HTSICC4801EW/C7

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N5

HTMS8301FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

2

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B2

Not Qualified

HTMS1201FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTSICH5601EW/V7

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N5

HTSMOH4801EV

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N2

NOT APPLICABLE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HTMS1101FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTSMOH5601EV

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-PUUC-N2

NOT APPLICABLE

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HT2MOA2S20/E/3

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

DIE

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-PUUC-N2

MC33660EFR2

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

e3

4.9 mm

MC33742SPEG/R2

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

5.5/18

SMALL OUTLINE

Network Interfaces

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G28

3

2.65 mm

7.5 mm

Not Qualified

e3

40

260

17.925 mm

HT1ICS3002W/V9F

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.