RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Output High Voltage	Maximum Output Low Voltage	Standard	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Reference Point	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Maximum Output Low Current	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGA7H1N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel				-40 Cel	TIN	DUAL	R-PDSO-N6		1	.4 mm	.7 mm			e3			1.1 mm
PEB2055A2P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0
BGA751N7	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel				-30 Cel		DUAL	R-PDSO-N6		1	.4 mm	1.3 mm						2 mm
PEB2056-P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
PEF2023T	Infineon Technologies	TELECOM CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE										DUAL	R-PDSO-G14					Not Qualified
PSB4506A	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		60 mA		3.5/9.2	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
BGT24AT2E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel				-40 Cel	TIN	QUAD	R-PQCC-N32		3	.9 mm	4.5 mm			e3			5.5 mm
PMB2230-S	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		13.2 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	85 Cel				-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G24					Not Qualified		e0
PSB4595V2.1	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel				0 Cel		DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified					9.7 mm
PEB2045-PVA3	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0
LH2559AAC-TR	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	70 Cel				0 Cel		DUAL	R-PDSO-G8			2.13 mm	5.59 mm	Not Qualified					5.715 mm
BGT24MTR12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel				-40 Cel		QUAD	R-PQCC-N32		3	.9 mm	4.5 mm						5.5 mm
PEB2070B1P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS					IN-LINE	DIP24,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T24					Not Qualified		e0
PEF3035-P	Infineon Technologies	TELECOM CIRCUIT		THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1						IN-LINE			2.54 mm							DUAL	R-PDIP-T28			4.6 mm	15.24 mm	Not Qualified					35.9 mm
PMB2207	Infineon Technologies		OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR				2.7/4.5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.635 mm	85 Cel				-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G24					Not Qualified		e0
H67100-H6246	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	J BEND	28	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		CHIP CARRIER			1.27 mm	85 Cel				-40 Cel		QUAD	R-PQCC-J28			3.8 mm	8.95 mm	Not Qualified					14.05 mm
PSB4450V1.1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G38			1.2 mm	4.4 mm	Not Qualified					9.7 mm
PSB4506-T	Infineon Technologies		COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		60 mA		3.5/9.2	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28					Not Qualified		e0
V23806-A34-C2	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1				5 V		FIBER OPTIC				70 Cel				0 Cel		UNSPECIFIED	R-XXFO-X					Not Qualified
PEB20950-C	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T40					Not Qualified		e0
PEB2025-P	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	22	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V	5,-12/-60	IN-LINE	DIP22,.4	Digital Transmission Interfaces	2.54 mm	70 Cel	2.4 V	.45 V	CCITT I.430	0 Cel	TIN LEAD	DUAL	R-PDIP-T22	S		5.1 mm	10.16 mm	Not Qualified	2 Amp	e0			27.8 mm
S980C5	Infineon Technologies	TELECOM CIRCUIT		GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR			5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.635 mm						Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G16					Not Qualified		e0
BGSF110GN26	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	26	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel				-30 Cel		QUAD	R-PQCC-N26		1	.77 mm	2.6 mm						3.4 mm
PEB2023	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			40 V		SMALL OUTLINE			1.27 mm	70 Cel				0 Cel		DUAL	R-PDSO-G14			1.75 mm	4 mm	Not Qualified					8.75 mm
PEB2052P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		CMOS			5 V	5	IN-LINE	DIP40,.6	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T40					Not Qualified		e0
BGT24MTR11E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel				-40 Cel		QUAD	R-PQCC-N32			.9 mm	4.5 mm				NOT SPECIFIED	NOT SPECIFIED	5.5 mm
PEF2026T-S	Infineon Technologies	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm						TIN LEAD	DUAL	R-PDSO-G20			2.65 mm	7.6 mm	Not Qualified		e0			12.8 mm
BGSF18DM20E6727XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel				-30 Cel		BOTTOM	R-XBGA-B20		3	.98 mm	2.8 mm						3.2 mm
BGT24ATR11E6327	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel				-40 Cel		QUAD	R-PQCC-N32			.9 mm	4.5 mm						5.5 mm
BGT24MTR12E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel				-40 Cel		QUAD	R-PQCC-N32			.9 mm	4.5 mm				NOT SPECIFIED	NOT SPECIFIED	5.5 mm
BGT24ATR11	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel				-40 Cel		QUAD	R-PQCC-N32		3	.9 mm	4.5 mm						5.5 mm
PEB22812	Infineon Technologies	TELECOM CIRCUIT		GULL WING	144	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK										QUAD	R-PQFP-G144					Not Qualified
TUA6100B6	Infineon Technologies	TELECOM CIRCUIT		GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm					-20 Cel		DUAL	R-PDSO-G28			1.2 mm	4.4 mm	Not Qualified					9.7 mm
PEB22811	Infineon Technologies	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK										QUAD	R-PQFP-G64					Not Qualified
PEB22810	Infineon Technologies	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm							DUAL	R-PDSO-G20			3.7 mm	11 mm	Not Qualified
BGA7M1N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel				-40 Cel	TIN	DUAL	R-PDSO-N6		1	.4 mm	.7 mm			e3			1.1 mm
LH2559AC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE				70 Cel				0 Cel		DUAL	R-PDSO-G8					Not Qualified
PSB4501-P	Infineon Technologies		OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		140 mA		1.6/7.5	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T20					Not Qualified		e0
BGT24AR2E6327	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	AEC-Q100		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel				-40 Cel		QUAD	R-PQCC-N32			.9 mm	4.5 mm						5.5 mm
V23809-E11-C10	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1				5 V		FIBER OPTIC				70 Cel				0 Cel		UNSPECIFIED	R-XXFO-X					Not Qualified
PMB2205T(V1.1)	Infineon Technologies		OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				33 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	85 Cel				-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20					Not Qualified		e0
PSB4400P	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		1.45 mA		1.6/7.5	IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T18					Not Qualified		e0
PSB4506A-T	Infineon Technologies		COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		60 mA		3.5/9.2	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G28					Not Qualified		e0
BGA5L1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel				-40 Cel		BOTTOM	R-XBCC-B6		1	.4 mm	.7 mm						1.1 mm
PSB4505A	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		60 mA		3.5/9.2	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel				-20 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T28					Not Qualified		e0
PEF2026	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel				-40 Cel		DUAL	R-PDSO-G20			3.5 mm	11 mm	Not Qualified					15.9 mm
TDA4065	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			5 V	5	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	70 Cel				0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T8					Not Qualified		e0
BGA7M1N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.4 mm	85 Cel				-40 Cel	TIN	DUAL	R-PDSO-N6		1	.4 mm	.7 mm			e3			1.1 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.