Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
43 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.7 V |
MICROELECTRONIC ASSEMBLY |
MODULE,43LEAD(UNSPEC) |
1.2 mm |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N43 |
1.9 mm |
15 mm |
29 mm |
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|
Laird Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
UNSPECIFIED |
47 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.8 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-X47 |
2.4 mm |
12.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
19 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
46 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-B46 |
13.8 mm |
40 |
245 |
19.8 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
39 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N39 |
3.4 mm |
18 mm |
NOT SPECIFIED |
NOT SPECIFIED |
31.4 mm |
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|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G56 |
1 |
2.794 mm |
7.493 mm |
Not Qualified |
e3 |
30 |
260 |
18.415 mm |
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|
Melexis N V |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.72 mm |
3.9 mm |
e3 |
260 |
4.9 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
3 |
2 mm |
3.9 mm |
Not Qualified |
e3 |
40 |
260 |
8.65 mm |
||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3/5 |
SMALL OUTLINE |
SOP20,.4 |
Codecs |
1.27 mm |
85 Cel |
-40 Cel |
1 dB |
Tin/Lead (Sn85Pb15) |
DUAL |
R-PDSO-G20 |
1 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
30 |
240 |
12.8 mm |
YES |
|||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
150 Mbps |
R-XDMA-N38 |
3 |
3.45 mm |
18 mm |
250 |
31.4 mm |
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|
Melexis N V |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.72 mm |
3.9 mm |
e3 |
260 |
4.9 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G10 |
1.1 mm |
3 mm |
Not Qualified |
e3 |
3 mm |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3/5 |
SMALL OUTLINE |
SOP28,.4 |
Codecs |
1.27 mm |
85 Cel |
-40 Cel |
1.2 dB |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
240 |
17.9 mm |
YES |
||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e0 |
240 |
3 mm |
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Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e0 |
240 |
3 mm |
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|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
NO LEAD |
52 |
QCCN |
RECTANGULAR |
YES |
1 |
3.3 V |
CHIP CARRIER |
85 Cel |
-40 Cel |
QUAD |
433 Mbps |
R-XQCC-N52 |
2.05 mm |
13 mm |
SEATED HGT NOMINAL |
16.6 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
NO LEAD |
52 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
LCC52(UNSPEC) |
85 Cel |
-40 Cel |
QUAD |
433 Mbps |
R-XQCC-N52 |
2.1 mm |
13 mm |
SEATED HEIGHT NOM CONSIDERED |
16.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Quectel Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
52 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
433 Mbps |
R-XXMA-N52 |
2.1 mm |
13 mm |
Seated Hgt-Nom |
16.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
70 Cel |
-30 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
e6 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
SOP16,.25 |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.002 Mbps |
R-PDSO-G16 |
1 |
1.895 mm |
3.9 mm |
Operates from 4.75V to 5.5V |
e3 |
30 |
260 |
9.9 mm |
|||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
2.54 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N12 |
3.48 mm |
22.86 mm |
33.02 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
SILVER OVER NICKEL |
DUAL |
R-XDMA-N24 |
2.6 mm |
12.2 mm |
e4 |
16 mm |
||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
|||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
|||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
96 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-B96 |
4 |
3.25 mm |
16 mm |
26 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.0095 mA |
3 V |
2.1/4 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
5 mm |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
3 |
1.2 mm |
4.4 mm |
Not Qualified |
5 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
2 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
30 |
260 |
17.9 mm |
||||||||||||||||||||||||||||||||||||
|
Digi International |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Sierra Wireless |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N20 |
2.3 mm |
9 mm |
9.5 mm |
|||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
OTHER |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
BIPOLAR |
-15 V |
5 mA |
15 V |
+-15 |
IN-LINE |
DIP20,.3 |
Other Telecom ICs |
2.54 mm |
85 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T20 |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
51 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N51 |
2.138 mm |
14.908 mm |
33.864 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
43 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.7 V |
MICROELECTRONIC ASSEMBLY |
MODULE,43LEAD(UNSPEC) |
1.2 mm |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N43 |
1.9 mm |
15 mm |
29 mm |
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|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.178 Mbps |
R-XXMA-N24 |
2 mm |
9 mm |
50 |
250 |
9.5 mm |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
UNSPECIFIED |
5 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
6.5 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
R-XXMA-X5 |
Not Qualified |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
1.7272 mm |
3.8989 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.8895 mm |
|||||||||||||||||||||||||||||||||||||||||
Imst |
TELECOM CIRCUIT |
NO LEAD |
26 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
5 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N26 |
67.3 mm |
79.8 mm |
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|
Murata Manufacturing |
TELECOM CIRCUIT |
NO LEAD |
81 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N81 |
1.345 mm |
8.3 mm |
9.1 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
BALL |
30 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-XBGA-B30 |
1 |
.675 mm |
e1 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||
|
Murata Manufacturing |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
2 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER |
85 Cel |
-40 Cel |
BOTTOM |
R-PBCC-N2 |
.7 mm |
1.6 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
3.2 mm |
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Maxim Integrated |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0164 mA |
2.7 V |
2.7 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e4 |
245 |
2.9 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0166 mA |
2.7 V |
2.7 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Other Telecom ICs |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.45 mm |
1.625 mm |
Not Qualified |
e4 |
30 |
260 |
2.9 mm |
||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
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Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.07 mA |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP16,.25 |
Other Telecom ICs |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e0 |
5 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
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Raytac |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
41 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N41 |
2.2 mm |
10 mm |
16 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.