RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BM23SPKS1NB9-0001AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

43

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.7 V

MICROELECTRONIC ASSEMBLY

MODULE,43LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N43

1.9 mm

15 mm

29 mm

BT900-SA-03

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

47

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X47

2.4 mm

12.5 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

EMMY-W161-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

46

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

R-XQMA-B46

13.8 mm

40

245

19.8 mm

ESP32-WROVER-B(M213DH6464PH3Q0)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

39

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N39

3.4 mm

18 mm

NOT SPECIFIED

NOT SPECIFIED

31.4 mm

IDT82V3010PVG8

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

56

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G56

1

2.794 mm

7.493 mm

Not Qualified

e3

30

260

18.415 mm

MLX90109CDC-AAA-000-TU

Melexis N V

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.72 mm

3.9 mm

e3

260

4.9 mm

SI4010-C2-GS

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

3

2 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

AD73311AR-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

SMALL OUTLINE

SOP20,.4

Codecs

1.27 mm

85 Cel

-40 Cel

1 dB

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-G20

1

2.65 mm

16-BIT

7.5 mm

Not Qualified

e0

30

240

12.8 mm

YES

ESP32-WROVER-IE(4MB)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3

3.45 mm

18 mm

250

31.4 mm

MLX90109CDC-AAA-000-RE

Melexis N V

TELECOM CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

MATTE TIN

DUAL

R-PDSO-G8

1

1.72 mm

3.9 mm

e3

260

4.9 mm

RS9113-N00-D1W-X78

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

SY88403BLEY

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

HTSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G10

1.1 mm

3 mm

Not Qualified

e3

3 mm

AD73322AR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

3/5

SMALL OUTLINE

SOP28,.4

Codecs

1.27 mm

85 Cel

-40 Cel

1.2 dB

TIN LEAD

DUAL

R-PDSO-G28

3

2.65 mm

16-BIT

7.5 mm

Not Qualified

e0

240

17.9 mm

YES

AD8314ACP-REEL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

UNSPECIFIED

YES

1

3 V

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e0

240

3 mm

AD8314ACP-WP

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

UNSPECIFIED

YES

1

3 V

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-XDSO-N8

1

1 mm

2 mm

Not Qualified

e0

240

3 mm

FC20

Quectel Wireless Solutions

TELECOM CIRCUIT

NO LEAD

52

QCCN

RECTANGULAR

YES

1

3.3 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

433 Mbps

R-XQCC-N52

2.05 mm

13 mm

SEATED HGT NOMINAL

16.6 mm

FC20-Q73

Quectel Wireless Solutions

TELECOM CIRCUIT

NO LEAD

52

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

LCC52(UNSPEC)

85 Cel

-40 Cel

QUAD

433 Mbps

R-XQCC-N52

2.1 mm

13 mm

SEATED HEIGHT NOM CONSIDERED

16.6 mm

FC20N-Q73B

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

52

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

433 Mbps

R-XXMA-N52

2.1 mm

13 mm

Seated Hgt-Nom

16.6 mm

LA72910V-TLM-H

Onsemi

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

5 V

5

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

Other Telecom ICs

.635 mm

70 Cel

-30 Cel

TIN BISMUTH

DUAL

R-PDSO-G16

3

Not Qualified

e6

30

260

MICRF009YM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

SOP16,.25

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

.002 Mbps

R-PDSO-G16

1

1.895 mm

3.9 mm

Operates from 4.75V to 5.5V

e3

30

260

9.9 mm

MRF24J40MET-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N12

3.48 mm

22.86 mm

33.02 mm

NEO-7N-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

SILVER OVER NICKEL

DUAL

R-XDMA-N24

2.6 mm

12.2 mm

e4

16 mm

RS9113-N00-D1W-X68

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

RS9113-N00-D1W-X72

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

RS9113-N00-D1W-X74

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

79

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N79

3.3 mm

16 mm

ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C

27 mm

SARA-U270-03S

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

96

RECTANGULAR

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-B96

4

3.25 mm

16 mm

26 mm

TDK5100XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.0095 mA

3 V

2.1/4

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

5 mm

TDK5110XUMA1

Infineon Technologies

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G16

3

1.2 mm

4.4 mm

Not Qualified

5 mm

UCC3750DWG4

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

2

2.65 mm

7.5 mm

Not Qualified

e4

30

260

17.9 mm

XB3-24APS-J

Digi International

TELECOM CIRCUIT

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

SPECIAL SHAPE

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-X

XM1100_1103874

Sierra Wireless

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N20

2.3 mm

9 mm

9.5 mm

AD630BD/+

Analog Devices

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

-15 V

5 mA

15 V

+-15

IN-LINE

DIP20,.3

Other Telecom ICs

2.54 mm

85 Cel

-25 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T20

e0

ATSAMW25H18-MR210PB1954

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

51

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N51

2.138 mm

14.908 mm

33.864 mm

BM23SPKA1NB9-0001AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

43

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.7 V

MICROELECTRONIC ASSEMBLY

MODULE,43LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N43

1.9 mm

15 mm

29 mm

ENW89829A2KF

Panasonic

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2.178 Mbps

R-XXMA-N24

2 mm

9 mm

50

250

9.5 mm

HMC-C200

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

5

RECTANGULAR

UNSPECIFIED

NO

1

6.5 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

GOLD OVER NICKEL

UNSPECIFIED

R-XXMA-X5

Not Qualified

e4

IA3223-C-FUR

Silicon Labs

TELECOM CIRCUIT

OTHER

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, SHRINK PITCH

.635 mm

85 Cel

-25 Cel

DUAL

R-PDSO-G16

1.7272 mm

3.8989 mm

NOT SPECIFIED

NOT SPECIFIED

4.8895 mm

IC880A-SPI

Imst

TELECOM CIRCUIT

NO LEAD

26

QMA

RECTANGULAR

UNSPECIFIED

YES

5 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

R-XQMA-N26

67.3 mm

79.8 mm

LBEE5CJ1XK-687

Murata Manufacturing

TELECOM CIRCUIT

NO LEAD

81

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

54 Mbps

R-XXMA-N81

1.345 mm

8.3 mm

9.1 mm

LM3290TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LXMS31ACNA-010

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

CHIP CARRIER

85 Cel

-40 Cel

BOTTOM

R-PBCC-N2

.7 mm

1.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3.2 mm

MAX1472AKA-T

Maxim Integrated

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0164 mA

2.7 V

2.7

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP8,.1

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

Not Qualified

e4

245

2.9 mm

MAX1472AKA+T

Analog Devices

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0166 mA

2.7 V

2.7

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSSOP8,.1

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1

1.45 mm

1.625 mm

Not Qualified

e4

30

260

2.9 mm

MAX3120ESA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX3120ESA+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e3

30

260

4.9 mm

MAX9152EUE

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.07 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP16,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

5 mm

MAX9152EUE+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

MDBT42Q-512K

Raytac

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

41

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N41

2.2 mm

10 mm

16 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.