RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Hybrid	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Battery Feed	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MK5027P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	48	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V		5	IN-LINE	DIP48,.6	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	Matte Tin (Sn)	DUAL		R-PDIP-T48				Not Qualified		e3
TEA7053DP	STMicroelectronics			THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					3.3 V		3.3	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm				Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20				Not Qualified		e0
SPZB260C-PRO	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	19		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V			MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel		-40 Cel		DUAL		R-XDMA-N19		1.025 mm		Not Qualified			NOT SPECIFIED	NOT SPECIFIED	26.5 mm
SPZB250	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	24		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V			MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-X24				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
XRA00-SBN18L/XXX	STMicroelectronics	TELECOM CIRCUIT		NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1							UNCASED CHIP								UPPER		R-XUUC-N
PBL3726/9	STMicroelectronics		OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		100 mA			3.9/13	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T18				Not Qualified		e0
L3000N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	15		RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	-5 V	85 mA	5 V	2-4 CONVERSION	+-5	FLANGE MOUNT	SIP15,.1	Analog Transmission Interfaces	2.54 mm	70 Cel	-48 AND +72	0 Cel	TIN LEAD	SINGLE		R-PSFM-T15				Not Qualified	RESISTIVE	e0
STA8090FGBTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.2 V			GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B99		1.2 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
L3092NT	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		-5 V		5 V			IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL		R-PDIP-T28			15.24 mm	Not Qualified					36.83 mm
SPZB260	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V			MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N17				Not Qualified
LRIS2K-MBTG/2	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES				.15 mA			1.5/3	SMALL OUTLINE	SOLCC8,.11,20	Other Telecom ICs	.5 mm	85 Cel		-20 Cel		DUAL		R-PDSO-N8				Not Qualified
TEA7530FP	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.03 mA	3 V		3	SMALL OUTLINE	DIP8,.3	Telephone Circuits	1.27 mm	70 Cel		-20 Cel	TIN LEAD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
SPBT2932DM	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1				2.5 V			MICROELECTRONIC ASSEMBLY				60 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N18		2.9 mm	11.6 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
LS025M	STMicroelectronics		OTHER	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		2.5 mA			-12/-30	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel		-25 Cel		DUAL		R-PDSO-G14				Not Qualified
GS-BT2416C1	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	51		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V			MICROELECTRONIC ASSEMBLY				70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-X51				Not Qualified
STLC60133	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		-6 V		6 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		1.2 mm	4.4 mm	Not Qualified		e0			9.7 mm
SPBT2532C2.AT	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	14		RECTANGULAR	UNSPECIFIED	NO	1				3 V			MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel		-40 Cel		DUAL		R-XDMA-N14			10.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	13.5 mm
STS39230	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20		RECTANGULAR	PLASTIC/EPOXY	YES	1								BGA20(UNSPEC)			85 Cel		-25 Cel		BOTTOM		R-PBGA-B20
L3092TN	STMicroelectronics		INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	-5 V		5 V		+-5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28				Not Qualified		e0
SPBT4.0DP	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR		YES	1				3.3 V			MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel		-40 Cel		TRIPLE	.8 Mbps	R-XXMA-N18		2.9 mm	11.6 mm						13.5 mm
BLUENRGCSP	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B34		.5 mm	2.56 mm				NOT SPECIFIED	NOT SPECIFIED	2.66 mm
TDA7212	STMicroelectronics	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				3 V			IN-LINE			2.54 mm	85 Cel		-20 Cel	TIN LEAD	DUAL		R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified		e0
UAA3202M-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4.7 mA	3.5 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified		e4			7.2 mm
TZA3044T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
TEA1083A	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	0 V	.004 mA	3.6 V		3.6	IN-LINE	DIP16,.3	Telecom Signaling Circuits	2.54 mm	75 Cel		-25 Cel		DUAL		R-PDIP-T16		4.7 mm	7.62 mm	Not Qualified					21.6 mm
TDA8010AM-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel		-20 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
UAA3220TS/V1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G24		2 mm	5.3 mm						8.2 mm
TEA1081T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V			SMALL OUTLINE			1.27 mm	75 Cel		-25 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
933897020112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V			SMALL OUTLINE			1.27 mm	70 Cel		-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		e4			4.9 mm
TZA3044BTT/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified					5 mm
935059610118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6.5 mm
TZA3023U/G	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V			UNCASED CHIP				85 Cel		-40 Cel		UPPER		R-XUUC-N13				Not Qualified
SA5217D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			13.5 mA	5 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified			40	250	12.8 mm
TZA3033T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		e4			4.9 mm
UAA2077BM-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		33.5 mA	4 V			SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-30 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
TZA3043U/G	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V			UNCASED CHIP				85 Cel		-40 Cel		UPPER		R-XUUC-N13				Not Qualified
935263520557	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V			FLATPACK			.65 mm	70 Cel		0 Cel		QUAD		R-PQFP-G100		3.2 mm	14 mm	Not Qualified					20 mm
935262928026	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1							UNCASED CHIP				85 Cel		-40 Cel		UPPER		R-XUUC-N8				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
UAA3220TS/V1/S5	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified		e4			8.2 mm
TZA3033U/C3	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V			UNCASED CHIP				85 Cel		-40 Cel		UPPER		R-XUUC-N8				Not Qualified
UAA3220TS	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0058 mA	5 V		2.7	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.65 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified				260	8.2 mm
PCA5075-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V			SMALL OUTLINE				70 Cel		-40 Cel		DUAL		R-PDSO-G20				Not Qualified
PCD6001H	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.5 V		2.5,3	FLATPACK	QFP80,.7X.9,32	Other Telecom ICs	.8 mm	70 Cel		-25 Cel		QUAD		R-PQFP-G80				Not Qualified			40	245
NE5900N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		4 mA	5 V			IN-LINE			2.54 mm	70 Cel		0 Cel		DUAL		R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified					19.025 mm
NE5224D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
TFF1024HN/N1,135	NXP Semiconductors	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.1X.14,20		.5 mm	85 Cel		-40 Cel		QUAD		R-PQCC-N16	1	1 mm	2.5 mm					260	3.5 mm
TZA3043BU	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V			UNCASED CHIP				85 Cel		-40 Cel		UPPER		R-XUUC-N13				Not Qualified
NE5217D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			13.3 mA	5 V			SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified					12.8 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.