Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
17 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
95 Cel |
-40 Cel |
UPPER |
R-XUUC-N17 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Silicon Labs |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
12.9 mm |
17.8 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-55 Cel |
DUAL |
R-PDSO-N6 |
.8 mm |
1.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
30 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N30 |
3 |
2 mm |
15 mm |
23 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
75 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.35 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B75 |
1 |
.815 mm |
4 mm |
30 |
260 |
6 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG |
QUAD12,.09 X.07 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N12 |
1 |
.6 mm |
2 mm |
260 |
2.5 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
42 |
RECTANGULAR |
UNSPECIFIED |
1 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
NO LEAD |
24 |
RECTANGULAR |
YES |
1 |
AEC-Q100 |
105 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N24 |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.25 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N40 |
2.1 mm |
14.4 mm |
21 mm |
||||||||||||||||||||||||||||||||||||||||||||
Panasonic |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
12 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
12 V |
IN-LINE |
75 Cel |
-25 Cel |
SINGLE |
R-PSIP-T12 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||
Intel |
TELECOM CIRCUIT |
NO LEAD |
SMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
80 Cel |
0 Cel |
SINGLE |
2400 Mbps |
R-XSMA-N |
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|
Silicon Labs |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
12.9 mm |
17.8 mm |
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|
Murata Manufacturing |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER |
1.02 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N20 |
9.65 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10.9 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N24 |
1 |
.9 mm |
3 mm |
4 mm |
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|
ROHM |
TELECOM CIRCUIT |
OTHER |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-30 Cel |
TIN/TIN COPPER |
DUAL |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
Not Qualified |
e3/e2 |
10 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
XMA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N24 |
2 mm |
9 mm |
9.5 mm |
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Intersil |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
1.5 mA |
5 V |
5 |
IN-LINE |
DIP14,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T14 |
Not Qualified |
e0 |
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|
Murata Manufacturing |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
2 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
BOTTOM |
R-PBCC-N2 |
.7 mm |
1.6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3.2 mm |
||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQCC-N28 |
.9 mm |
3 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
2.6 mm |
7.4 mm |
Not Qualified |
e0 |
12.825 mm |
||||||||||||||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
1 |
3.607 mm |
5.85 mm |
e3 |
260 |
6.807 mm |
|||||||||||||||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
105 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G8 |
1 |
3.607 mm |
5.85 mm |
e3 |
260 |
6.807 mm |
|||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BALL |
49 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B49 |
1 mm |
4 mm |
4.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BALL |
74 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
70 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B74 |
1 |
.55 mm |
2.87 mm |
4.87 mm |
||||||||||||||||||||||||||||||||||||||||||
Motorola |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
-5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
9.9 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
12.9 mm |
17.8 mm |
||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
101 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N101 |
2.3 mm |
14 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
15 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
OTHER |
BUTT |
30 |
TFLGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.625 mm |
85 Cel |
0 Cel |
BOTTOM |
R-PBGA-B30 |
1.1 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
OTHER |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-20 Cel |
MATTE TIN |
DUAL |
R-PDSO-G24 |
3 |
2 mm |
3.9 mm |
e3 |
40 |
260 |
8.65 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
20 |
HQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-XQCC-N20 |
3 |
1.05 mm |
3 mm |
e4 |
4 mm |
||||||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
42 |
RECTANGULAR |
UNSPECIFIED |
1 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Skyworks Solutions |
TELECOM CIRCUIT |
38 |
RECTANGULAR |
1 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G20 |
2 |
2.6 mm |
7.4 mm |
Not Qualified |
e3 |
12.825 mm |
|||||||||||||||||||||||||||||||||||||
Atmel |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.0099 mA |
5 V |
5 |
SMALL OUTLINE |
SOP20,.4 |
Other Telecom ICs |
1.27 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
7.4 mm |
Not Qualified |
e0 |
12.825 mm |
|||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N28 |
2.86 mm |
14.5 mm |
35.75 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
59 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N59 |
5.65 mm |
14.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
35.55 mm |
||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
NO LEAD |
18 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
UNSPECIFIED |
.04 Mbps |
R-XXMA-N18 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
Abracon |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
34 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N34 |
3 |
2.5 mm |
13 mm |
26.9 mm |
|||||||||||||||||||||||||||||||||||||||||||
Cypress Semiconductor |
TELECOM CIRCUIT |
OTHER |
BALL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
70 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B63 |
.55 mm |
2.87 mm |
4.87 mm |
||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BALL |
140 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B140 |
.6 mm |
4.47 mm |
5.27 mm |
||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
33 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N33 |
2.1 mm |
11 mm |
13.9 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Taiyo Yuden |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
.4 mm |
75 Cel |
-25 Cel |
UNSPECIFIED |
R-XXMA-N28 |
1.5 mm |
5.1 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11.3 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
.25 Mbps |
R-XXMA-N31 |
2.1 mm |
12.9 mm |
15 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
12.9 mm |
17.8 mm |
||||||||||||||||||||||||||||||||||||||||||||||
|
Intel |
TELECOM CIRCUIT |
GULL WING |
64 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
QUAD |
R-PQFP-G64 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
COMMERCIAL |
BUTT |
42 |
HVBCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
BOTTOM |
R-XBCC-B42 |
.9 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.