RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BM77SPPS3MC2-0007AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.1125 Mbps	R-XXMA-N30		1.86 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	15 mm
BMD-300-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N	3							250
ESP-WROOM-02	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.9 mm	18 mm				30	250	20 mm
CMWX1ZZABZ-093	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	METAL	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-MXMA-N
RN41XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm			e4			29.9 mm
RN41SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm			e4			25.8 mm
MAX-M8Q-0	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100	3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	9.7 mm						10.1 mm
RN4677-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
BM70BLES1FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
MAX-M8Q-0-10	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100	3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.7 mm	9.7 mm						10.1 mm
DWM1000	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1	CMOS				MICROELECTRONIC ASSEMBLY			1.4 mm	85 Cel	-40 Cel		UNSPECIFIED	6.8 Mbps	R-XXMA-N24		3.15 mm	13 mm				NOT SPECIFIED	NOT SPECIFIED	23 mm
BGM111A256V21R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.2 mm	12.9 mm						15 mm
BM78SPPS5MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm			e4	40	255	22 mm
SA612AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4		260	4.9 mm
WL1831MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
ESP32-WROVER-IB	Espressif Systems (Shanghai)	TELECOM CIRCUIT		NO LEAD	38	DMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL	150 Mbps	R-XDMA-N38		3.45 mm	18 mm						31.4 mm
RN4871U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.1 mm	9 mm						11.5 mm
RN4871-V/RM140	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
SA612AD/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
BLUENRG-M2SA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	23	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N23		2.5 mm	11.5 mm				20	240	13.5 mm
TESEO-LIV3F	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.3 mm	9.7 mm				NOT SPECIFIED	NOT SPECIFIED	10.1 mm
DWM1001C	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34	DMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		DUAL	6.8 Mbps	R-XDMA-N34		3.4 mm	19.13 mm						26.12 mm
NEO-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100; TS 16949	3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm						16 mm
BGM220PC22HNA2R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	105 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N31		2.4 mm	12.9 mm						15 mm
BT840F	Fanstel	TELECOM CIRCUIT		NO LEAD	61	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N61			14 mm						20.8 mm
BMD-350-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.35 mm	6.4 mm						8.65 mm
SPSGRF-868	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
ZED-F9P-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	LGA	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100	3 V		GRID ARRAY			1.1 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N54		2.6 mm	17 mm						22 mm
WL1837MODGIMOCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
ADL5350ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1			3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm	2 mm	Not Qualified		e3		260	3 mm
BGM111A256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.1 mm	12.9 mm						15 mm
DC-ME-01T-C	Digi International	SERIAL DEVICE SERVER		NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	100 Mbps	R-XXMA-N		18.67 mm	19.05 mm						36.7 mm
WT12-A-AI4	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.6 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
RN4020-V/RM123	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel		UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		Bluetooth Module		NOT SPECIFIED	NOT SPECIFIED	19.5 mm
MP45DT02TR-M	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	LGA	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		GRID ARRAY				85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	BOTTOM		R-XBGA-N6	3	1.35 mm	3.76 mm			e4		260	4.72 mm
WT12-A-AI3	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N31		2.6 mm	14 mm						25 mm
BM70BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
ODIN-W260-05B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N52		3.2 mm	14.8 mm						22.3 mm
WL1831MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
BMD-340-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N68		1.9 mm	10.2 mm						15 mm
RN4020-V/RMBEC133	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		Bluetooth Module	e4			19.5 mm
BM70BLES1FC2-0B03AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
RN4871-V/RM130	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
LEA-M8S-0	U-blox Ag	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	DMA	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100	3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N28	4	2.7 mm	17 mm						22.4 mm
RN4020-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm			e4			19.5 mm
L76L-M33	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm						10.1 mm
L76-M33	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1					MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm		HEIGHT CAPTURED NOMINAL				10.1 mm
BLUENRG-M2SP	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N20		2.5 mm	11.5 mm				20	240	13.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.