RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
450-0064	Ls Research	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel			QUAD		R-XQMA-N52	4	1.9 mm		13 mm						18 mm
WT32I-A-AI6	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N50		2.55 mm		15.9 mm				NOT SPECIFIED	NOT SPECIFIED	23.9 mm
CYBLE-224116-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.76 mm	105 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N32	3	1.9 mm		9.5 mm						15.4 mm
NEO-M8P-0-11	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			DUAL		R-XDMA-N24	4	2.6 mm		12.2 mm						16 mm
BG95M5LA-64-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	102	LGA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		GRID ARRAY	LGA102(UNSPEC)			75 Cel	-35 Cel			BOTTOM	1.119 Mbps	R-XBGA-N102		2.2 mm		19.9 mm						23.6 mm
BGSF18DM20E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1		CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel	-30 Cel		GOLD NICKEL	BOTTOM		R-XBGA-B20	3	.98 mm		2.8 mm			e4			3.2 mm
RN41-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm		13.2 mm			e4			25.8 mm
BLE113-A-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	XMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N36	3	2.09 mm		9.15 mm		Operates from 2V to 3.6V supply		40	260	15.725 mm
RN4870-I/RM130	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel			UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm		12 mm						22 mm
ZM3102AE-CME1	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY								UNSPECIFIED	.04 Mbps	R-XXMA-N18
A2235-H	Lantronix	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X
BGT24MTR12E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		TIN	QUAD		R-PQCC-N32	3	.9 mm		4.5 mm			e3			5.5 mm
MDBT50Q-P1MV2	Raytac	TELECOM CIRCUIT		NO LEAD	61	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2 Mbps	R-XXMA-N61		2 mm		10.5 mm						15.5 mm
WL1807MODGIMOCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm		13.3 mm	Not Qualified		e4	30	260	13.4 mm
XBP9X-DMRS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
CC2564BYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm		2.93 mm			e1	30	260	3.26 mm
MGM12P32F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X				12.9 mm						17.8 mm
AD73311ARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e3		260	7.2 mm	YES
TMS3705EDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm		3.9 mm			e4	30	260	9.9 mm
ADF7012BRUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified		e3	30	260	7.8 mm
BLED112-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X						VBUS= 3.6V TO 5.5V		NOT SPECIFIED	NOT SPECIFIED
TDA5201XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN	DUAL		R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified		e3			9.7 mm
SA612AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel			DUAL		R-PDIP-T8		4.2 mm		7.62 mm	Not Qualified			40	250	9.5 mm
SA612AN,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel			DUAL		R-PDIP-T8		4.2 mm		7.62 mm	Not Qualified			40	250	9.5 mm
MD0100N8-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	FLAT	3	LSOF	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949				SMALL OUTLINE, LOW PROFILE	TO-243		1.5 mm	125 Cel	-40 Cel		MATTE TIN	SINGLE		R-PSSO-F3	1	1.6 mm		2.445 mm			e3	40	260	4.5 mm
SA616DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4		260	6.5 mm
AD8015AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e0		240	4.9 mm
BGS12AL74E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.8 V		CHIP CARRIER			.55 mm	85 Cel	-30 Cel		GOLD	BOTTOM		R-XBCC-B6	1	.5 mm		1.5 mm			e4			2.3 mm
MLX90109EDC-AAA-000-RE	Melexis N V	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G8	1	1.72 mm		3.9 mm			e3		260	4.9 mm
PCM3060PW	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	1.2 mm		4.4 mm	Not Qualified		e4	30	260	9.7 mm
AD608ARZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	9.9 mm
DS2409P+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-C6	1	1.5 mm		3.81 mm	Not Qualified		e3	30	260	3.937 mm
DS2409P	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-C6	1	1.5 mm		3.76 mm	Not Qualified		e0			3.94 mm
HTSH5601ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel	-25 Cel			DUAL		R-PDSO-N2	1				Not Qualified			30	260
SA636DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
TDA5211XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel		TIN	DUAL		R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified		e3			9.7 mm
TLE8457BSJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm				TIN	DUAL		R-PDSO-G8	3	1.75 mm		4 mm			e3			5 mm
BGT24MR2E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		TIN	QUAD		R-PQCC-N32	3	.9 mm		4.5 mm			e3			5.5 mm
HT12D(18DIP)	Holtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			CMOS				2.4/12	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel	-20 Cel			DUAL		R-PDIP-T18					Not Qualified
WT32I-E-AI6	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N50		2.55 mm		15.9 mm						23.9 mm
BGM15LA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		GOLD NICKEL	BOTTOM		R-XBCC-B12	1	.65 mm		1.1 mm			e4			1.9 mm
BGSF110GN26E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	26	HQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-30 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD		R-PQCC-N26	1	.77 mm		2.6 mm			e4			3.4 mm
BQ51013ARHLR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	0 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.002 Mbps	R-PQCC-N20	2	1 mm		3.5 mm			e4	NOT SPECIFIED	260	4.5 mm
MAX-8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel			DUAL		R-XDMA-N18	4	2.7 mm		9.7 mm					245	10.1 mm
SA602AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G8		1.75 mm		3.9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
UCC3750DW	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm		7.5 mm	Not Qualified		e4	30	260	17.9 mm
WLR089U0-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD	12 Mbps	R-XQMA-N40		2.8 mm		13.5 mm		HEAT SINK IS PRESENT				17 mm
WT32I-E-AI6IAP	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N50		2.55 mm		15.9 mm						23.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.