RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA647DH,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e4			6.5 mm
TEA1094ATD	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4.4 mA	5 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
SA5212AD,623	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		40	260	4.9 mm
TEA1094AM	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		4.4 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G24		2 mm	5.3 mm	Not Qualified				8.2 mm
SA5223D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SA575AD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL	R-PDSO-G20				Not Qualified
PCA1070T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0001 mA	5 V	3/5	SMALL OUTLINE	SOP24,.4	Telephone Circuits	1.27 mm	60 Cel	-10 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
PCD3316T-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		2.3 mA	3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e4			10.3 mm
UAA3202M/V1/S5	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified				7.2 mm
TEA1081	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	75 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e3/e4			9.5 mm
SA5212AD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		40	260	4.9 mm
SA647DH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified	e4			6.5 mm
NE5750D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
TEA1093TD	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			140 mA	3.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
NE575DK-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G20				Not Qualified
TDA8010M-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel	-20 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
935262597112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SL3S1204FTB0X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6				Not Qualified
TZA3044BT/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
NE5750N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE				70 Cel	0 Cel		DUAL	R-PDIP-T24				Not Qualified
WLAN8101H	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	38	HLGA	RECTANGULAR	UNSPECIFIED	YES	1				3.85 V		GRID ARRAY, HEAT SINK/SLUG	LGA38(UNSPEC)		.35 mm	85 Cel	-40 Cel		BOTTOM	R-XLGA-N38		.685 mm	3 mm					4 mm
SL3S1013FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6	1	.5 mm	1 mm				260	1.45 mm
TZA3033T-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
PCF5075-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
BGB110	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				50 Cel	-10 Cel		UNSPECIFIED	R-XXMA-N34				Not Qualified
SA647DH-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
TEA1085T-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	0 V		4.2 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
BGW211	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	68	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1	BICMOS					CHIP CARRIER, HEAT SINK/SLUG							QUAD	R-XQCC-N68
TEA1094	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	e3/e4			35.5 mm
SA647DH,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified				6.5 mm
TEA1081T-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
933897020118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
SL3ICS1002FUG/V7AF	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS					UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N8				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
PCF5077T-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
PCD3316T/2,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	10.3 mm
PCF5075M	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			15 mA	5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL	R-PDSO-G20				Not Qualified
TZA3044TT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	ECL			3.3 V	3.3	SMALL OUTLINE	TSSOP16,.25	ATM/SONET/SDH ICs	.635 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16				Not Qualified	e4
SA5225D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
TDA8010MDK-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel	-20 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
935262794518	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SA5751D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
SA5751N	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V		IN-LINE				85 Cel	-40 Cel		DUAL	R-PDIP-T24				Not Qualified
SA5750D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
NE5751D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
935260061118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1				2.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X				Not Qualified
935051900602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
935266813112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified				5 mm
935263376025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N13				Not Qualified		NOT SPECIFIED	NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.