RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Peak Reflow Temperature (C)	Length
BCM43340HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	141	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B141		.55 mm	4.47 mm				5.67 mm
BCM43903KUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	151	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B151		.55 mm	4.91 mm				5.85 mm
BCM4330FKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm				5.33 mm
BCM20705A1KWFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B50		.8 mm	4 mm				4.5 mm
BCM43241GKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		1.05 mm	7 mm				9 mm
BCM4325FKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	339	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B339		.42 mm	5.81 mm				6.51 mm
BCM43303KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm				5.33 mm
BCM4339XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	286	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B286		.41 mm	4.87 mm				5.413 mm
BCM4330FKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm	4.89 mm				5.33 mm
BCM20710A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B42		.6 mm	2.509 mm				3.019 mm
BCM4330GKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm				5.33 mm
BCM4330XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	225	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B225		.41 mm	4.89 mm				5.33 mm
BCM4325GKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	339	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B339		.42 mm	5.81 mm				6.51 mm
BCM4356XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	395	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B395		.33 mm	4.87 mm				7.67 mm
BCM4319SKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	138	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.225 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B138		.55 mm	4.53 mm				5.74 mm
BCM20713A1KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B42		.6 mm	2.509 mm				3.019 mm
BCM4330XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	133	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B133		.55 mm	4.89 mm				5.33 mm
BCM4339XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B145		.55 mm	4.87 mm				5.413 mm
BCM4329HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B182		.55 mm	5.62 mm				6.57 mm
CYW88335L2CUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B145		.55 mm	4.87 mm				5.413 mm
CYW89071A1CUBXG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B42		.6 mm	2.509 mm				3.019 mm
BCM43907KWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B316		.33 mm	4.907 mm				5.848 mm
BCM4334WKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		.33 mm	4.08 mm				4.48 mm
BCM43353LIUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	145	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B145		.55 mm	4.87 mm				5.413 mm
BCM4334XKWBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM	R-PBGA-B208		.41 mm	4.08 mm				4.48 mm
BCM4354ZKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	192	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM	R-PBGA-B192		.55 mm	4.87 mm				7.67 mm
BCM89359KUBG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	194	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B194		.55 mm	4.97 mm				7.44 mm
SP000524278	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm				5 mm
SP000016381	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28		1.2 mm	4.4 mm		e3		9.7 mm
SP000892662	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-N6		.77 mm	1.7 mm		e3		2.3 mm
TDK5111XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0195 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			5 mm
TDK5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			5 mm
TDK5100XT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm				5 mm
SLB9635TT1.2	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel		DUAL	R-PDSO-G28		1.2 mm	4.4 mm				9.7 mm
TDK5110XT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm				5 mm
TDK5111	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0195 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified		260	5 mm
TLE6255	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	4 mm	Not Qualified			8.75 mm
SP000550860	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel		DUAL	R-PDSO-G28		1.2 mm	4.4 mm				9.7 mm
TDK5110	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.019 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified	e3	260	5 mm
TDK5101	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0095 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified		260	5 mm
TDK5111XT	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm				5 mm
SLB9635TT1.2F	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel		DUAL	R-PDSO-G28		1.2 mm	4.4 mm				9.7 mm
SDA6310X	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			12 V	12	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20		2.65 mm	7.6 mm	Not Qualified	e0		12.8 mm
SP000013532	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.2 mm	4.4 mm				5 mm
SDA6310	Infineon Technologies		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR			12 V	12	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDIP-T20				Not Qualified	e0
TDK5100	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	TIN	DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified	e3	260	5 mm
TDA5255E1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V	2.5/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP38,.25,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G38		1.2 mm	4.4 mm	Not Qualified			9.7 mm
BGM15HA12E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		QUAD	R-XQCC-N12		.65 mm	1.1 mm				1.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.