RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGM113A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			.8 mm	85 Cel	-40 Cel		UNSPECIFIED				2 mm	9.15 mm						15.73 mm
RS9116W-SB00-B00	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	126	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.85 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N126
AD9832BRUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	5 mm
BMD-340-A-R-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N68		1.9 mm	10.2 mm						15 mm
CC2564BRVMT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	76	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.6 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-PQCC-N76	3	.9 mm	7.73 mm			e3	30	260	8 mm
ETRX357-LRS	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	DMA	RECTANGULAR	UNSPECIFIED	NO	1					3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N33			19 mm						25 mm
MRF24J40ME-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm						33.02 mm
WT32I-A-AI6IAP	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50		2.55 mm	15.9 mm				NOT SPECIFIED	NOT SPECIFIED	23.9 mm
AP22814AW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G5		1.4 mm	1.6 mm			e3	30	260	3 mm
ATECC508A-SSHDA-B	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949		3.6 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm			e4		260	4.9 mm
PEF7072HLV16SLLHN	Intel	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1							FLATPACK							QUAD		R-PQFP-G64
ISO508P	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T24		6.35 mm	15.24 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	30.99 mm
BMD-330-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.9 mm	9.8 mm						14 mm
SL3S1002FTB1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs	.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified		e3	30	260	1.45 mm
BM23SPKS1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm						29 mm
XB3-24AUM	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
CC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm			e3			7 mm
CC2564BYFVR-XI	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm	2.93 mm			e1	30	260	3.26 mm
MAX-M8W-0-10	U-blox Ag	GNSS Module	INDUSTRIAL	NO LEAD	18		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N18	4	2.7 mm	2.5 mm						10.1 mm
NEO-M8U-05B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	YES	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm						16 mm
XB3-24Z8RM-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N34			13 mm				NOT SPECIFIED	NOT SPECIFIED	19 mm
ZM5202AE-CME3R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	QMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-10 Cel		QUAD	.1 Mbps	R-XQMA-N18			12.5 mm						13.6 mm
BM71BLE01FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm						8 mm
CC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	TIN OVER NICKEL	UNSPECIFIED	4 Mbps	R-XXMA-N33	3		7 mm			e3			7 mm
NINA-B112	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X
RN4870U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N30		1.6 mm	12 mm						15 mm
SA612AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
RS9116W-SB00-B00-X23	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	126	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.85 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N126	3						40	260
SA602AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	9.5 mm
USB3740B-AI9-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		5 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.08,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-PQCC-N10		.6 mm	1.6 mm			e4			2.1 mm
USB3740B-AI9TR	Standard Microsystems	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		R-XQCC-N10		.6 mm	1.6 mm				NOT SPECIFIED	NOT SPECIFIED	2.1 mm
NEO-M8P-2-11	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm						16 mm
RN4870-I/RM140	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
SA602AD/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e4	30	260	4.9 mm
SL2S2002FTB,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N3	1	.5 mm	1 mm			e3	30	260	1.45 mm
XB3-24AUT-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
MFRC53001T/0FE,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm					250	20.5 mm
451-00002	Laird Technologies	TELECOM CIRCUIT		NO LEAD	71	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N71		2.35 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	15 mm
WL1805MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified		e4	30	260	13.4 mm
8265.NGWMG.NV	Intel	TELECOM CIRCUIT		NO LEAD		SMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				80 Cel	0 Cel		SINGLE	867 Mbps	R-XSMA-N
PCM3060PWR	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
TMS3705A1DRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm	Not Qualified		e4	30	260	9.9 mm
ATWILC1000-MR110UB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
BGM15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					2.8 V		CHIP CARRIER, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm						1.9 mm
ETRX357	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33		RECTANGULAR	UNSPECIFIED	NO	1					3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N33	3		19 mm				40	250	25 mm
ODIN-W260	U-blox Ag	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X
RS9116W-DB00-CC1-X11	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	107	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.85 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N107
TM266DVA1	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.5	ATM/SONET/SDH ICs	.65 mm	125 Cel	-55 Cel		DUAL		R-PDSO-G28	1	5.588 mm		Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.