RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NE575AN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5 V		IN-LINE				70 Cel	0 Cel		DUAL	R-PDIP-T20				Not Qualified
TDA8050A	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	0 V		5 V	5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G32				Not Qualified	e4
SL3S1203FUF,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER	R-XUUC-N4				Not Qualified
TZA3044TT-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE				85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16				Not Qualified	e4
UAA2077CM	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		47.5 mA	3.75 V	3.75	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	75 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
TZA3023U	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N13				Not Qualified
SA5212AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.033 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		40	260	4.9 mm
PCD5094H	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
935240740118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		2 mm	5.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.2 mm
SL3S1003FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm		e3			1.45 mm
TZA3043BU/G	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N13				Not Qualified
PCD5093H-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SL3ICS3001FW/F1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES							UNCASED CHIP							UPPER	R-XUUC-N8				Not Qualified
SA5211D,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.031 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		40	260	8.65 mm
WLAN8101C	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	38	HLGA	RECTANGULAR	UNSPECIFIED	YES	1				3.85 V		GRID ARRAY, HEAT SINK/SLUG	LGA38(UNSPEC)		.35 mm	85 Cel	-40 Cel		BOTTOM	R-XLGA-N38		.685 mm	3 mm					4 mm
TEA1085T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	0 V		4.2 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified	e4			15.4 mm
935263530118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
PCA1070P	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		.0001 mA	5 V	3/5	IN-LINE	DIP24,.6	Telephone Circuits	2.54 mm	60 Cel	-10 Cel		DUAL	R-PDIP-T24				Not Qualified
935054340118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
SA5214D,623	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			41.2 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
SA5224D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
UAA2077BM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		33.5 mA	4 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
TEA1094PN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified				35.5 mm
935051650112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e0			6.5 mm
SL3S1202FTB1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs	.55 mm	85 Cel	-40 Cel	TIN	BOTTOM	R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
SA5211D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		40	260	8.65 mm
UMA1000T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL	R-PDSO-G28				Not Qualified
SL3S1213FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.265 mA	1.8 V	1.8	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
TZA3033TD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
PN7150B0UK/C11003	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16		.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B42		.58 mm	2.8 mm					2.88 mm
PCD6002H/F1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		FLATPACK			.8 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G80		3.2 mm	14 mm	Not Qualified				20 mm
TEA1085A	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	0 V		4.2 V		IN-LINE			2.54 mm	75 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T24		5.1 mm	15.24 mm	Not Qualified	e3/e4			31.7 mm
935260218122	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1				2.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	R-XXMA-X				Not Qualified
SA5223D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.029 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
TDA8044AH/C2	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SL3S1213FUF/G,005	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER	R-XUUC-N4				Not Qualified
935264043025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N13				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TEA1085AT-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	0 V		4.2 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
TEA1094N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified				35.5 mm
PCD6003H	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	80	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.035 mA	2.5 V	2.5,3	FLATPACK	QFP80,.7X.9,32	Other Telecom ICs	.8 mm	70 Cel	-25 Cel	MATTE TIN	QUAD	R-PQFP-G80				Not Qualified	e3
TEA1094AT-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		4.4 mA	5 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
TZA3033U	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N15				Not Qualified
SL3S1213FUF,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER	R-XUUC-N4				Not Qualified
935185240518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
935263510112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.9 mm
PCD3316T/2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
NE5900D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
TEA1093	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		140 mA	3.6 V	3.6	IN-LINE	DIP28,.6	Telephone Circuits	2.54 mm	75 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified	e3/e4			35.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.