RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
AP22804BW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G5		1.4 mm		1.6 mm			e3	30	260	3 mm
ATWILC1000-MR110UB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel			UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm		14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
MRF24WG0MA-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel			DUAL		R-XDMA-N36		2.7 mm		21 mm						31 mm
NEO-M8T	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949			3 V		SMALL OUTLINE				85 Cel	-40 Cel			DUAL		R-PDSO-N24								NOT SPECIFIED	NOT SPECIFIED
RN41N-I/RM615	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		MATTE TIN	QUAD		R-XQMA-N35		2.2 mm		13.2 mm			e3			20.1 mm
SPSGRF-915	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N11		2.2 mm		11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
CC3135MODRNMMOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	63	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		NICKEL GOLD	QUAD		R-XQMA-B63	3	2.4 mm		17.5 mm			e4	30	260	20.5 mm
EC21AFA-512-STD	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD		R-XQMA-N		2.4 mm		29 mm		SEATED HEIGHT NOM				32 mm
MGM12P32F1024GA-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X				12.9 mm						17.8 mm
RN4870-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel			UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm		12 mm						22 mm
SA616DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		1.5 mm		4.4 mm	Not Qualified					6.5 mm
SE2431L-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.12X.16,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel			QUAD		R-XQCC-N24	1	.9 mm		3 mm	Not Qualified				260	4 mm
SKY66111-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.25 mm	85 Cel	-40 Cel			QUAD		R-XQCC-N20	3	.9 mm		3 mm					260	3.3 mm
SL2S2002FTB	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel		TIN	DUAL		R-PDSO-N3	1	.5 mm		1 mm	Not Qualified		e3	30	260	1.45 mm
UJA1023T/2R04/C,512	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel			DUAL		R-PDSO-G16		1.75 mm		3.9 mm						9.9 mm
XB3-24ARM	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUT	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XCC3135MODRNMMOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	63	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel			QUAD		R-PQCC-N63		2.45 mm		17.5 mm						20.5 mm
XCC3235MODSM2MOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	63	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel			QUAD		R-PQCC-N63		2.45 mm		17.5 mm						20.5 mm
BM832	Fanstel	TELECOM CIRCUIT		NO LEAD	47	LGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY				85 Cel	-40 Cel			BOTTOM	8 Mbps	R-XLGA-N47		1.95 mm		10.2 mm						15 mm
LMX9838SBX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	70	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.065 mA	3.3 V	3.3	GRID ARRAY	LGA70(UNSPEC)	Other Telecom ICs	1 mm	85 Cel	-40 Cel			BOTTOM		R-PBGA-N70	4	2.1 mm		10 mm	Not Qualified			30	250	17 mm
LMX9838SB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	70	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		TIN LEAD	BOTTOM		R-PBGA-N70		2.1 mm		10 mm	Not Qualified		e0			17 mm
MGC3030-I/SS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	2	2 mm		5.3 mm			e3	40	260	10.2 mm
SIM900B	Simcom Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	60	XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.0856 Mbps	R-XXMA-X60						Operates with 3.2-4.8 V supply
XB3-24Z8US	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N37
AD73311ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e0		240	7.2 mm	YES
CYG2030	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		HYBRID			9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	0 Cel			DUAL		R-PDIP-T18					Not Qualified
EYAGJNZXX	Taiyo Yuden	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	28		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			.4 mm	75 Cel	-25 Cel			UNSPECIFIED		R-XXMA-N28		1.5 mm		5.1 mm				NOT SPECIFIED	NOT SPECIFIED	11.3 mm
FC20-Q93	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	52	QCCN	RECTANGULAR		YES	1					3.3 V		CHIP CARRIER				85 Cel	-40 Cel			QUAD	433 Mbps	R-XQCC-N52		2.05 mm		13 mm		SEATED HGT NOMINAL				16.6 mm
MCP2140A-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949			3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.65 mm		7.5 mm	Not Qualified		e3	40	260	11.55 mm
SARA-G450-00C-00	U-blox Ag	TELECOM CIRCUIT	OTHER	NO LEAD	96		RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel			UNSPECIFIED		R-XXMA-N96		2.65 mm		16 mm						26 mm
SX8651ICSTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM		R-PBGA-B12	1	.625 mm		1.5 mm			e4		260	2 mm
WL1807MODGIMOCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm		13.3 mm	Not Qualified		e4	30	260	13.4 mm
AD630JN/+	Analog Devices		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR		-15 V	.005 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20							e0
AD73311ARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e3	40	260	7.2 mm	YES
AD8015ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	4.9 mm
BM71BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT		NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.0086 Mbps	R-XXMA-X16		2.1 mm		9 mm						11.5 mm
MCP2140A-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	TS 16949			3 V		IN-LINE	DIP18,.3		2.54 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDIP-T18		5.334 mm		7.62 mm	Not Qualified		e3			22.86 mm
WYSBHVGXG	Taiyo Yuden	TELECOM CIRCUIT	OTHER	NO LEAD	70		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel			UNSPECIFIED		R-XXMA-N70		1.9 mm		8.9 mm				NOT SPECIFIED	NOT SPECIFIED	12.6 mm
XB3-24APS	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB9X-DMUS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
ATA8403C-6AQY66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					11 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.635 mm	85 Cel	-55 Cel		MATTE TIN	DUAL		R-PDSO-G8					Not Qualified		e3
AX-SFEU-1-03-TX30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20		.5 mm	85 Cel	-40 Cel			QUAD		R-PQCC-N40		1 mm		5 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
BGS14PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1	CMOS				2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel			QUAD		R-XQCC-N10	1	.4 mm		1.1 mm						1.5 mm
M66FA-04-STD	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1					4 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD		R-XQMA-N44		2.3 mm		17.7 mm						15.8 mm
RM024-S125-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.5 Mbps	R-XXMA-X						ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
XB3-24Z8CM	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N34				13 mm						19 mm
AP22811BW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G5		1.4 mm		1.6 mm			e3	30	260	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.