RECTANGULAR Other Function Telecom Interface ICs 2,400+

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LMX9830SMX	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	125 Cel		-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B60	3	1.3 mm	6 mm	Not Qualified		e0	30	235	9 mm
TMS3705CDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm			e4	30	260	9.9 mm
CC2564NSYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY				85 Cel		-40 Cel		BOTTOM		R-PBGA-B54	1						30	260
BQ51013YFFT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	1.56 mm	Not Qualified		e1	30	260	2.76 mm
SN76832N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel		DUAL		R-PDIP-T16				Not Qualified
BQ51013RHLR	Texas Instruments	TELECOM CIRCUIT		NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		R-PQCC-N20		1 mm	3.5 mm	Not Qualified					4.5 mm
LMX9820ASM	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	116	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B116		2 mm	9.95 mm						14 mm
BQ51020YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	8.8	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
CC2560BYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1	.575 mm	2.925 mm			e1	30	260	3.265 mm
CC2564BYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1					e1	30	260
BQ51013YFFR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	1.56 mm	Not Qualified		e1	30	260	2.76 mm
TSC2200IPWRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	NOT SPECIFIED	260	9.7 mm
CC2564NSYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY				85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1					e1	30	260
CC2564YFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY				85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1					e1	30	260
BQ51013RHLT	Texas Instruments	TELECOM CIRCUIT		NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		R-PQCC-N20		1 mm	3.5 mm	Not Qualified					4.5 mm
BQ51010YFFT	Texas Instruments	TELECOM CIRCUIT		BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm					BOTTOM		R-XBGA-B28		.625 mm	1.56 mm	Not Qualified					2.76 mm
BQ51021YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
CC2564YFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY				85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1					e1	30	260
SN76514N	Texas Instruments		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR				12,-8	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel		DUAL		R-PDIP-T14				Not Qualified
LMX9830SM/NOPB	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.065 mA	2.75 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.9216 Mbps	R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
BQ51011YFFR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	1.56 mm	Not Qualified		e1	30	260	2.76 mm
CC2564NYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY				85 Cel		-40 Cel		BOTTOM		R-PBGA-B54	1						30	260
CC2560ARVMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	4 Mbps	R-PQCC-N76	3	.9 mm	7.73 mm			e3	30	260	8 mm
SN65HVD1050-Q1	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	125 Cel		-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
LMX9830SM	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.75 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	125 Cel		-40 Cel		BOTTOM		R-PBGA-B60		1.3 mm	6 mm	Not Qualified					9 mm
TSC2200IPWG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
BQ51010YFFR	Texas Instruments	TELECOM CIRCUIT		BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm					BOTTOM		R-XBGA-B28		.625 mm	1.56 mm	Not Qualified					2.76 mm
CC2564NYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		GRID ARRAY				85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1					e1	30	260
BQ51013AYFPR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
BQ51020YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	8.8	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
BQ51011YFFT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	1.56 mm	Not Qualified		e1	30	260	2.76 mm
BQ51025YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
BQ51021YFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
TSC2200IPW	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	30	260	9.7 mm
TMS37122	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified					5 mm
SN76514J	Texas Instruments		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	CERAMIC	NO		BIPOLAR				12,-8	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel		DUAL		R-XDIP-T14				Not Qualified
BQ51025YFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	42	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B42	1	.5 mm	2.844 mm			e1	30	260	3.556 mm
CC2564RVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		R-PQCC-N76	3	.9 mm	7.73 mm			e3	30	260	8 mm
TSC2005IYZLR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.625 mm	2.75 mm	Not Qualified		e1	30	260	3.25 mm
SN76832AN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel		DUAL		R-PDIP-T16				Not Qualified
BQ51014YFPT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-PBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
SN76606N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	50 Cel		0 Cel		DUAL		R-PDIP-T28				Not Qualified
LMX9820ASMX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	116	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		GRID ARRAY			1 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B116		2 mm	9.95 mm						14 mm
SN76730N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP18,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel		DUAL		R-PDIP-T18				Not Qualified
SN76609N	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR					IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	50 Cel		0 Cel		DUAL		R-PDIP-T20				Not Qualified
CC2560ARVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	4 Mbps	R-PQCC-N76	3	.9 mm	7.73 mm			e3	30	260	8 mm
AD7013ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.3	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL		R-PDSO-G28		2 mm	5.3 mm	Not Qualified		e0			10.2 mm
AD6459ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE				85 Cel		-40 Cel		DUAL		R-PDSO-G20				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.