Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Silicon Labs |
TELECOM CIRCUIT |
UNSPECIFIED |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
SPECIAL SHAPE |
85 Cel |
-40 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-X |
12.9 mm |
17.8 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
.635 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.02 Mbps |
R-PDSO-G16 |
1.75 mm |
3.91 mm |
e3 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
101 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N101 |
2.3 mm |
14 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
15 mm |
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|
Skyworks Solutions |
TELECOM CIRCUIT |
NO LEAD |
24 |
QCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CHIP CARRIER |
QUAD |
R-PQCC-N24 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
PIN/PEG |
9 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
5.1 mm |
65 Cel |
-10 Cel |
DUAL |
R-XDMA-P9 |
11.68 mm |
35.3 mm |
40.64 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
PIN/PEG |
9 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
5.1 mm |
80 Cel |
-40 Cel |
DUAL |
R-XDMA-P9 |
11.68 mm |
35.3 mm |
40.64 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
PIN/PEG |
9 |
DMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
5.1 mm |
65 Cel |
-10 Cel |
DUAL |
R-XDMA-P9 |
11.68 mm |
35.3 mm |
40.64 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Laird Technologies |
TELECOM CIRCUIT |
NO LEAD |
71 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N71 |
2.35 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
3/5 |
SMALL OUTLINE |
SOP20,.4 |
Codecs |
1.27 mm |
85 Cel |
-40 Cel |
1 dB |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
2.65 mm |
16-BIT |
7.5 mm |
Not Qualified |
e0 |
240 |
12.8 mm |
YES |
||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0125 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Modems |
.65 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e0 |
240 |
7.2 mm |
||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.0125 mA |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP20,.3 |
Modems |
.65 mm |
105 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G20 |
1 |
2 mm |
5.3 mm |
Not Qualified |
e0 |
240 |
7.2 mm |
||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
17.9 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
30 |
260 |
17.9 mm |
||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
NO LEAD |
44 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XQMA-N44 |
2.72 mm |
16.51 mm |
24.77 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
51 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N51 |
2.138 mm |
14.908 mm |
33.864 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
51 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N51 |
2.138 mm |
14.908 mm |
33.864 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
51 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N51 |
2.138 mm |
14.908 mm |
33.864 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
42 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N42 |
3.2 mm |
20 mm |
30 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
.8 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N36 |
2 mm |
9.15 mm |
15.73 mm |
||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
43 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.7 V |
MICROELECTRONIC ASSEMBLY |
MODULE,43LEAD(UNSPEC) |
1.2 mm |
70 Cel |
-20 Cel |
UNSPECIFIED |
R-XXMA-N43 |
1.9 mm |
15 mm |
29 mm |
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|
Infineon Technologies |
TELECOM CIRCUIT |
OTHER |
BALL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
70 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B63 |
1 |
.55 mm |
2.87 mm |
4.87 mm |
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|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.178 Mbps |
R-XXMA-N24 |
2 mm |
9 mm |
9.5 mm |
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|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.6 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.178 Mbps |
R-XXMA-N24 |
2 mm |
6.5 mm |
9 mm |
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|
Panasonic |
TELECOM CIRCUIT |
INDUSTRIAL |
UNSPECIFIED |
28 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-X28 |
2 mm |
9 mm |
50 |
250 |
9.5 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
2.54 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N38 |
20.5 mm |
37.5 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDMA-N28 |
4 |
2.7 mm |
17 mm |
22.4 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
18 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N18 |
4 |
2.7 mm |
9.7 mm |
10.1 mm |
||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
9.9 mm |
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
9.9 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
36 |
RECTANGULAR |
UNSPECIFIED |
1 |
TS 16949 |
3.3 V |
85 Cel |
-40 Cel |
2.7 mm |
21 mm |
31 mm |
||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
|||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N36 |
2.7 mm |
21 mm |
31 mm |
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Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
37 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N37 |
2.286 mm |
17.78 mm |
26.67 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
25 mA |
3.3 V |
3.3 |
UNCASED CHIP |
DIE OR CHIP |
Other Telecom ICs |
85 Cel |
-40 Cel |
UPPER |
4250 Mbps |
R-XUUC-N10 |
Not Qualified |
Data rate is 4.25 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
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|
Texas Instruments |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.008 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP8,.25 |
Other Telecom ICs |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
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Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
28 |
LFLGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.6 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.676 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-B28 |
1.25 mm |
5 mm |
5.5 mm |
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Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3/5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP20,.25,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.2 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
6.5 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,32LEAD(UNSPEC) |
1 mm |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
3 Mbps |
R-XXMA-N32 |
2.4 mm |
13.4 mm |
e4 |
25.8 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
54 Mbps |
R-XXMA-N79 |
3.3 mm |
16 mm |
ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C |
27 mm |
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Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
101 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.85 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N101 |
||||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.85 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N79 |
||||||||||||||||||||||||||||||||||||||||||||||||
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
79 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.85 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N79 |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G20 |
1.5 mm |
4.4 mm |
Not Qualified |
40 |
260 |
6.5 mm |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SSOP20,.25 |
.65 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
1 |
1.5 mm |
4.4 mm |
e4 |
30 |
260 |
6.5 mm |
|||||||||||||||||||||||||||||||||||||
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
96 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-B96 |
4 |
3.25 mm |
16 mm |
26 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Telit Communications Plc |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-N24 |
2.4 mm |
12.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
23 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N23 |
2.2 mm |
11.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
13.5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.