RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
OPA380AIDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm		3.9 mm	Not Qualified		e4	30	260	4.9 mm
RN42U-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N32		2.4 mm		13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.8 mm
SL2S2102FTB,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel		TIN	DUAL		R-PDSO-N3	1	.5 mm		1 mm			e3	30	260	1.45 mm
XB3-24APT-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUM-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
AD9832BRUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified		e3	30	260	5 mm
ATA5743P3-TKQY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.0091 mA	5 V	5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	1.35 mm		4.4 mm	Not Qualified		e3			6.75 mm
ATA5743P6-TGQY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.0091 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1			7.4 mm	Not Qualified		e3		260	12.825 mm
BM78SPP05MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1					1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N30		1.86 mm		12 mm			e4	40	255	15 mm
CYBLE-012011-00	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N31	3	2 mm		14.52 mm						19.2 mm
RM024-S10-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.5 Mbps	R-XXMA-X						ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
SA612AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G8		1.75 mm		3.9 mm	Not Qualified					4.9 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm		4.4 mm	Not Qualified		e4		260	7.8 mm
SKY66112-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	22	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N22	3	1.1 mm		3 mm			e4		260	3.5 mm
UBX-M8030-CT	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BALL	47	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		3 V		GRID ARRAY				85 Cel	-40 Cel			BOTTOM		R-PBGA-B47	1
XB3-24ARS	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUS-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XBP9X-DMUS-011	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
450-0152C	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N47	4	2.14 mm		15.5 mm					245	21 mm
BT111-A-HCI	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	21		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-30 Cel			UNSPECIFIED		R-XXMA-N21		2.31 mm		9.3 mm						13.05 mm
ENW89823A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm		9 mm				40	250	9.5 mm
L26-M33	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		R-XDMA-N24		2.4 mm		12.2 mm		OPERATES FROM 2.8V TO 3.4V SUPPLY				16 mm
MGM111A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm		12.9 mm						15 mm
MRF24WG0MA-I/RM110	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		R-XDMA-N36		2.7 mm		21 mm						31 mm
RN42SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm		13.4 mm			e4			25.8 mm
RN4678U-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949				MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)			70 Cel	-20 Cel			UNSPECIFIED		R-XXMA-N30		1.8 mm		12 mm						15 mm
RS9113-NB0-D1C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps				27 mm
SA606DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		1.5 mm		4.4 mm	Not Qualified					6.5 mm
SA639DH/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm		4.4 mm			e4	30	260	7.8 mm
TM1062TXHUA	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	16		RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				125 Cel	-55 Cel			DUAL		R-PDMA-G16	3				Not Qualified
ADMP510ACEZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	TLGA	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		GRID ARRAY, THIN PROFILE			1.22 mm	85 Cel	-40 Cel			BOTTOM		R-XBGA-B3		1.08 mm		2.5 mm				NOT SPECIFIED	NOT SPECIFIED	3.35 mm
BLE112-E-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1.25 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N31		2.3 mm		12.05 mm						18.1 mm
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G24		1.1 mm		4.4 mm	Not Qualified			40	260	7.8 mm
SA639DH,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G24		1.1 mm		4.4 mm	Not Qualified					7.8 mm
XB3-24Z8RS	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N37
XWL1831MODGAMOCT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							GRID ARRAY			.7 mm	70 Cel	-20 Cel			BOTTOM		R-PBGA-N100		2 mm		13.3 mm						13.4 mm
AD73322AR-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1.2 dB	TIN LEAD	DUAL		R-PDSO-G28	3	2.65 mm	16-BIT	7.5 mm	Not Qualified		e0		240	17.9 mm	YES
BGSA11GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel			BOTTOM		R-XBCC-B10	1	.4 mm		1.1 mm						1.5 mm
BM70BLE01FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N30		1.66 mm		12 mm			e4			15 mm
MLX90109EDC	Melexis N V		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					2 mA		3.3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn)	DUAL		R-PDSO-G8					Not Qualified		e3
PI3EQX1004ZHEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	42	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel			QUAD		R-XQCC-N42		.84 mm		3.5 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
RC1180-MBUS3	Radiocrafts As	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD		R-XQMA-N30		3.3 mm		12.7 mm						25.4 mm
SA639DH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G24		1.1 mm		4.4 mm	Not Qualified			40	260	7.8 mm
SPWF04SA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.524 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N30		2.3 mm		15.24 mm				NOT SPECIFIED	NOT SPECIFIED	26.924 mm
XB24CZ7PIS-004	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N								NOT SPECIFIED	NOT SPECIFIED
BGM111E256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-B31		2.15 mm		12.9 mm						15 mm
BGSA13GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel			BOTTOM		R-XBCC-N10	1	.4 mm		1.1 mm						1.5 mm
BLE121LR-A-M256K	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY			.9 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N36		1.8 mm		13 mm						14.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.