RECTANGULAR Other Function Telecom Interface ICs 2,400+

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SPBTLE-RF	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N11		2.2 mm	11.5 mm				NOT SPECIFIED	NOT SPECIFIED	13.5 mm
T555711-TAS	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.00004 mA			SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8			3.8 mm	Not Qualified		e0			4.925 mm
TDA5235XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e4			9.7 mm
WFI32E01PC-I	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,54LEAD,.7		1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N54		2.6 mm	20.5 mm						24.5 mm
WT32I-E-AI6-APTX	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	50		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N50		2.55 mm	15.9 mm						23.9 mm
XB3-24APT	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24ARS-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB9X-DMUS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
AD73360ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	30	260	17.9 mm
ADA2200ARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
ADA2200ARUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm			e3	30	260	5 mm
ATBTLC1000-MR110CA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.6 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		.9 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N24		2.165 mm	12.7 mm						20.157 mm
BGA751N7E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL		R-PDSO-N6	1	.4 mm	1.3 mm			e3			2 mm
BGM111E256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm						15 mm
BH1417FV-E2	ROHM		INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				28 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.3	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24				Not Qualified
BM71BLE01FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm			e4			8 mm
BM71BLE01FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm				30	260	8 mm
BMD-301-A-R-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.9 mm	9.8 mm						14 mm
BMD-301-A-R-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	47	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N47		1.9 mm	9.8 mm						14 mm
CLRC632	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE							DUAL		R-PDSO-G32
CLRC63201T/0FE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm	Not Qualified		e4	30	250	20.5 mm
CY7B923-SC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		85 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28	1	2.67 mm	7.5 mm	Not Qualified		e0	30	225	17.905 mm
CYBLE-212019-00	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2 mm	14.52 mm				NOT SPECIFIED	NOT SPECIFIED	19.2 mm
CYBLE-212023-10	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2 mm	14.52 mm				NOT SPECIFIED	NOT SPECIFIED	19.2 mm
CYW43364KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B74	1	.55 mm	2.87 mm			e1			4.87 mm
EMMY-W163-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	46		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-B46			13.8 mm				40	245	19.8 mm
ENW89823A2KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm				50	250	9.5 mm
ENW89835A3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N		2 mm	8.7 mm				10	250	15.6 mm
IC1003	Rf Monolithics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1						FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		R-PQFP-G64	1	1.2 mm	10 mm	Not Qualified				260	10 mm
ISL32273EIVZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	1.2 mm	4.4 mm			e3	30	260	5 mm
LA72912V-MPB-H	Onsemi		OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		.032 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G24	3			Not Qualified		e6	30	260
LA72914V-TLM-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES		BIPOLAR		.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified		e6	30	260
LE866-SV1	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-N		2.2 mm	15 mm						25 mm
LEA-6H-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1		AEC-Q100		3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N28		2.7 mm	17 mm				NOT SPECIFIED	NOT SPECIFIED	22.4 mm
LEA-6S-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N28
LEA-6T-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-N28
LPR2400	Rf Monolithics	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	36		RECTANGULAR	UNSPECIFIED	NO	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-X36				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
LPR2400ERA	Rf Monolithics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N36				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MAX2510EEI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		25 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	1.75 mm	3.9 mm	Not Qualified		e0			9.89 mm
MAX2510EEI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			25 mA	3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	9.89 mm
MFRC53101T/0FE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified					20.5 mm
MRF24WG0MART-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
RN42HCI-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N35		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
RS9113-NB0-D1C-X75	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
RS9113-NB0-D1C-X78	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	79	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XXMA-N79		3.3 mm	16 mm		ALSO HAS BLUETOOTH DATA RATE= 1,2,3 Mbps and ZIGBEE DATA RATE= 250 kbps; ESD for WURX pin=1C				27 mm
SA606D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified		e4			6.5 mm
SARA-U260-00S	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B96	4	3 mm	16 mm						26 mm
SL3S1003FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.5 mm	1 mm						1.45 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.