RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BQ51003YFPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1							GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm			e1	30	260	3 mm
DNT24C	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel		-40 Cel		DUAL		R-XDMA-N30			24.9 mm				NOT SPECIFIED	NOT SPECIFIED	38.1 mm
EC21EUGA-512-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	144	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	10 Mbps	R-XXMA-N144		2.4 mm	29 mm		SEATED HEIGHT NOM				32 mm
EYSGCNZWY	Taiyo Yuden	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				75 Cel		-25 Cel		UNSPECIFIED		R-XXMA-N49		2.2 mm	9.6 mm				NOT SPECIFIED	NOT SPECIFIED	12.9 mm
LMX9830SMX/NOPB	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	60	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.065 mA	2.75 V	2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA60,6X10,32	Other Telecom ICs	.8 mm	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	.9216 Mbps	R-PBGA-B60	4	1.3 mm	6 mm	Not Qualified		e1	30	260	9 mm
OPA380AID	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
PCM3060PWRG4	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified		e4	NOT SPECIFIED	260	9.7 mm
XB3-24ACM-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel		-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUS	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							SPECIAL SHAPE				85 Cel		-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24Z8PS-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N37							NOT SPECIFIED	NOT SPECIFIED
ATWILC1000-MR110PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel		-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
MAX7033EUI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel		-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified		e0			9.7 mm
MAX7033EUI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel		-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
SKY66110-11	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.25 mm	85 Cel		-40 Cel		QUAD		R-XQCC-N20	3	.9 mm	3 mm					260	3.3 mm
AD6676BCBZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.1 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B80	1	.66 mm	5.04 mm			e1	30	260	4.29 mm
CYG2031	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			HYBRID		9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel		0 Cel		DUAL		R-PDIP-T18				Not Qualified
L70B-M39	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	DMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N18		2.5 mm	9.7 mm		SEATED HGT-NOM; OPERATED WITH 2.8V TO 4.3V				10.1 mm
SI4010-C2-GSR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G14		2 mm	3.9 mm	Not Qualified			40	260	8.65 mm
XB9X-DMRS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
ATWILC1000-MR110PB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel		-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
BMD-360-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47	3	1.9 mm	9.8 mm					250	14 mm
ATSAMW25H18-MR510PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
BGSA12GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1					2.85 V		CHIP CARRIER			.4 mm	85 Cel		-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm						1.5 mm
MRF24WB0MB/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		UNCASED CHIP				70 Cel		0 Cel	MATTE TIN	UPPER		R-XUUC-N36				Not Qualified		e3
SA602AD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			6 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
XB3-24Z8RS-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N37							NOT SPECIFIED	NOT SPECIFIED
BGA5H1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER			.4 mm	85 Cel		-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm						1.1 mm
CYW20706UA2KFFB4G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B49	3	1.05 mm	4 mm			e1			4.5 mm
EFR32BG1P332F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B43	1	.54 mm	3.143 mm			e1	40	260	3.295 mm
RM024-P125-C-30	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	.5 Mbps	R-XXMA-X					ALSO AVAILABLE WITH 280kbps data rate		NOT SPECIFIED	NOT SPECIFIED
RTL8139D-LF	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.5 V		FLATPACK			.65 mm	70 Cel		0 Cel		QUAD		R-PQFP-G100		3.3 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	20 mm
SI32170-C-GM1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	42	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		BOTTOM		R-XBCC-B42		.9 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
TPS80010ARSMR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N32	2	1 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
AD8312ACBZ-P7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm	.95 mm	Not Qualified		e1	40	260	1.45 mm
BGA5M1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER			.4 mm	85 Cel		-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm						1.1 mm
BMD-301-A-R	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		XMA	RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N
NINA-W102-00B-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	1		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-B1	4	4.2 mm	10 mm						14 mm
NRF51822-CEAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		R-PBGA-B62		.55 mm	3.5 mm				NOT SPECIFIED	NOT SPECIFIED	3.83 mm
RS9116N-DB00-CC1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	107	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.85 V		GRID ARRAY				85 Cel		-40 Cel		BOTTOM		R-XBGA-N107
TLE8457ASJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm				TIN	DUAL		R-PDSO-G8	3	1.75 mm	4 mm			e3			5 mm
AD8314ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	UNSPECIFIED	YES	1					3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm	2 mm	Not Qualified		e3	30	260	3 mm
CYBLE-212020-01	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N31	3	2 mm	14.52 mm						19.2 mm
CYG2021	IXYS Corporation		COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO			HYBRID		9 mA	5 V	5	IN-LINE	DIP18(UNSPEC)	Other Telecom ICs		70 Cel		0 Cel		DUAL		R-PDIP-T18				Not Qualified
CYW20734UA1KFFB3G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	90	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel		0 Cel		BOTTOM		R-PBGA-B90		1.2 mm	8.5 mm						8.5 mm
ENW89835A1KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		UNSPECIFIED		R-XXMA-N		2 mm	8.7 mm				50	250	15.6 mm
LEA-6H-0-002	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	PLASTIC/EPOXY	NO	1			AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel		-40 Cel		DUAL		R-PDMA-N28	4	2.7 mm	17 mm						22.4 mm
NEO-M8L-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100				MICROELECTRONIC ASSEMBLY				85 Cel		-40 Cel		DUAL		R-XDMA-N24							NOT SPECIFIED	NOT SPECIFIED
AD73311LARSZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel		-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified		e3		260	7.2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.