RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Input Type	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
STA8090FGB	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			BOTTOM		R-PBGA-B99		1.2 mm		5 mm					NOT SPECIFIED	NOT SPECIFIED	6 mm
U2741B-NFBG3Y	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0125 mA	3 V	2.2/5.5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	1	1.7 mm			Not Qualified			e3		260	4.9 mm
W2SG0084I-B-TR	Wi2wi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			QUAD		R-XQMA-N24	1	2.3 mm		11.2 mm						260	12 mm
WL1801GYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	130	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA130,11X12,16		.4 mm	105 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B130	1	.575 mm		4.64 mm				e1	30	260	4.93 mm
XB3-24ACM	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB9X-DMRS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
XR-2211ACD	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		9 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G14	1	1.75 mm		3.9 mm	Not Qualified			e0	30	215	8.65 mm
XR2211ACP-F	Exar	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.009 mA	12 V	12	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		MATTE TIN	DUAL		R-PDIP-T14		5.33 mm		7.62 mm	Not Qualified			e3			19.305 mm
XWL1831MODGAMOCR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel	-20 Cel			BOTTOM		R-PBGA-B130		2 mm		13.3 mm							13.4 mm
ABBTM-NVC-MDCS42A	Abracon	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N32	3	2.2 mm		13.4 mm							25.8 mm
AD73322LARUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.031 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Codecs	.65 mm	85 Cel	-40 Cel	.75 dB	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.2 mm	16-BIT	4.4 mm	Not Qualified			e3	40	260	9.7 mm	YES
AD73360ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
ATA5577M3330C-DDB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	2	DIE	RECTANGULAR	UNSPECIFIED		1						UNCASED CHIP	DIE OR CHIP		.524 mm	85 Cel	-40 Cel			UPPER		R-XUUC-N2		.162 mm		1 mm							1.35 mm
BMD-341-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	2 Mbps	R-XXMA-N68	3	1.9 mm		10.2 mm						250	15 mm
D52MD2M8IA-TRAY	Garmin Canada	TELECOM CIRCUIT	INDUSTRIAL	BALL	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			UNSPECIFIED	.06 Mbps	R-XXMA-B35		2.11 mm		9.8 mm							14 mm
DP1203C4333LF	Semtech	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	21		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		MATTE TIN	UNSPECIFIED		R-XXMA-X21					Not Qualified			e3
EFR32BG1B232F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel			BOTTOM		R-PBGA-B43		.54 mm		3.143 mm							3.295 mm
ETRX2HR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	38		RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N38				20.5 mm							37.5 mm
HTSH4801ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel	-25 Cel			DUAL		R-PDSO-N2	1				Not Qualified				30	260
LTC4400-1ES6#TRMPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G6	1	1 mm		1.6 mm	Not Qualified			e3			2.9 mm
MC33660EF	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel			DUAL		R-PDSO-N8		1.75 mm		3.9 mm							4.9 mm
MGM111A256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm		12.9 mm							15 mm
MGM12P32F1024GE-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X				12.9 mm							17.8 mm
ODIN-W262	U-blox Ag	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X
PEF7072HLV16	Intel	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK								QUAD		R-PQFP-G64
RN4020BCN-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel		GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm		11.5 mm				e4			19.5 mm
RN4677-V/RM112	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm		12 mm				e4			22 mm
RS9113-NB0-D1C-X68	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm			ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-NB0-D1W	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm		16 mm			ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps				27 mm
SA606DK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		1.5 mm		4.4 mm	Not Qualified				40	260	6.5 mm
SA606DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		1.5 mm		4.4 mm	Not Qualified				40	260	6.5 mm
TSC2200IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified	SINGLE-ENDED		e4	30	260	9.7 mm
UCC2750DWTRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G28		2.65 mm		7.5 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	17.9 mm
WL1801MODGBMOC	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	130	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V		GRID ARRAY				70 Cel	-20 Cel			BOTTOM		R-PBGA-B130		2 mm		13.3 mm							13.4 mm
WT11I-E-AI5	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.5 mm	85 Cel	-40 Cel			DUAL		R-XDMA-N28		2.86 mm		14.5 mm							35.75 mm
XB3-24AST	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB9X-DMUS-011	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED	.25 Mbps	R-XXMA-N37
ATSAMB11-XR2100A	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	49	HLGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.6 V		GRID ARRAY, HEAT SINK/SLUG				85 Cel	-40 Cel			BOTTOM		R-XBGA-N49		1.4 mm		4.5 mm							5.5 mm
ISL32275EIBZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	3	1.75 mm		3.9 mm				e3	30	260	9.9 mm
XB3-24AST-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24Z8RM	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	34		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			UNSPECIFIED		R-XXMA-N34				13 mm							19 mm
ADL5506ACBZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.56 mm		.79 mm				e1	30	260	1.19 mm
CY7B933-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm		7.505 mm	Not Qualified			e4	20	260	17.905 mm
CYW43455XKUBGT	Infineon Technologies	TELECOM CIRCUIT		BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA140,11X13,16		.4 mm	85 Cel	-30 Cel			BOTTOM	433.3 Mbps	R-PBGA-B140	1	.6 mm		4.47 mm							5.27 mm
MGM12P02F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		SPECIAL SHAPE				85 Cel	-40 Cel			UNSPECIFIED	1 Mbps	R-XXMA-X				12.9 mm							17.8 mm
AD974BRSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2 mm		5.3 mm	Not Qualified			e3		260	10.2 mm
WIT2410M4G	Murata Manufacturing	TELECOM CIRCUIT	OTHER	UNSPECIFIED	16		RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY				70 Cel	-40 Cel			UNSPECIFIED		R-XXMA-X16					Not Qualified				NOT SPECIFIED	NOT SPECIFIED
BGM1033N7	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-N6		.77 mm		1.7 mm				e3			2.3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.