RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCP-3039NQT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1							CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		R-XQCC-N6		1 mm			1.2 mm					1.6 mm
AX-SFAZ-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40		1 mm			5 mm		e4			7 mm
SX042T	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK				70 Cel	0 Cel		QUAD		R-PQFP-G64						Not Qualified
TCP-4112UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm			.609 mm		e4		260	.626 mm
TCP-3039H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm			.722 mm					1.029 mm
TCP-3056H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm			.722 mm					1.179 mm
19293-001-XTP	Onsemi	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	50 Cel	0 Cel		DUAL		R-PDSO-G20		2 mm			5.3 mm	Not Qualified				7.2 mm
LV2282VA	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP24,.25		.2 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.5 mm			4.4 mm					6.5 mm
LC898212XD-SH	Onsemi	TELECOM CIRCUIT		BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm			TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.69 mm			1.37 mm		e1	30	260	1.77 mm
N24RF64DTPT3G	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.25		.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02648 Mbps	R-PDSO-G8	1	1.2 mm			3 mm		e4	30	260	6.4 mm
TCP-3056N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm			.722 mm					1.179 mm
TCP-3068H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm			.722 mm					1.179 mm
MC33169DTB-4R2	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G14	1	1.2 mm			4.4 mm	Not Qualified	e4			5 mm
MC33170DTBR2	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.2 mm			4.4 mm	Not Qualified	e4		260	5 mm
MC33169DTB-004	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G14		1.2 mm			4.4 mm	Not Qualified				5 mm
MC33169DTB-4.0	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G14		1.2 mm			4.4 mm		e0			5 mm
MC33170DTB	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.2 mm			4.4 mm	Not Qualified	e4		260	5 mm
NCV7428D1L3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm			3.937 mm		e3	30	260	4.927 mm
NCH-RSL10-01S51-ACG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.25 V		CHIP CARRIER			.7 mm	85 Cel	-40 Cel		BOTTOM	4 Mbps	R-PBCC-B51		1.56 mm			6 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
NCH-RSL10-101WC51-ABG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	51	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA51,11X11,10		.252 mm	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2 Mbps	R-PBGA-B51	1	.381 mm			2.325 mm		e2	30	260	2.364 mm
NCV7425DW5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	2.65 mm			7.5 mm		e3	30	260	10.3 mm
LA72910V-TLM-E	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3					Not Qualified	e6	30	260
LA72910V-MPB-E	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3					Not Qualified	e6	30	260
LA72914V-MPB-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3					Not Qualified	e6	30	260
NCV7425DW0G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16		2.65 mm			7.5 mm		e3			10.3 mm
NCV7425DW0R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16	2	2.65 mm			7.5 mm		e3		260	10.3 mm
NCV7425DW5G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16		2.65 mm			7.5 mm		e3			10.3 mm
LA72910V-MPB-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3					Not Qualified	e6	30	260
NCV7428D1L5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm			3.937 mm		e3	30	260	4.927 mm
TEA7050D	STMicroelectronics			GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					26 mA	2.8 V	2.8	SMALL OUTLINE	SOP28,.5	Other Telecom ICs	1.27 mm			Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28						Not Qualified	e0
SPBT3.0DP1	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N24		3 mm			15.24 mm			NOT SPECIFIED	NOT SPECIFIED	26.9 mm
STA020DJTR	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	3	2.65 mm			7.5 mm		e4		260	15.4 mm
SPBT2563C1	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	24		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		DUAL		R-XDMA-X24						Not Qualified		NOT SPECIFIED	NOT SPECIFIED
STC101F10S	STMicroelectronics	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		FLATPACK			.65 mm		0 Cel	TIN LEAD	QUAD		R-PQFP-G100		3.4 mm			14 mm	Not Qualified	e0			20 mm
TEA7050DP	STMicroelectronics			THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO					26 mA	2.8 V	2.8	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm			Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T28						Not Qualified	e0
GS-BT2416C2.H	STMicroelectronics	TELECOM CIRCUIT	OTHER	UNSPECIFIED	45		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-X45						Not Qualified
LRI2K-MBTG/3	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES					.15 mA		1.5/3	SMALL OUTLINE	SOLCC8,.12,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel		DUAL		R-PDSO-N8						Not Qualified
L3845D1013TR	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	70 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8		1.75 mm			3.9 mm	Not Qualified	e0			4.9 mm
STLC60133N	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			-6 V		6 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G28		1.2 mm			4.4 mm	Not Qualified				9.7 mm
STHVDAC-256MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B20		.64 mm			1.94 mm			NOT SPECIFIED	NOT SPECIFIED	2.23 mm
CRX14-MQ	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-20 Cel		DUAL		R-PDSO-G16		1.75 mm			3.9 mm	Not Qualified				9.9 mm
ST5451N	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS				5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDIP-T28					15.24 mm	Not Qualified	e0			36.83 mm
EFB7332P	STMicroelectronics		COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		MOS			30 mA	5 V	5	IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16			T-1(DS1)	CEPT PCM-30/E-1		Not Qualified
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B16		.655 mm			1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
CRX14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			20 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3					Not Qualified	e4	30	260
STA8058A	STMicroelectronics		INDUSTRIAL	BALL	104	FBGA	RECTANGULAR	PLASTIC/EPOXY	YES		BICMOS					2.7,3.3	GRID ARRAY, FINE PITCH	BGA104,8X13,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B104						Not Qualified
SPZB32W1A14	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N25		3.7 mm			16.4 mm					26.5 mm
STLC2690WTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	61	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V	1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA61,8X8,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B61		.6 mm			3.315 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3.56 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.